JPH0357622B2 - - Google Patents

Info

Publication number
JPH0357622B2
JPH0357622B2 JP3832886A JP3832886A JPH0357622B2 JP H0357622 B2 JPH0357622 B2 JP H0357622B2 JP 3832886 A JP3832886 A JP 3832886A JP 3832886 A JP3832886 A JP 3832886A JP H0357622 B2 JPH0357622 B2 JP H0357622B2
Authority
JP
Japan
Prior art keywords
printed circuit
outer frame
plate
manufacturing
circuit box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3832886A
Other languages
Japanese (ja)
Other versions
JPS62198136A (en
Inventor
Yasuo Yamakoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TANAKA PURESU KOGYO KK
Original Assignee
TANAKA PURESU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TANAKA PURESU KOGYO KK filed Critical TANAKA PURESU KOGYO KK
Priority to JP3832886A priority Critical patent/JPS62198136A/en
Publication of JPS62198136A publication Critical patent/JPS62198136A/en
Publication of JPH0357622B2 publication Critical patent/JPH0357622B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 <産業上の利用分野> この発明はハイブリツドIC等の印刷回路に使
用される箱体の外枠の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method of manufacturing an outer frame of a box used for a printed circuit such as a hybrid IC.

<従来の技術> 従来より、この種のハイブリツドIC等の印刷
回路に使用される箱体の製造方法は、例えば、肉
厚の金属製板状体を枠状にワイヤーカツト加工す
る等の製造方法であつた。
<Prior art> Conventionally, the method of manufacturing boxes used for printed circuits such as this type of hybrid IC has been, for example, by wire-cutting a thick metal plate into a frame shape. It was hot.

<発明が解決しようとする問題点> しかし、前記従来のワイヤーカツト加工による
製造方法では不要な材料費が多くかかり、又、加
工費が高くなると云う問題点を有していた。
<Problems to be Solved by the Invention> However, the conventional manufacturing method using wire cutting processing has problems in that unnecessary material costs are high and processing costs are high.

そこで、この発明は材料費が少なくて済み、
又、加工費も低廉で、しかも大量生産にも適して
いる印刷回路箱体の外枠の製造方法を目的として
提供するものである。
Therefore, this invention requires less material cost,
Another object of the present invention is to provide a method for manufacturing the outer frame of a printed circuit box that has low processing costs and is suitable for mass production.

<問題点を解決するための手段> 前記目的を達成するため、この発明に係る印刷
回路箱体の製造方法はプレスで板状体に所要数の
穴を穿設する工程と、この所要数の穴が穿設され
た板状体を折曲加工し、この折曲加工された板状
体の端部を溶接して枠状に加工する工程とから構
成されることを特徴とするものである。
<Means for Solving the Problems> In order to achieve the above-mentioned object, the method for manufacturing a printed circuit box according to the present invention includes the steps of punching a required number of holes in a plate-like body using a press, and It is characterized by comprising the steps of bending a plate-like body with holes drilled therein, and welding the ends of the bent plate-like body to form a frame shape. .

<作用> 前記構成によれば、プレスで板状体に所要数の
穴を穿設する工程により板状体の所要個所に所要
数の穴が穿設される。
<Function> According to the above configuration, the required number of holes are drilled at required locations on the plate-like body by the process of punching the required number of holes in the plate-like body using a press.

そして、その後の折曲加工と溶接加工との工程
により印刷回路箱体の外枠が製造される。
Then, the outer frame of the printed circuit box body is manufactured through the subsequent bending and welding processes.

<実施例> 以下、この発明に係る印刷回路箱体の外枠の製
造方法に係る実施例について説明する。
<Example> Hereinafter, an example related to a method of manufacturing an outer frame of a printed circuit box body according to the present invention will be described.

図面中、第1図はこの発明に係る製造方法によ
り製造された印刷回路箱体の外枠の一態様例を示
す斜視図、第2図はこの発明に係る製造方法によ
り製造された印刷回路箱体の外枠の他の態様例を
示す斜視図である。
In the drawings, FIG. 1 is a perspective view showing an example of an outer frame of a printed circuit box manufactured by the manufacturing method according to the present invention, and FIG. 2 is a printed circuit box manufactured by the manufacturing method according to the present invention. FIG. 7 is a perspective view showing another example of the outer frame of the body.

先ず、前記第1図に示す印刷回路箱体の外枠A
の製造方法について説明する。
First, the outer frame A of the printed circuit box shown in FIG.
The manufacturing method will be explained.

両端部に係合段部1,1を有する2つの金属製
板体2,2にプレスで所要数の穴3,3…を所定
個所に穿設する。
A required number of holes 3, 3, . . . are punched at predetermined locations in two metal plate bodies 2, 2 having engagement step portions 1, 1 at both ends using a press.

次いで、この所要数の穴3,3…が穿設された
板状体2,2の一方をその係合段部1,1が内方
を向くようにコ字状に折曲加工する。又、他方の
板状体2をその係合段部1,1が外方を向くよう
にコ字状に折曲加工する。
Next, one of the plate-like bodies 2, 2 having the required number of holes 3, 3, . Further, the other plate-shaped body 2 is bent into a U-shape so that its engaging step portions 1, 1 face outward.

そして、その後、それらの2つの板状体2,2
の係合段部1,1,1,1を係合させ、その係合
部分4,4をレーザ溶接して枠状に加工する。
Then, after that, those two plate-like bodies 2, 2
The engaging step portions 1, 1, 1, 1 are engaged, and the engaging portions 4, 4 are laser welded to form a frame shape.

前記各工程により第1図に示す印刷回路箱体の
外枠Aが製造される。
Through each of the above steps, the outer frame A of the printed circuit box shown in FIG. 1 is manufactured.

次に、第2図に示す印刷回路箱体の外枠Bの製
造方法について説明する。
Next, a method for manufacturing the outer frame B of the printed circuit box shown in FIG. 2 will be described.

1つの金属製板状体5にプレスで所要数の穴
6,6…を所定個所に穿設する。尚、この金属製
板状体5は第1図に示すものと異なり、その両端
部に係合段部1が形成されていないものである。
A required number of holes 6, 6, . . . are bored at predetermined locations in one metal plate-like body 5 using a press. Note that this metal plate-like body 5 is different from that shown in FIG. 1 in that the engaging step portions 1 are not formed at both ends thereof.

次いで、その所要数の穴6,6…が穿設された
板状体5を枠状に折曲加工して、それらの両端部
を接合し、その後、その両端部接合部分7をレー
ザー溶接して枠状に加工する。
Next, the plate-like body 5 with the required number of holes 6, 6... is bent into a frame shape, both ends of which are joined, and then the joined parts 7 of both ends are laser welded. Process it into a frame shape.

前記各工程により第2図に示す印刷回路箱体の
外枠Bが製造される。
The outer frame B of the printed circuit box shown in FIG. 2 is manufactured through each of the above steps.

<発明の効果> 以上のように構成されたこの発明に係る印刷回
路箱体の外枠の製造方法によれば、プレスで板状
体に所要数の穴を穿設する工程により板状体の所
要数の穴が穿設され、そして、その後の所定の折
曲加工、溶接加工の工程を経て印刷回路箱体の外
枠が製造されるので、従来のこの種の製造方法に
比べ、材料費が少なくて済み、又、加工費も低廉
で、しかも、大量生産に適していると云う特有な
効果を奏する。
<Effects of the Invention> According to the method for manufacturing the outer frame of a printed circuit box according to the present invention configured as described above, the plate-like body is formed by the step of punching the required number of holes in the plate-like body using a press. The required number of holes are drilled, and the outer frame of the printed circuit box is manufactured through the following prescribed bending and welding processes, which reduces material costs compared to conventional manufacturing methods of this type. It has the unique effects of requiring less processing, low processing costs, and being suitable for mass production.

【図面の簡単な説明】[Brief explanation of drawings]

図面は、この発明に係る印刷回路箱体の外枠の
製造方法の実施例を示し、第1図はこの発明に係
る印刷回路箱体の外枠の製造方法により製造され
た印刷回路箱体の外枠の一態様例を示す斜視図、
第2図は、この発明に係る印刷回路箱体の外枠の
製造方法により製造された印刷回路箱体の外枠の
他の態様例を示す斜視図である。 <図中の主な符号の説明>2,5:板状体、
3,6:穴。
The drawings show an embodiment of the method for manufacturing the outer frame of a printed circuit box according to the present invention, and FIG. 1 shows an example of the method for manufacturing the outer frame of a printed circuit box according to the present invention. A perspective view showing an example of one aspect of the outer frame,
FIG. 2 is a perspective view showing another example of the outer frame of a printed circuit box manufactured by the method for manufacturing an outer frame of a printed circuit box according to the present invention. <Explanation of main symbols in the figure> 2, 5: plate-shaped body,
3,6: Hole.

Claims (1)

【特許請求の範囲】 1 プレスで板状体に所要数の穴を穿設する工程
と、この所要数の穴が穿設された板状体を折曲加
工し、この折曲加工された板状体の端部を溶接し
て枠状に加工する工程とから構成されることを特
徴とする印刷回路箱体の外枠の製造方法。 2 所要数の穴が穿設された板状体をコ字状に折
曲加工する特許請求の範囲第1項記載の印刷回路
箱体の外枠の製造方法。 3 所要数の穴が穿設された板状体を枠状に折曲
加工する特許請求の範囲第1項記載の印刷回路箱
体の外枠の製造方法。
[Claims] 1. A step of punching a required number of holes in a plate-shaped body using a press, bending the plate-shaped body in which the required number of holes have been punched, and bending the bent plate. 1. A method for manufacturing an outer frame of a printed circuit box, comprising a step of welding the ends of the shaped body to form a frame shape. 2. A method for manufacturing an outer frame of a printed circuit box according to claim 1, which comprises bending a plate-shaped body having a required number of holes into a U-shape. 3. A method for manufacturing an outer frame of a printed circuit box according to claim 1, which comprises bending a plate-shaped body having a required number of holes into a frame shape.
JP3832886A 1986-02-25 1986-02-25 Manufacture of outer frame of printed circuit box Granted JPS62198136A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3832886A JPS62198136A (en) 1986-02-25 1986-02-25 Manufacture of outer frame of printed circuit box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3832886A JPS62198136A (en) 1986-02-25 1986-02-25 Manufacture of outer frame of printed circuit box

Publications (2)

Publication Number Publication Date
JPS62198136A JPS62198136A (en) 1987-09-01
JPH0357622B2 true JPH0357622B2 (en) 1991-09-02

Family

ID=12522214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3832886A Granted JPS62198136A (en) 1986-02-25 1986-02-25 Manufacture of outer frame of printed circuit box

Country Status (1)

Country Link
JP (1) JPS62198136A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656184A (en) * 1995-03-27 1997-08-12 General Electric Company Method of laser welding open receptacles

Also Published As

Publication number Publication date
JPS62198136A (en) 1987-09-01

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