JPH0357687B2 - - Google Patents
Info
- Publication number
- JPH0357687B2 JPH0357687B2 JP61136315A JP13631586A JPH0357687B2 JP H0357687 B2 JPH0357687 B2 JP H0357687B2 JP 61136315 A JP61136315 A JP 61136315A JP 13631586 A JP13631586 A JP 13631586A JP H0357687 B2 JPH0357687 B2 JP H0357687B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- busbar
- insulating
- laminated
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 239000003960 organic solvent Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000004078 waterproofing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VOKIGVXCRFTUBE-UHFFFAOYSA-N C(=C)(Cl)Cl.CC(=O)CC Chemical compound C(=C)(Cl)Cl.CC(=O)CC VOKIGVXCRFTUBE-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- -1 ketone Vinyl chloride Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- RIOOIQBUNJDFON-UHFFFAOYSA-N methyl 2-methylprop-2-enoate oxolane Chemical compound O1CCCC1.COC(C(=C)C)=O RIOOIQBUNJDFON-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Connection Or Junction Boxes (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ワイヤーハーネスの接続に使用する
ジヤンクシヨンボツクス（以下、「J.B」とい
う。）における積層ブスバー配線板の防水シール
方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a waterproof sealing method for a laminated busbar wiring board in a junction box (hereinafter referred to as "JB") used for connecting a wire harness.
従来の技術
自動車などに搭載するJ.Bの従来の防水シール
構造は、第６，７図のような構成を有する。すな
わち、１は防水カバーであつて、ワイヤーハーネ
スとの結合部３をもつ裏カバー２と嵌合し、水の
浸入を簡易に防止する構造である。４はメインカ
バーであり、裏カバー２と嵌合して内部の電子部
品であるヒユーズ５ａ、リレー５ｂや電子ユニツ
ト５ｃなどを保護、固定する。６は所望のパター
ンをもつブスバー回路であつて、これに連成され
た外部接続用のタブ状端子（図示せず）が前記電
子部品５ａ〜５ｃやワイヤーハーネスとの電気的
接続を行なう。７は絶縁基板であつて、J.B組立
ての際、前記ブスバー回路６の位置決めやこれら
の絶縁を行なつており、積層ブスバー配線板を形
成している。８はゴムパツキング（ゴム板）であ
つて、各絶縁基板７間に隙間なく充填された防水
シールのための充填樹脂９のモレ防止と共に配線
板内部への水の浸入を防いでいる。Prior Art The conventional waterproof seal structure of JB installed in automobiles, etc. has a structure as shown in Figs. 6 and 7. That is, reference numeral 1 denotes a waterproof cover, which is fitted with a back cover 2 having a connecting portion 3 to a wire harness, and has a structure that easily prevents water from entering. A main cover 4 is fitted with the back cover 2 to protect and fix internal electronic components such as a fuse 5a, a relay 5b, and an electronic unit 5c. Reference numeral 6 denotes a busbar circuit having a desired pattern, and tab-shaped terminals (not shown) for external connection coupled to this busbar circuit make electrical connections with the electronic components 5a to 5c and the wire harness. Reference numeral 7 denotes an insulating substrate, which positions the busbar circuit 6 and insulates these when assembling the JB, and forms a laminated busbar wiring board. Reference numeral 8 denotes a rubber packing (rubber plate) which prevents leakage of the filling resin 9 for a waterproof seal that is filled between each insulating substrate 7 without any gaps, and also prevents water from entering the inside of the wiring board.
発明が解決しようとする問題点
上記した従来公知技術にあつては、積層ブスバ
ー配線板の防水シールのために、絶縁基板間に隙
間なく樹脂を充填しなければならないから、J.B
の組立て終了後において、メインカバー４に設け
た注入口１０から内部にエポキシ樹脂やグリスな
どを加圧注入した後、内部気泡除去のために吸引
し、さらに樹脂固化のための熱処理（例えば、70
℃程度の高温槽へ30分投入して乾燥固形させた
り、逆に０℃の低温槽へ投入して固形化を速め
る。）などの諸工程をJ.Bの組立てラインとは別
のラインで行なう必要があつた。Problems to be Solved by the Invention In the conventionally known technology described above, resin must be filled without any gaps between the insulating substrates in order to seal the laminated busbar wiring board waterproof.
After the assembly is completed, epoxy resin, grease, etc. are injected under pressure into the interior through the injection port 10 provided in the main cover 4, suction is applied to remove internal air bubbles, and heat treatment (for example, 70%
Dry and solidify by placing in a high-temperature tank at around 0°C for 30 minutes, or conversely, speed up solidification by placing in a low-temperature tank at 0°C. ) and other processes needed to be carried out on a separate line from JB's assembly line.
このように、積層ブスバー配線板の防水シール
のために、J.Bの組立て以外に種々の工程を要す
るから、生産コストがかさむうえに、J.Bの重量
増加を招くなどの問題があつた。 In this way, in order to waterproof seal the laminated busbar wiring board, various steps are required in addition to assembling the JB, resulting in problems such as increased production costs and an increase in the weight of the JB.
本発明の目的は、上記の問題点を解決し、低減
されたコストで積層ブスバー配線板を簡易、迅速
に防水シールできる方法を提供するにある。 An object of the present invention is to solve the above-mentioned problems and provide a method for easily and quickly waterproofing a laminated busbar wiring board at reduced cost.
問題点を解決するための手段
図面を参照して説明すると、本発明は第１図お
よび第２図に示すように、所望の回路パターンを
有するブスバー回路６を合成樹脂製の絶縁基板７
に配設したブスバー配線板Ｃを二層以上積層し、
最上層または最下層から所望のブスバー回路６と
導通するタブ状端子１１を突出させて成る積層ブ
スバー配線板の各絶縁基板７間を防水シールする
方法であつて、各絶縁基板間に毛細管現象を利用
して有機溶剤を浸入させ、絶縁基板表面の一部ま
たは全部を溶解して接着し、各絶縁基板を密封す
ることを特徴とする。Means for Solving the Problems Explained with reference to the drawings, the present invention, as shown in FIGS. 1 and 2, connects a busbar circuit 6 having a desired circuit pattern to an insulating substrate 7 made of synthetic resin.
laminate two or more layers of busbar wiring boards C arranged on the
This is a method of waterproof sealing between the insulating substrates 7 of a laminated busbar wiring board in which tab-shaped terminals 11 that are electrically connected to the desired busbar circuits 6 are protruded from the top or bottom layer, and the capillary phenomenon is created between the insulating substrates. The method is characterized in that each insulating substrate is sealed by infiltrating an organic solvent to dissolve and adhere a part or all of the surface of the insulating substrate.
ブスバー配線板Ｃは、これらを互に積層したと
きに、第３図に示すように上下の絶縁基板７1，
７2が密着するように、絶縁基板７1の上面にブス
バー回路６に対応するパターンのブスバー載置溝
１２を予め設けておくか、或いは重ね合わされる
上部の絶縁基板７2の下面に対応するブスバー嵌
入溝（図示せず）を予め設ける。これにより、絶
縁基板とブスバー回路との間の段差が解消する。 When the busbar wiring boards C are stacked together, the upper and lower insulating substrates 7 1 ,
In order to ensure that the insulating substrates 7 2 are in close contact with each other, a busbar mounting groove 12 with a pattern corresponding to the busbar circuit 6 is provided in advance on the upper surface of the insulating substrate 7 1 , or a busbar mounting groove 12 with a pattern corresponding to the busbar circuit 6 is provided in advance so that the busbar mounting grooves 12 are formed in a pattern corresponding to the lower surface of the upper insulating substrate 7 2 to be overlapped. A bus bar insertion groove (not shown) is provided in advance. This eliminates the level difference between the insulating substrate and the busbar circuit.
有機溶剤の浸入は、第２図のようにブスバー配
線板Ｃを積層し、絶縁基板７の端縁に設けた注入
口１３から注射器のような注入器１４で有機溶剤
を注入することにより行なう。これによつて、有
機溶剤が、各絶縁基板の微少な間隙およびブスバ
ー回路６と載置溝１２の間隙を毛細管現象によつ
て浸入し、絶縁基板表面の一部または全部を溶解
し、その蒸発により互に接着すると共に、ブスバ
ー回路６の周りは同様の現象により溶解された樹
脂で被覆、固定されるから、密封状態となる。注
入される有機溶剤は、揮発性であるから、短時間
で蒸発し、防水処理は短時間で終了する。要すれ
ば、後処理として水やメタノール、エタノール等
のアルコールで洗浄してもよい。 The infiltration of the organic solvent is carried out by stacking the bus bar wiring boards C as shown in FIG. 2, and injecting the organic solvent through an injection port 13 provided at the edge of the insulating substrate 7 with an injector 14 such as a syringe. As a result, the organic solvent infiltrates the minute gap between each insulating substrate and the gap between the busbar circuit 6 and the mounting groove 12 by capillary action, dissolves part or all of the surface of the insulating substrate, and evaporates. In addition to adhering to each other, the area around the bus bar circuit 6 is covered and fixed with melted resin by a similar phenomenon, resulting in a sealed state. Since the injected organic solvent is volatile, it evaporates in a short time, and the waterproofing process is completed in a short time. If necessary, washing with water or alcohol such as methanol or ethanol may be performed as a post-treatment.
絶縁基板の材料に対応する有機溶剤の好ましい
組合せは次のとおりである。 Preferred combinations of organic solvents corresponding to the materials of the insulating substrate are as follows.
ABS樹脂：
アセトン、ベンゼン、テトラヒドロフラン
メタクリル酸メチル樹脂：
メチルエチルケトン
塩化ビニリデン樹脂
ジメチルホルムアミド、ジオキサン
ジアセチルセルロース：
アルコール類、アセトン
ポリスチレン樹脂：
トルエン、ベンゼン、ケトン
塩化ビニル樹脂：
シクロヘキサン
実施態様
絶縁基板間に注入した有機溶剤の毛細管現象に
よる浸入を容易にするための好ましい態様は、第
１図に示すように、絶縁基板７の上面又は下面に
葉脈状、網目状等の浅底の溝１５を設けることで
ある。これにより、有機溶剤は溝１５を伝わつて
絶縁基板の隅々までまんべんなく浸入し、より完
全な密封状態が得られる。また、絶縁基板上のブ
スバー回路６の部分での浸入を容易にするため、
第４図のようにブスバー回路自体に縦横に溝１６
を設けることも有効である。さらに、タブ状端子
１１の相手端子との電気接触部分が有機溶剤によ
つて汚染されるのを防止するため、第３図のよう
に端子貫通孔１７にテーパー部１９をもつ堰１８
を設けることが好ましい。ABS resin: Acetone, benzene, tetrahydrofuran Methyl methacrylate resin: Methyl ethyl ketone Vinylidene chloride resin Dimethyl formamide, dioxane diacetyl cellulose: Alcohols, acetone Polystyrene resin: Toluene, benzene, ketone Vinyl chloride resin: Cyclohexane embodiment Organic injected between insulating substrates A preferred embodiment for facilitating the infiltration of the solvent by capillary action is to provide shallow grooves 15 in the form of veins, meshes, etc. on the upper or lower surface of the insulating substrate 7, as shown in FIG. As a result, the organic solvent travels through the grooves 15 and evenly infiltrates into every corner of the insulating substrate, resulting in a more complete sealed state. In addition, in order to make it easier to penetrate the busbar circuit 6 on the insulating substrate,
As shown in Figure 4, there are grooves 16 vertically and horizontally in the busbar circuit itself.
It is also effective to provide Furthermore, in order to prevent the electrical contact portion of the tab-shaped terminal 11 with the mating terminal from being contaminated by organic solvent, a weir 18 having a tapered portion 19 in the terminal through-hole 17 as shown in FIG.
It is preferable to provide
絶縁基板間に有機溶剤を浸入させる他の手段と
しては、第３図に示す積層ブスバー配線板を上方
に突出したタブ状端子１１を残して有機溶剤中に
短時間浸漬して引上げ乾燥することもできる。こ
の場合には、積層された絶縁基板の全周から有機
溶剤が内部に浸入し、一層完全な密封状態が得ら
れる。 Another method for infiltrating the organic solvent between the insulating substrates is to immerse the laminated busbar wiring board shown in FIG. 3 in the organic solvent for a short time leaving the tab-shaped terminals 11 projecting upward, and then pull it up and dry it. can. In this case, the organic solvent infiltrates into the inside from the entire circumference of the stacked insulating substrates, resulting in a more complete sealed state.
第５図は別の密封方法を示し、裏カバー２に被
覆嵌合されるメインカバー４に溶剤の注入口２０
を設け、ここから内部の積層ブスバー配線板に有
機溶剤を注入するようにしたものである。なお、
ブスバー回路６の一部は、符号６′で示されるよ
うに他をまたいで架設されている。この場合に
は、前記と同様に各絶縁基板７の間隙や端子貫通
孔１７から有機溶剤が浸入して密封すると共に、
裏カバー２とメインカバー４の嵌合部の隙間にも
有機溶剤が浸入し、同様の作用により接着、密封
される。なお、裏カバー２には第１図の符号２１
で示すような穴を設けておく。この穴２１によ
り、過剰の有機溶剤の排出と共に、防水カバー１
の取外し時において何んらかの要因で水が入つて
も外部に流出させることができる。注入口２０や
穴２１には、防水処理後にゴム栓などを差し込ん
で密封することは言うまでもない。 FIG. 5 shows another sealing method, in which a solvent injection port 20 is provided in the main cover 4 which is fitted over the back cover 2.
is provided, from which organic solvent is injected into the internal laminated busbar wiring board. In addition,
A portion of the busbar circuit 6 is constructed across the other busbar circuits, as indicated by the reference numeral 6'. In this case, the organic solvent infiltrates through the gaps and terminal through-holes 17 of each insulating substrate 7 and seals them, as described above.
The organic solvent also enters the gap between the fitting portion of the back cover 2 and the main cover 4, and is bonded and sealed by the same action. Note that the back cover 2 has the reference numeral 21 in FIG.
Make a hole as shown. This hole 21 allows excess organic solvent to be discharged and the waterproof cover 1
Even if water gets in for some reason when it is removed, it can flow out to the outside. Needless to say, rubber plugs or the like are inserted into the injection port 20 and the hole 21 after waterproofing to seal them.
発明の効果
以上から明らかなように、本発明における積層
ブスバー配線板を構成する各配線板（或いは絶縁
基板）の防水シールは、毛細管現象を利用して有
機溶剤の浸入と、その溶解、接着により密封する
ものであるから、次のような効果がある。Effects of the Invention As is clear from the above, the waterproof seal of each wiring board (or insulating substrate) constituting the laminated busbar wiring board of the present invention is achieved by infiltration of an organic solvent, its dissolution, and adhesion using capillary phenomenon. Since it is sealed, it has the following effects.
(1) 従来の樹脂モールドのための金型や装置およ
び諸工程を必要とせず、また部品点数を増加さ
せるこなく、積層したブスバー配線板をほとん
どそのままの状態で防水処理することができ、
コストを大巾に低減することができる。(1) Laminated busbar wiring boards can be waterproofed almost as they are without requiring molds, equipment, and various processes for conventional resin molding, and without increasing the number of parts.
Costs can be significantly reduced.
(2) 重量の増加がない。(2) No weight increase.
(3) J.Bの組立てライン上で処理できる。(3) Can be processed on J.B.'s assembly line.
(4) 防水処理が短時間で終了する。(4) Waterproofing can be completed in a short time.
(5) 絶縁基板間に樹脂注入用の空間を設ける必要
がなく、コンパクトでしかもブスバー回路など
のガタツキがなく、J.B全体の剛性度も向上す
る。(5) There is no need to provide a space for resin injection between insulating substrates, making it compact and free from rattling in the busbar circuit, improving the overall rigidity of the JB.
(6) 有機溶剤は毛細管現象により微少間隙に容易
に浸入して接着、密封されるから、より完全な
防水が可能である。(6) More complete waterproofing is possible because the organic solvent easily penetrates into minute gaps due to capillary action and is bonded and sealed.
第１図は本発明方法の一実施例を示すためのジ
ヤンクシヨンボツクスの分解斜視図、第２図は第
１図における積層ブスバー配線板の拡大斜視図、
第３図は第２図のＡ部分の拡大断面図、第４図は
本発明方法の実施態様を示すブスバー回路の斜視
図、第５図は本発明方法の他の実施例を示すため
のジヤンクシヨンボツクスの一部切欠斜視図、第
６図および第７図はそれぞれ従来例の説明図であ
る。
１……防水シール、２……裏カバー、４……メ
インカバー、６……ブスバー回路、７……絶縁基
板、１１……タブ状端子、１５，１６……溝。
FIG. 1 is an exploded perspective view of a junction box to show an embodiment of the method of the present invention, FIG. 2 is an enlarged perspective view of the laminated busbar wiring board in FIG. 1,
FIG. 3 is an enlarged sectional view of part A in FIG. 2, FIG. 4 is a perspective view of a busbar circuit showing an embodiment of the method of the present invention, and FIG. 5 is a junk diagram showing another embodiment of the method of the present invention. A partially cutaway perspective view of the box, FIGS. 6 and 7, are explanatory views of conventional examples, respectively. DESCRIPTION OF SYMBOLS 1... Waterproof seal, 2... Back cover, 4... Main cover, 6... Busbar circuit, 7... Insulating board, 11... Tab-shaped terminal, 15, 16... Groove.
Claims (1)
樹脂製の絶縁基板に配設したブスバー配線板を二
層以上積層し、最上層または最下層の絶縁基板か
ら所望のブスバー回路と導通するタブ状端子を突
出させて成る積層ブスバー配線板の各絶縁基板間
を防水シールする方法であつて、各絶縁基板間に
毛細管現象を利用して有機溶剤を浸入させ、絶縁
基板表面の一部または全部を溶解して接着し、各
絶縁基板間を密封することを特徴とする積層ブス
バー配線板の防水シール方法。 ２ 絶縁基板として、その上面または下面に葉脈
状、網目状などの溝を設けた絶縁基板を使用する
特許請求の範囲第１項に記載の方法。 ３ ブスバー回路として、その上面に縦または横
に溝を設けたブスバー回路を使用する特許請求の
範囲第１項に記載の方法。 ４ 最上層または最下層の絶縁基板のタブ状端子
の端子貫通孔に堰を設けた絶縁基板を使用する特
許請求の範囲第１項に記載の方法。[Scope of Claims] 1 Two or more layers of busbar wiring boards in which busbar circuits having a desired pattern are arranged on synthetic resin insulating substrates are laminated, and conduction is established from the top or bottom layer of the insulating substrate to the desired busbar circuit. A method of waterproof sealing between each insulating substrate of a laminated busbar wiring board consisting of protruding tab-shaped terminals, in which an organic solvent is infiltrated between each insulating substrate using capillary phenomenon, and a part of the surface of the insulating substrate is sealed. Or, a waterproof sealing method for a laminated busbar wiring board, which is characterized by melting and bonding the entire board and sealing between each insulating board. 2. The method according to claim 1, wherein the insulating substrate is an insulating substrate provided with vein-like, mesh-like, etc. grooves on its upper or lower surface. 3. The method according to claim 1, wherein a busbar circuit having vertical or horizontal grooves on its upper surface is used as the busbar circuit. 4. The method according to claim 1, wherein an insulating substrate is used in which a weir is provided in a terminal through hole of a tab-shaped terminal of the uppermost or lowermost insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61136315A JPS62296710A (en) | 1986-06-13 | 1986-06-13 | Method of moisture-proof sealing of laminated bus-bar wiringboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61136315A JPS62296710A (en) | 1986-06-13 | 1986-06-13 | Method of moisture-proof sealing of laminated bus-bar wiringboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62296710A JPS62296710A (en) | 1987-12-24 |
| JPH0357687B2 true JPH0357687B2 (en) | 1991-09-03 |
Family
ID=15172334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61136315A Granted JPS62296710A (en) | 1986-06-13 | 1986-06-13 | Method of moisture-proof sealing of laminated bus-bar wiringboard |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62296710A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01116515U (en) * | 1988-01-28 | 1989-08-07 | ||
| JP2561948B2 (en) * | 1988-09-08 | 1996-12-11 | 矢崎総業株式会社 | Busbar circuit board manufacturing method |
-
1986
- 1986-06-13 JP JP61136315A patent/JPS62296710A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62296710A (en) | 1987-12-24 |
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