JPH0358892B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board breaking device, and particularly to a circuit board breaking device for dividing a ceramic board such as a thermal head in which a large number of heating resistors are arranged in a row. This relates to dividing with high accuracy along the lines.

[Conventional technology]

As a method of dividing a substrate such as a ceramic substrate provided with dividing grooves along the grooves, for example, there is
-60766, an elastic body is placed on a flat pedestal, and the dividing groove is brought into contact with the back surface of the elastic body, and the substrate is placed on the back side of the dividing groove through the elastic body. The method was to break the board by touching the edge of the cutter. However, the break length of ceramics, etc., has become noticeably longer from A4 size (210 mm) to A3 size (297 mm), in which a large number of low fever antibodies developed in recent years are arranged in a row. The breaking method in the IC manufacturing process, such as that proposed in No. 50-60766, does not provide a satisfactory breaking method and a high yield, and is usually broken manually.

In the manual breaking method, bring your fingertips as close as possible to the dividing groove at the edge of the ceramic board, put pressure on your fingertips to break it at the dividing groove,
The glass cutter was used to divide glass in the same way that it was broken after being processed.

[Problem that the invention seeks to solve]

In the conventional manual breaking method, it is necessary to apply force with the fingertips near the dividing groove to break the glass after cutting with a glass cutter, which not only limits the number of pieces that can be done, but also requires a lot of skill. However, there was a problem in that it required a lot of work and was not suitable for mass production. In addition, for thermal heads that are becoming larger and larger, thermal heads that have higher resolution, or thermal heads that have higher functionality (higher cost) by mounting drive IC chips, diode chips, etc. on the board, Breaking work is a process that is located after dozens of work steps, and mistakes in breaking work (defective products) were a cause of great losses.

This invention was made to solve the above-mentioned problems, and it is possible to reliably divide even a long board along the dividing groove, and also to mount drive IC chips, diode chips, etc. on the board. It is an object of the present invention to provide a break device that can be divided into parts of a thermal head or the like without damaging its mounting part.

[Means for solving problems]

The circuit board breaking device according to the present invention tilts the pedestal so as to be line symmetrical with respect to the dividing groove, and at the center of the dividing groove in the longitudinal direction, with respect to an axis perpendicular to the dividing groove. Rotatably engage a board cutter whose ridge line is placed above the branch line on the slope of the cradle, and align the dividing groove with the branch line of the cradle's slope and the ridge line of the board cutter on the branch line side. This is to break the substrate by making contact with the substrate by holding it in place.

[Effect]

The method of breaking the board in this invention is to bring the back side of the board into contact with the inclined surface of the pedestal while pushing down the back side of the dividing groove at the ridgeline of the board cutter so that the dividing groove is uniform in the longitudinal direction. By pressing down the board cutter, the inclined surface of the pedestal, the board and the abutting part move closer to the branch line of the inclined surface, narrowing the bending deformation area span and concentrating the bending stress, causing the bending stress to be concentrated along the dividing groove. It is something that breaks.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 denotes a pedestal, which has V-shaped inclined surfaces 11 and 12, and a linear branch line 1a. Sheets 11a and 12a made of elastic material are attached to the inclined surfaces 11 and 12, and positioning pins 11b and 11c are provided for positioning the dividing groove 2a provided on the back surface of the thermal head board 2 above the branch line 1a. It is arranged. A plurality of low heat generation antibodies 2c are arranged on the surface of the thermal head board 2, and a drive IC chip 2 is arranged.
b is installed. 3 is a board cutter;
One end thereof protrudes into a V-shape and is provided with a ridgeline 3a finished to a predetermined radius.
A hole 3 perpendicular to the ridge line 3a at the center in the length direction of a.
b is provided. 13 is a guide pin;
The ridgeline 3a of the board cutter 3 is slidably guided above the branch line 1a of the pedestal 1. Reference numeral 4 denotes a support shaft, which rotatably engages with the hole 3b of the substrate cutter 3, and this support shaft 4 is installed on the arm block 5.

Next, the operation of the circuit board breaking device having such a configuration will be explained.

First, while the thermal head board 2 is brought into contact with the positioning pins 11b and 11c of the pedestal 1, the back surface of the thermal head board 2 is divided above the branch line 1a of the pedestal 1, approximately centered on the support shaft 4. Groove 2
Set a. Next, when the arm block 5 is operated in the direction of arrow A by an air cylinder (not shown), the substrate cutter 3 is guided by the guide pin 13 and its ridgeline 3a aligns with the branch line 1a of the pedestal 1.
descends from above. Then, the ridge line 3a comes into contact with the opposite surface of the dividing groove 2a, that is, the surface of the thermal head substrate 2, and the branch line 1a, dividing groove 2a,
The ridge lines 3a can be set on the same line. When the arm block 5 is further actuated in the direction of the arrow A, the thermal head board 2 starts to curve as shown in Fig. 2, the abutting part of the ridge line 3a on the front surface of the thermal head board 2 is compressed, and the back surface with the dividing groove 2a is compressed. is pulled, and so-called bending stress occurs. Since this bending stress is applied via the substrate cutter 3 rotatably engaged with the support shaft 4, it is uniform at the abutting portion between the ridgeline 3a and the thermal head substrate 2. Note that the deformation range span in this state is l. Further, when the arm block 5 is actuated in the direction of the arrow A, the deformation range span moves to _l1 as shown in Fig. 3, and furthermore, due to the notch effect of the dividing groove 2a, bending stress is suddenly applied to the bottom of the dividing groove 2a. Concentrate,
A crack occurs in the thickness direction of the thermal head board 2 from the bottom of the dividing groove 2a, and the thermal head board 2
break.

In addition, in the above embodiment, a break using the board cutter 3 having a continuous edge line was shown, but
A so-called partial cutter shape in which the ridge lines are discontinuous, as shown in FIG. 4, also produces the same effect. Furthermore, it goes without saying that the present invention can be applied not only to a line-type thermal head board in which heating resistors are arranged in a row, but also to a serial-type thermal head board or an IC board.

Furthermore, by changing the position of the positioning pin (it may be movable), it is of course possible to break boards of different shapes.

〔Effect of the invention〕

As described above, according to the present invention, since the pedestal is configured to have an inclined surface, the deformation region span decreases depending on the amount of descent of the board cutter, which not only concentrates bending stress but also prevents cutting by the dividing groove. In addition to further enhancing the chipping effect, the board cutter has a rotatable pin support structure, which generates uniform bending stress over the entire breaking range, allowing it to accurately follow the dividing groove even with long objects, and prevent break mistakes. This has the effect of providing a break on the board without any cracks.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view showing a circuit board breaking device according to an embodiment of the present invention, FIG. 2 is an enlarged side view showing the initial state of contact between the circuit board cutter and the thermal head circuit board, and FIG. 3 is an enlarged side view of the thermal head circuit board. FIG. 4 is an enlarged side view showing a state on the verge of breaking, and FIG. 4 is a perspective view of a substrate cutter in another embodiment of the present invention. 1... cradle, 1a... branch line, 11, 12...
...Slanted surface, 2...Thermal head board, 2a...
Dividing groove, 3... board cutter, 3a... ridge line,
4...Support shaft. In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1. In a board breaking device that divides a ceramic substrate on which a large number of electrical components are arranged and a dividing groove is provided in the direction of the arrangement along the dividing groove, the ceramic substrate is placed and the dividing groove is a pedestal having two V-shaped inclined surfaces so as to be symmetrical with respect to the dividing groove; The substrate cutter has a ridge line set substantially on the same line as the branch line, and is provided with a board cutter that rotatably engages with an axis perpendicular to the branch line at the longitudinal center of the branch line, and presses the board cutter. A device for breaking a substrate, characterized in that the device divides the ceramic substrate by concentrating bending stress on the dividing groove of the ceramic substrate by lowering the substrate.