JPH0356056Y2 - - Google Patents
Info
- Publication number
- JPH0356056Y2 JPH0356056Y2 JP9521388U JP9521388U JPH0356056Y2 JP H0356056 Y2 JPH0356056 Y2 JP H0356056Y2 JP 9521388 U JP9521388 U JP 9521388U JP 9521388 U JP9521388 U JP 9521388U JP H0356056 Y2 JPH0356056 Y2 JP H0356056Y2
- Authority
- JP
- Japan
- Prior art keywords
- protective cover
- wall portion
- wall
- wall body
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001681 protective effect Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 description 9
- 238000009434 installation Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
［考案の目的］
〈産業上の利用分野〉
本考案は、電子回路基板上に装着されるIC等
の電子部品に使用する保護カバーに関する。[Detailed description of the invention] [Purpose of the invention] <Field of industrial application> The present invention relates to a protective cover used for electronic components such as ICs mounted on an electronic circuit board.
〈従来の技術〉
近年、IC等の電子部品を用いた電子回路が家
電製品を含む様々な分野で多用されている。IC
は使用時に発熱するので、一般に放熱板等を用い
て熱放散が図られている。しかし、高密度実装化
に伴いICが発生する熱によつてその周辺に装着
された電子部品が破壊される虞れが生じてきた。
このため、従来は耐熱性を考慮してシリコンゴム
等で筒状カバーを形成し、その材料自体の弾性を
利用してICの外周に被せるように装着していた。
しかし、シリコンゴムは比較的高価であるために
材料コスト及び加工コストが高くなると共に、取
付作業が面倒であるという欠点があつた。<Background Art> In recent years, electronic circuits using electronic components such as ICs have been widely used in various fields including home appliances. I C
Since they generate heat during use, heat dissipation is generally achieved using a heat sink or the like. However, as ICs become more densely packaged, there is a risk that the heat generated by ICs will destroy electronic components mounted around them.
For this reason, in the past, a cylindrical cover was formed from silicone rubber or the like in consideration of heat resistance, and was attached to cover the outer periphery of the IC by utilizing the elasticity of the material itself.
However, silicone rubber is relatively expensive, resulting in high material and processing costs, as well as troublesome installation work.
〈考案が解決しようとする課題〉
そこで、本考案の目的は、容易に着脱自在で取
付作業性に優れ、かつ比較的低価格の電子部品の
保護カバーを提供することにある。<Problems to be Solved by the Invention> Therefore, an object of the present invention is to provide a protective cover for electronic components that is easily attachable and detachable, has excellent installation workability, and is relatively inexpensive.
［考案の構成］
〈課題を解決するための手段〉
上述の目的は、本考案によれば、電子部品に装
着される保護カバーであつて、合成樹脂材料から
なる壁体と、前記壁体の両端を拡開・閉鎖するヒ
ンジ手段と、前記壁体をもつて前記電子部品を囲
繞するべく前記両端を係合させる係合手段とを備
えることを特徴とする電子部品の保護カバーを提
供することにより達成される。[Structure of the invention] <Means for solving the problem> According to the invention, the above-mentioned object is a protective cover attached to an electronic component, which includes a wall made of a synthetic resin material and a wall made of a synthetic resin material. To provide a protective cover for an electronic component, comprising a hinge means for expanding and closing both ends, and an engaging means for engaging the both ends so as to surround the electronic component with the wall body. This is achieved by
〈作用〉
このようにすれば、ヒンジ手段を介して壁体の
両端を拡開した状態で電子部品の外周に配置し、
係合手段により前記両端を係合させて筒状とする
ことによつて、電子部品に容易に装着することが
できる。<Function> With this arrangement, both ends of the wall are spread out via the hinge means and placed around the outer periphery of the electronic component.
By engaging the both ends with the engaging means to form a cylindrical shape, it can be easily attached to an electronic component.
〈実施例〉
以下に添付の図面を参照して本考案を特定の実
施例について詳細に説明する。<Embodiments> The present invention will now be described in detail with reference to specific embodiments with reference to the accompanying drawings.
第１図乃至第３図に示されるように、本考案に
よる保護カバー１は、装着するIC２の長さに対
応する長さを有しかつIC２より十分に高い概ね
平坦な矩形の第１壁部３と第２壁部４を有する。
第１壁部３の両端はそれぞれ直角に折曲されて、
IC２の幅に対応する長さの屈曲部５，６が互い
に対向するように形成されている。第１壁部３と
第２壁部４とは、一方の屈曲部５と第２壁部４の
一方の端部とを結合する薄肉のヒンジ部７を介し
て一体的に形成されている。他方の屈曲部６に
は、その外面上半分に爪８が突設されている。第
２壁部４の他方の端部には、その上半分に湾曲部
９が形成され、かつその屈曲部６に向けて延長す
る先端の内側に爪８に対応する爪１０が形成され
ている。 As shown in FIGS. 1 to 3, the protective cover 1 according to the present invention has a generally flat rectangular first wall portion that has a length corresponding to the length of the IC 2 to be mounted and is sufficiently higher than the IC 2. 3 and a second wall portion 4.
Both ends of the first wall portion 3 are bent at right angles,
Bent portions 5 and 6 having a length corresponding to the width of the IC 2 are formed to face each other. The first wall portion 3 and the second wall portion 4 are integrally formed via a thin hinge portion 7 that connects one bent portion 5 and one end portion of the second wall portion 4 . The other bent portion 6 has a claw 8 protruding from the upper half of its outer surface. A curved part 9 is formed in the upper half of the other end of the second wall part 4, and a claw 10 corresponding to the claw 8 is formed inside the tip extending toward the bent part 6. .
保護カバー１は、第１図及び第２図に示される
ように、第１壁部３及び第２壁部４の両端、即ち
屈曲部６と湾曲部９とを拡開した状態で合成樹脂
材料によつて一体的に成形される。このような合
成樹脂材料として例えばナイロン６６があるが、
ある程度の可撓性とICの発熱に対する耐熱性を
有する他の様々な材料が使用される。 As shown in FIGS. 1 and 2, the protective cover 1 is made of synthetic resin material with both ends of the first wall portion 3 and the second wall portion 4, that is, the bent portion 6 and the curved portion 9, expanded. It is integrally molded by. For example, nylon 66 is an example of such a synthetic resin material.
Various other materials may be used that have some degree of flexibility and resistance to IC heat generation.
また、第１壁部３の下端中央には、上方に向け
て中心付近まで延びる狭幅のスロツト１１が開設
されている。また第１壁部３には、その下端に沿
つて屈曲部６の内側からスロツト１１の手前まで
延びるフランジ部１２が内向きに形成されてい
る。このフランジ部１２に対応して同様のフラン
ジ部１３が第２壁部４の下端に沿つて形成されて
いる。第１壁部３及び第２壁部４の上端中央に
は、それぞれ円弧状の凹み１４，１５が形成され
ている。更に、第１壁部３及び第２壁部４の内壁
面にそれぞれ上端から下端まで延長する断面半円
形の突条１６，１７が複数本形成されている。 Further, a narrow slot 11 is provided at the center of the lower end of the first wall portion 3 and extends upward to near the center. Further, the first wall portion 3 has an inwardly formed flange portion 12 extending from the inside of the bent portion 6 to the front side of the slot 11 along the lower end thereof. A similar flange portion 13 is formed along the lower end of the second wall portion 4 in correspondence with this flange portion 12 . Arc-shaped recesses 14 and 15 are formed at the center of the upper ends of the first wall portion 3 and the second wall portion 4, respectively. Further, a plurality of protrusions 16 and 17 each having a semicircular cross section and extending from the upper end to the lower end are formed on the inner wall surfaces of the first wall section 3 and the second wall section 4, respectively.
使用の際には、第１図によく示されるように、
両端を拡開した第１壁部３と第２壁部４との間に
基板２０に装着されたIC２を挟むように保護カ
バー１を矢印Ａの向きに上から装着する。次に、
薄肉のヒンジ部７を曲げて第２壁部４の爪１０を
屈曲部６の爪８に弾発係合させることにより、保
護カバー１の取付作業が完了する。 In use, as best shown in Figure 1,
The protective cover 1 is attached from above in the direction of arrow A so that the IC 2 mounted on the board 20 is sandwiched between the first wall section 3 and the second wall section 4 whose both ends are expanded. next,
The installation work of the protective cover 1 is completed by bending the thin hinge portion 7 and resiliently engaging the claw 10 of the second wall portion 4 with the claw 8 of the bent portion 6.
第４図乃至第６図には、保護カバー１の装着状
態がそれぞれ図示されている。第４図は保護カバ
ー１を装着したIC２を上方から見た図であり、
爪８，１０を係合させて箱型筒状に形成された保
護カバー１にIC２が囲繞されている。突条１６，
１７がIC２の両側面に当接して第１壁部３及び
第２壁部４の内壁面との間に僅かな空隙が画定さ
れ、IC２が発生する熱を逃すようになつている。
これにより、断熱効果が向上して周辺の電子部品
をIC２の熱から保護することができる。 FIGS. 4 to 6 each illustrate the state in which the protective cover 1 is attached. FIG. 4 is a view of the IC 2 with the protective cover 1 attached, viewed from above.
The IC 2 is surrounded by a protective cover 1 formed into a box-like tube shape by engaging the claws 8 and 10. Projection 16,
17 are brought into contact with both side surfaces of the IC 2, and a small gap is defined between the inner wall surfaces of the first wall portion 3 and the second wall portion 4, so that the heat generated by the IC 2 is released.
This improves the heat insulation effect and protects surrounding electronic components from the heat of the IC2.
また、第５図に示されるように、第１壁部３に
開口するスロツト１１を介してIC２の側面に記
載された表示を読み取ることができる。第６図は
保護カバー１の装着したICを下側から見た図で
あり、第１壁部３及び第２壁部４のフランジ部１
２，１３がそれぞれIC２の下端２１に係合して
いる。これにより、取付けた保護カバー１がIC
２から抜けないように固定することができる。ま
た、両フランジ部１２，１３の間には僅かな間隙
が形成され、その間からIC２のリード線２２が
突出している。 Further, as shown in FIG. 5, the display written on the side surface of the IC 2 can be read through the slot 11 opened in the first wall portion 3. FIG. 6 is a view of the IC with the protective cover 1 attached, viewed from below, and shows the flange portions 1 of the first wall portion 3 and the second wall portion 4.
2 and 13 are respectively engaged with the lower end 21 of the IC2. This allows the installed protective cover 1 to
It can be fixed to prevent it from falling out. Further, a slight gap is formed between both the flange portions 12 and 13, and the lead wire 22 of the IC 2 protrudes from the gap.
上述の実施例では、基板に既に装着されている
ICに保護カバー１を取付ける場合について説明
したが、保護カバーを先に取付けた後にICを基
板に装着することもできる。その場合には、第１
壁部３及び第２壁部４上端に設けられた凹み１
４，１５を利用してICのリード線を基板の挿入
孔に押し込むことができる。 In the embodiments described above, it is already mounted on the board.
Although the case where the protective cover 1 is attached to the IC has been described, it is also possible to attach the protective cover first and then attach the IC to the board. In that case, the first
Recesses 1 provided at the upper ends of the wall portion 3 and the second wall portion 4
4 and 15 can be used to push the IC lead wire into the insertion hole of the board.
尚、本考案は上述の実施例に限定されるもので
はなく様々な変形・変更を加えて実施できること
は当業者にとつて明らかである。例えば、装着さ
れる電子部品の形状に適合させて円筒状に形成す
ることができる。この場合には特定のヒンジ部を
設けずとも、材料自体の可撓性を利用して両端部
を拡開・閉鎖することができる。 It is clear to those skilled in the art that the present invention is not limited to the embodiments described above and can be implemented with various modifications and changes. For example, it can be formed into a cylindrical shape to match the shape of the electronic component to be mounted. In this case, both ends can be expanded and closed by utilizing the flexibility of the material itself without providing a specific hinge part.
［考案の効果］
上述したように、本考案によれば、ヒンジ部を
介して結合された第１壁部と第２壁部との端部同
士を互いに弾発係合する爪からなる係合手段によ
つて係合させて筒状にすることにより、基板への
装着前後に拘らずICに容易に取り付けることが
できるので、取付作業性が向上すると共に、可撓
性と耐熱性とを有する合成樹脂材料で一体成形す
ることにより比較的廉価に製造することができ
る。また、ICに取付後も容易に取外し可能であ
ることからメンテナンスが容易になる利点があ
る。[Effects of the invention] As described above, according to the invention, the engagement consisting of claws that elastically engage the end portions of the first wall portion and the second wall portion that are connected via the hinge portion to each other. By engaging the IC by means of a cylindrical shape, it can be easily attached to the IC regardless of whether it is attached to the board before or after it is attached.This improves the attachment workability and has flexibility and heat resistance. By integrally molding a synthetic resin material, it can be manufactured at a relatively low cost. Furthermore, since it can be easily removed even after being attached to the IC, it has the advantage of facilitating maintenance.
第１図は、本考案による保護カバー及びその取
付方法を示す斜視図である。第２図は、保護カバ
ーの上面図である。第３図は、保護カバーの側面
図である。第４図は、保護カバーの取付状態を示
す上面図である。第５図は、同じく側面図であ
る。第６図は、同じく下面図である。
１……保護カバー、２……IC、３……第１壁
部、４……第２壁部、５，６……屈曲部、７……
ヒンジ部、８……爪、９……湾曲部、１０……
爪、１１……スロツト、１２，１３……フランジ
部、１４，１５……凹み、１６，１７……突条、
２０……基板、２１……下端、２２……リード
線。
FIG. 1 is a perspective view showing a protective cover and its attachment method according to the present invention. FIG. 2 is a top view of the protective cover. FIG. 3 is a side view of the protective cover. FIG. 4 is a top view showing the state in which the protective cover is attached. FIG. 5 is a side view as well. FIG. 6 is a bottom view as well. DESCRIPTION OF SYMBOLS 1... Protective cover, 2... IC, 3... First wall part, 4... Second wall part, 5, 6... Bent part, 7...
Hinge part, 8...Claw, 9...Curved part, 10...
Claw, 11...slot, 12, 13...flange part, 14, 15...dent, 16, 17...projection,
20... Board, 21... Lower end, 22... Lead wire.
Claims (1)
合成樹脂材料からなる壁体と、前記壁体の両端
を拡開・閉鎖するヒンジ手段と、前記壁体をも
つて前記電子部品を囲繞するべく前記両端を係
合させる係合手段とを備えることを特徴とする
電子部品の保護カバー。 (2) 前記壁体の下端に内向きのフランジ部が形成
されていることを特徴とする実用新案登録請求
の範囲第１項に記載の電子部品の保護カバー。 (3) 前記壁体の内壁面上に突部が形成されている
ことを特徴とする実用新案登録請求の範囲第１
項または第２項に記載の電子部品の保護カバ
ー。[Scope of claims for utility model registration] (1) A protective cover attached to an electronic component, which
A wall body made of a synthetic resin material, a hinge means for expanding and closing both ends of the wall body, and an engaging means for engaging the both ends to surround the electronic component with the wall body. A protective cover for electronic components featuring: (2) The protective cover for electronic components according to claim 1, wherein an inward flange portion is formed at the lower end of the wall body. (3) Utility model registration claim 1, characterized in that a protrusion is formed on the inner wall surface of the wall body.
A protective cover for electronic components according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9521388U JPH0356056Y2 (en) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9521388U JPH0356056Y2 (en) | 1988-07-19 | 1988-07-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217846U JPH0217846U (en) | 1990-02-06 |
| JPH0356056Y2 true JPH0356056Y2 (en) | 1991-12-16 |
Family
ID=31319841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9521388U Expired JPH0356056Y2 (en) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356056Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2800744B2 (en) * | 1995-10-25 | 1998-09-21 | 日本電気株式会社 | Semiconductor device package |
-
1988
- 1988-07-19 JP JP9521388U patent/JPH0356056Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217846U (en) | 1990-02-06 |
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