JPH0357579A - Laser beam machining method - Google Patents

Laser beam machining method

Info

Publication number
JPH0357579A
JPH0357579A JP1190533A JP19053389A JPH0357579A JP H0357579 A JPH0357579 A JP H0357579A JP 1190533 A JP1190533 A JP 1190533A JP 19053389 A JP19053389 A JP 19053389A JP H0357579 A JPH0357579 A JP H0357579A
Authority
JP
Japan
Prior art keywords
cutting
output
laser
laser beam
piercing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1190533A
Other languages
Japanese (ja)
Inventor
Hideki Ikeuchi
秀樹 池内
Ryuichi Fujitani
藤谷 隆一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba FA Systems Engineering Corp
Original Assignee
Toshiba Corp
Toshiba FA Systems Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba FA Systems Engineering Corp filed Critical Toshiba Corp
Priority to JP1190533A priority Critical patent/JPH0357579A/en
Publication of JPH0357579A publication Critical patent/JPH0357579A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To stably cut a material to be worked by bringing an object to be worked to piercing by a laser light, and thereafter, varing continuously or stepwise an output of the laser light to a prescribed output, and the thereafter, starting the cutting by a prescribed output. CONSTITUTION:During the time T1 required for piercing, a relative position relation of a laser light and a steel plate being an object to be worked is constant, and in a cutting start point, a through-hole is formed. After the elapse of time T1, without varying the relative position relation, during T2, an output being suitable for piercing is varied stepwise to an output being suitable for cutting. A working range by the laser light is also varied stepwise. After the elapse of time T2, during T3, by varying the position relation of the laser light and the steel plate, cutting is executed. In such a way, at the time of shifting to cutting from piercing, self-burning is prevented, and also, in a cutting start point, an excessive hole is not formed, it is unnecessary to provided the cutting start point in a place separated from a locus, and a material to be worked can be used effectively.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、レーザ光を使用して、鋼板等の被加工物を所
定形状に切断加工するレーザ加工方法に関するものであ
る。
[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing method for cutting a workpiece such as a steel plate into a predetermined shape using laser light. .

(従来の技術) レーザ光を使用して、被加工物である金属材料から所定
形状を切り抜く場合、金属材料上の切断開始点に貫通孔
を設ける必要があり、これを一般にピアシング加工と呼
んでいる。このピアシング加工において、金属材料の加
工面に照射するレーザ光の出力が大き過ぎると、アシス
トガスと金属材料との反応熱エネルギーと金属拐料の熱
拡散速度のバランスが崩れ、セルフバーニング(自己燃
焼)が起こる。このセルフバーニングにより、金属材料
上のピアシング加工点には、入射レーザビーム径よりも
大きな孔が形成されてしまう。このため、レーザ光の連
続発振(CW)による切断加工のように平均レーザ出力
が高くなる場合、ビアシング加工時のレーザ出力を切断
加工時のレーザ出力よりも低く設定する必要があり、ピ
アシング加工終了後、切断加工に移る前に、レーザ出力
を低出力から高出力へ切換える必要がある。第3図は、
そのレーザ切断方法によるレーザ出力のタイムチャート
である。
(Prior art) When cutting out a predetermined shape from a metal material as a workpiece using a laser beam, it is necessary to provide a through hole at the cutting start point on the metal material, and this is generally called piercing. There is. In this piercing process, if the output of the laser beam irradiated onto the processed surface of the metal material is too large, the balance between the heat energy of the reaction between the assist gas and the metal material and the thermal diffusion rate of the metal particles will be lost, resulting in self-burning. ) occurs. Due to this self-burning, a hole larger than the diameter of the incident laser beam is formed at the piercing point on the metal material. Therefore, when the average laser output is high, such as when cutting using continuous wave (CW) laser light, it is necessary to set the laser output during the viaring process lower than the laser output during the cutting process, and the piercing process ends. After that, before moving on to the cutting process, it is necessary to switch the laser output from low output to high output. Figure 3 shows
3 is a time chart of laser output according to the laser cutting method.

以下、第3図により、より詳細に従来のレーザ切断方法
を説明する。
Hereinafter, the conventional laser cutting method will be explained in more detail with reference to FIG.

第3図において、T1はビアシング加工に要する時間+
T3は切断加工に要する時間を示す。T1の間レーザ光
と金属材料の相対位置関係は一定であり、レーザ出力は
T3間に比べて低い状態を維持する。T1経過後、レー
ザ出力は、瞬時に高出力に切換わり、その後T3間にお
いて、レーザ光と金属材料の相対位置関係が変化するこ
とにより、切断加工が開始される。
In Figure 3, T1 is the time required for viasing processing +
T3 indicates the time required for cutting. During T1, the relative positional relationship between the laser beam and the metal material is constant, and the laser output remains lower than during T3. After T1, the laser output is instantaneously switched to high output, and then during T3, the relative positional relationship between the laser beam and the metal material changes, and cutting is started.

(発明が解決しようとする課題) しかし、従来のレーザ加工方法では、ピアンング加工終
了後、瞬時にレーザ出力を低出力から高出力へ切換える
ためレーザ光による加工範囲の拡大が急激に起こる。こ
のためレーザ光により誘起されるアシス1・ガスと金属
材料との反応熱エネルギーが急激に増大し、セルフバー
ニングが発生しやすいという問題点があった。 そこで
、本発明は、上記の問題点を解決するためになされたも
のであり、ビアシング加工終了後のレーザ出力切換え時
において、セルフバーニングが発生することなく、良好
かつ安定した切断加工が可能なレーザ加工方法を提供す
ることを目的とする。
(Problems to be Solved by the Invention) However, in the conventional laser processing method, the laser output is instantly switched from low output to high output after the pianing process is completed, so that the processing range by the laser beam rapidly expands. For this reason, there was a problem in that the thermal energy of the reaction between the ASIS 1 gas and the metal material induced by the laser beam increased rapidly, and self-burning was likely to occur. Therefore, the present invention has been made to solve the above problems, and provides a laser that can perform good and stable cutting without self-burning when changing the laser output after the completion of the viasing process. The purpose is to provide a processing method.

[発明の構戊] (課題を解決するための手段) 本発明は、上記目的を達成するために、レザ光により被
加工物をビアンング加工した後、前記被加工物に照射さ
れていたレーザ光出力を連続的或いは段階的に所定時間
要して所定出力へ変化させ、その後、その所定出力によ
り切断加工を開始するレーザ加工方法を提供する。
[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention provides, after performing biang processing on a workpiece with a laser beam, a laser beam that has been irradiated on the workpiece. A laser processing method is provided in which the output is changed continuously or stepwise to a predetermined output over a predetermined period of time, and then cutting is started using the predetermined output.

(作用) 以上のようなレーザ加工方法においては、レーザ出力を
徐々に低出力から高出力へ変化させることにより、レー
ザ光による加工範囲の拡大も徐々に進行するので、レー
ザ光により誘起されるアシストガスと被加工物との反応
熱エネルギーの急激な増大によって発生していたセルフ
ノ(一ニングの発生を防止できる。
(Function) In the laser processing method described above, by gradually changing the laser output from low to high output, the processing range by the laser beam gradually expands, so the assist induced by the laser beam It is possible to prevent the occurrence of self-burning, which occurs due to a sudden increase in the heat energy of the reaction between the gas and the workpiece.

(実施例) 以下、本発明の一実施例を第1図により説明する。(Example) An embodiment of the present invention will be described below with reference to FIG.

第1図は、本実施例におけるレーザ出力のタイムチャー
トである。
FIG. 1 is a time chart of laser output in this embodiment.

同図において、T1はピアシング加工に要する時間,T
2はレーザ出力を変化させるのに要する時間,T3は切
断加工に要する時間を示す。
In the same figure, T1 is the time required for piercing, T
2 indicates the time required to change the laser output, and T3 indicates the time required for cutting.

本実施例におけるレーザ加工方法は、T1の間及びT3
の間における動作は、T1の間レーザ光と被加工物であ
る鋼板の相対位置関係は一定てあり、切断開始点におい
て、貫通孔を形成する。そして、T1経過後、レーザ光
と鋼板の相対位置関係を変化させることなく、T2の間
において、鋼板を貫通するレーザ光出力をピアシング加
工に適した出力から、切断加工に適した出力へ段階的に
変化させる。このT2の間の動作により、ビアンング加
工点におけるレーザ光による加工範囲も段階的に変化す
る。その後、T2経過後には、レーザ光による加工範囲
が切断加工用レーザ出力におけるレーザ光の加工範囲と
同等の状態により、この後、T3の間においてレーザ光
と鋼板の位置関係を変化させて、切断加工を行なう。こ
のように本実施例では、T1とT3の間にT2を設ける
こ5 とによりレーサ光による加工範囲の急激な変化かなくな
り、ピアシング加工から切断加工へセルフバーニングを
発生させず、スムーズに加丁を移行させることができる
The laser processing method in this embodiment is performed during T1 and T3.
In the operation during T1, the relative positional relationship between the laser beam and the steel plate as the workpiece is constant, and a through hole is formed at the cutting start point. After T1, the output of the laser light penetrating the steel plate is gradually changed from an output suitable for piercing to an output suitable for cutting during T2, without changing the relative positional relationship between the laser beam and the steel plate. change to Due to this operation during T2, the processing range by the laser beam at the biang processing point also changes stepwise. After that, after T2 has elapsed, the processing range of the laser beam is in a state equivalent to the processing range of the laser beam at the laser output for cutting, and after this, during T3, the positional relationship between the laser beam and the steel plate is changed, and cutting is performed. Perform processing. As described above, in this embodiment, by providing T2 between T1 and T3, there is no sudden change in the machining range caused by the laser beam, and self-burning does not occur from piercing to cutting, and cutting can be performed smoothly. can be migrated.

なお、本発明の他の実施例としては、第2図に示すよう
に、レーザ出力の変化過程において、連続的に変化させ
ても本発明の効果は十分奏する。
In addition, as another embodiment of the present invention, as shown in FIG. 2, the effect of the present invention can be sufficiently achieved even if the laser output is changed continuously in the process of changing the laser output.

[発明の効果コ 以上説明したように、本発明によれば、ビアシング加工
から切断加工へ移行する際、セルフノ)ニング発生が防
止でき、さらに切断開始点においても、過大な孔が形成
されることがないので、切断開始点を必要とする切断形
状の軌跡から離れた場所に設ける必要がなくなり、被加
工制料を有効に使うことができる。また、セルフバーニ
ングによる切断作業の中断,及びその復帰に要する時間
が不要となるため、作業時間を短縮できるといった作業
効率面でも優れた効果を奏するものである。
[Effects of the Invention] As explained above, according to the present invention, it is possible to prevent the occurrence of self-knocking when transitioning from the viasing process to the cutting process, and furthermore, it is possible to prevent the formation of an excessively large hole even at the cutting start point. Since there is no cutting start point, there is no need to set the cutting start point at a location away from the locus of the required cutting shape, and the workpiece can be used effectively. Furthermore, since there is no need to interrupt the cutting operation due to self-burning and the time required for its return, the cutting operation has excellent effects in terms of working efficiency, such as shortening the working time.

【図面の簡単な説明】[Brief explanation of drawings]

6 第1図は、本発明の一実施例を示すレーザ出力タイムチ
ャート,第2図は、本発明の他の実施例を示すレーザ出
力タイムチャート,第3図は、従来のレーザ加工方法を
示すレーザ出力タイムチャーl・てある。 T1・・・ビアシング加工時間, T2 ・・レーザ出力変化時間, T3・・・切断加工時間
6 Fig. 1 is a laser output time chart showing one embodiment of the present invention, Fig. 2 is a laser output time chart showing another embodiment of the present invention, and Fig. 3 is a conventional laser processing method. There is a laser output time chart. T1... Viasing processing time, T2... Laser output change time, T3... Cutting processing time

Claims (1)

【特許請求の範囲】[Claims] レーザ光を鋼板等の被加工物上に照射して切断加工を行
なうレーザ加工方法において、前記レーザ光により前記
被加工物をピアシング加工した後、前記被加工物に照射
されていたレーザ光出力を連続的あるいは段階的に所定
出力へ変化させ、その後、その所定出力にて切断加工を
開始することを特徴とするレーザ加工方法。
In a laser processing method in which cutting is performed by irradiating a laser beam onto a workpiece such as a steel plate, after piercing the workpiece with the laser beam, the output of the laser beam irradiated on the workpiece is reduced. A laser processing method characterized by changing the output to a predetermined output continuously or stepwise, and then starting cutting at the predetermined output.
JP1190533A 1989-07-25 1989-07-25 Laser beam machining method Pending JPH0357579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1190533A JPH0357579A (en) 1989-07-25 1989-07-25 Laser beam machining method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1190533A JPH0357579A (en) 1989-07-25 1989-07-25 Laser beam machining method

Publications (1)

Publication Number Publication Date
JPH0357579A true JPH0357579A (en) 1991-03-12

Family

ID=16259671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1190533A Pending JPH0357579A (en) 1989-07-25 1989-07-25 Laser beam machining method

Country Status (1)

Country Link
JP (1) JPH0357579A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06675A (en) * 1992-06-24 1994-01-11 Fanuc Ltd Laser beam machine
US5585018A (en) * 1994-02-24 1996-12-17 Mitsubishi Denki Kabushiki Kaisha Laser cutting method eliminating defects in regions where cutting conditions are changed

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06675A (en) * 1992-06-24 1994-01-11 Fanuc Ltd Laser beam machine
US5585018A (en) * 1994-02-24 1996-12-17 Mitsubishi Denki Kabushiki Kaisha Laser cutting method eliminating defects in regions where cutting conditions are changed

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