JPH0357472U

JPH0357472U -

Info

Publication number: JPH0357472U
Application number: JP11616789U
Authority: JP
Priority date: 1989-10-04
Filing date: 1989-10-04
Publication date: 1991-06-03
Also published as: JPH0451023Y2

Description

[Brief explanation of the drawing]

第１図ａ，ｂはこの考案の一実施例を示すもの
で、第１図ａは概略斜視図、第１図ｂは、第１図
ａの−線による拡大断面図、第２図ａ，ｂは
、第１図の噴流波の形状を示すもので、第２図ａ
は平面図、第２図ｂは、第２図ａの−線によ
る断面図、第３図ａ〜ｅは先に提案されたはんだ
槽の一例を示すもので、第３図ａは概略斜視図、
第３図ｂは、第３図ａの−線による拡大側断
面図、第３図ｃは、第３図ａの第１の噴流槽の部
分を示す拡大平面図、第３図ｄ，ｅは、第３図ｃ
の−線、−線による断面図、第４図ａ，
ｂは噴流波の形状を示すもので、第４図ａは平面
図、第４図ｂは、第４図ａの−線による断面
図である。図中、１……プリント基板、２……電子部品、
３……はんだ槽、４……１次槽、５……２次槽、
６，７……はんだ融液、６ｅ，６ｆ……噴流波、
６ｇ，６ｈ……波頭部、８……第１の噴流槽、９
……第２の噴流槽、１０，１１……噴流口、１０
ａ……案内部、１２……噴流体、１２ａ……係合
部、１４……クランク装置、２１Ａ，２１Ｂ……
透孔である。 Figures 1a and b show one embodiment of this invention, with Figure 1a being a schematic perspective view, Figure 1b being an enlarged sectional view taken along the - line in Figure 1a, Figures 2a and 2b showing an embodiment of the invention. b shows the shape of the jet wave in Fig. 1, and Fig. 2 a shows the shape of the jet wave in Fig. 1.
2b is a plan view, FIG. 2b is a sectional view taken along the - line in FIG. 2a, FIGS. 3a to 3e are examples of the previously proposed solder bath, and FIG. ,
Fig. 3b is an enlarged side sectional view taken along the - line in Fig. 3a, Fig. 3c is an enlarged plan view showing a portion of the first jet tank in Fig. 3a, and Figs. 3d and e are , Figure 3c
Cross-sectional view taken along the - line and - line, Fig. 4a,
4b shows the shape of the jet wave, FIG. 4a is a plan view, and FIG. 4b is a sectional view taken along the line - in FIG. 4a. In the figure, 1... printed circuit board, 2... electronic components,
3...Solder tank, 4...Primary tank, 5...Secondary tank,
6, 7...Solder melt, 6e, 6f...Jet wave,
6g, 6h... wave head, 8... first jet tank, 9
...Second jet tank, 10, 11...Jout port, 10
a... Guide part, 12... Jet fluid, 12a... Engagement part, 14... Crank device, 21A, 21B...
It is a through hole.

補正平２．１２．４図面の簡単な説明を次のように補正する。明細書第１３頁１２行の「断面図である。」を
、「断面図、第５図ａ〜ｃは従来のプリント基板
のはんだ付け方法に使用されたはんだ付け装置を
示すもので、第５図ａは一部切り欠き斜視図、第
５図ｂは、第５図ａのノズルを示す斜視図、第５
図ｃは、第５図ｂの使用状態を示す図である。」
と補正する。Amendment 2.12.4 The brief description of the drawing is amended as follows. "It is a cross-sectional view." on page 13, line 12 of the specification is replaced with "A cross-sectional view. Figures 5 a to 5 c show a soldering device used in a conventional method for soldering printed circuit boards. Figure 5a is a partially cutaway perspective view, Figure 5b is a perspective view showing the nozzle in Figure 5a, Figure 5
Figure c is a diagram showing the state of use of Figure 5b. ”
and correct it.

Claims

[Scope of utility model registration request]

The jet tank includes a jet tank that pressurizes and jets the solder melt stored in the solder tank, and has a large number of through holes that form jet waves with the solder melt from the jet port above the jet tank. is provided so as to be able to reciprocate and slide in the longitudinal direction of the jet port, further sliding the jet fluid back and forth and soldering a printed circuit board by each of the jet waves jetted from the plurality of through holes. In this step, the plurality of through holes are formed in the jet fluid so that the wave head of the jet wave is located on a straight line in a direction perpendicular to the running direction of the printed circuit board. A jet-flow solder bath characterized by being formed with a predetermined angle of inclination alternately on the front and rear sides.