JPH0359064A - Epoxy resin composition suitable for laser printing - Google Patents
Epoxy resin composition suitable for laser printingInfo
- Publication number
- JPH0359064A JPH0359064A JP1193961A JP19396189A JPH0359064A JP H0359064 A JPH0359064 A JP H0359064A JP 1193961 A JP1193961 A JP 1193961A JP 19396189 A JP19396189 A JP 19396189A JP H0359064 A JPH0359064 A JP H0359064A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- compsn
- bismuth oxalate
- bismuth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims description 16
- 238000007648 laser printing Methods 0.000 title description 5
- FIMTUWGINXDGCK-UHFFFAOYSA-H dibismuth;oxalate Chemical compound [Bi+3].[Bi+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O FIMTUWGINXDGCK-UHFFFAOYSA-H 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 21
- 238000000576 coating method Methods 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 14
- 238000007639 printing Methods 0.000 abstract description 8
- 229910000416 bismuth oxide Inorganic materials 0.000 abstract description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 abstract description 2
- 230000002411 adverse Effects 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 238000006114 decarboxylation reaction Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229960004887 ferric hydroxide Drugs 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Thermal Transfer Or Thermal Recording In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気電子部品の絶縁被覆に用いられ、レーザ
ーの照射によりその絶縁被覆表面に鮮明な印字を施すこ
とのできるレーザー印字に適したエポキシ樹脂組成物に
関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is suitable for laser printing, which is used for insulating coatings of electrical and electronic components, and is capable of clearly marking the surface of the insulating coating by laser irradiation. The present invention relates to an epoxy resin composition.
〔従来の技術）
従来、エポキシ樹脂組成物により絶縁被覆された電気電
子部品に特性や型番を明示するため印字をする際、熱硬
化性のインクや紫外線硬化性のインクが用いられている
が、工程の合理化を目的としてより短時間で印字できる
方法が要求されている。[Prior Art] Conventionally, thermosetting ink or ultraviolet curable ink has been used when printing to clearly indicate the characteristics and model number of electrical and electronic parts coated with an epoxy resin composition. For the purpose of streamlining the process, there is a need for a method that can print in a shorter time.
この対応方法の１つとして、レーザーの照射による印字
システムが注目されている。このレーザー印字システム
は、文字やパターン状にレーザーを照射された部分が熱
エネルギーにより変色する、あるいは照射された部分が
昇華し表面粗化され、光の散乱によって文字やパターン
が識別できるものであり、この方法の印字時間は０．０
１秒以下であり、従来の熱あるいは紫外線硬化性のイ°
ンクが硬化に数分〜数１０分を必要とするのに比べ、大
幅に短縮されるものである。As one method for dealing with this problem, a printing system using laser irradiation is attracting attention. In this laser printing system, the part of the text or pattern that is irradiated with the laser changes color due to thermal energy, or the part that is irradiated sublimates and becomes roughened, and the text or pattern can be identified by the scattering of light. , the printing time of this method is 0.0
It takes less than 1 second and is faster than conventional heat or ultraviolet curing.
Compared to the time it takes for inks to cure, which takes several to several tens of minutes, this time is significantly reduced.
しかし、従来のエポキシ樹脂＆ｌ１１ｙ、物の絶縁被覆
にレーザーを照射した場合、単に被覆表面を粗化するの
みで、変色がおこらず、鮮明な文字やパターンを印字す
ることができなかった。However, when conventional epoxy resins and insulating coatings of objects are irradiated with a laser, the coating surface is merely roughened, no discoloration occurs, and clear characters and patterns cannot be printed.
最近、従来のエポキシ樹脂ＩＪｌ放物に黄色の水酸化第
二鉄を含有させると、レーザー照射によって黄色から褐
色に変色することが見い出された（特開昭６２−５０３
６０号公報）。Recently, it has been discovered that when yellow ferric hydroxide is added to the conventional epoxy resin IJl parabolic, the color changes from yellow to brown when irradiated with a laser (Japanese Patent Laid-Open No. 62-503
Publication No. 60).
しかし、水酸化第二鉄は黄色であるため、黄、燈色のよ
うな色相にしか用いることができず、青や緑色の下地、
特に淡色系の下地に黒色のレーザ明色からレーザーによ
り黒色に変色する樹脂組成物を得んとして鋭意検討した
結果、シュウ酸ビスマスを含有させるとレーザーを照射
した際白色から黒色に変色することを見出し、更にこの
知見に基づき種々研究を進めて本発明を完成するに至っ
たものである。However, since ferric hydroxide is yellow, it can only be used for hues such as yellow and light blue;
In particular, as a result of intensive study to obtain a resin composition that changes color from a bright black color to black when exposed to a laser beam on a light-colored base, we found that when bismuth oxalate is added, the color changes from white to black when irradiated with a laser. Based on this finding and this knowledge, various studies have been carried out and the present invention has been completed.
本発明の目的とするところは電気的特性および他の緒特
性を低化させることなく、レーザーの照射により樹脂表
面に鮮明な印字を施すことのできる硬化物を与えるエポ
キシ樹脂組成物を提供する特徴とするレーザー印字に適
したエポキシ樹脂組成物に関するものである。An object of the present invention is to provide an epoxy resin composition that provides a cured product that can be clearly printed on the resin surface by laser irradiation without degrading electrical properties or other mechanical properties. This invention relates to an epoxy resin composition suitable for laser printing.
本発明のエポキシ樹脂、１１Ｊｉｆｉ、物にシュウ酸ビ
スマスを用いる理由を以下述べる。The reason for using bismuth oxalate in the epoxy resin of the present invention, 11Jifi, will be described below.
シュウ酸ビスマスは白色の粉末であり、加熱すると２０
０〜３００℃で脱炭酸し酸化ビスマス（［１りに変化し
、黒色となる。Bismuth oxalate is a white powder that, when heated, has a
It is decarboxylated at 0 to 300°C and changes to bismuth oxide ([1], turning black.
従って、シュウ酸ビスマスを含有したエポキシ樹脂組成
物に対し文字やパターン状にレーザーを照射すると、樹
脂表面がレーザーの熱エネルギーにより加熱され、樹脂
中に含有されたシュウ酸ビスマスが上記化学反応を生じ
黒色となる。すなわちレーザーに照射された部分のみ黒
色となり、照射されない部分は白色のままのため、白色
の下地に黒色の文字やパターンを鮮明に印字することが
できる。Therefore, when an epoxy resin composition containing bismuth oxalate is irradiated with a laser in the form of letters or patterns, the resin surface is heated by the laser's thermal energy, and the bismuth oxalate contained in the resin causes the above chemical reaction. It becomes black. In other words, only the parts irradiated by the laser turn black, and the parts not irradiated remain white, making it possible to clearly print black characters and patterns on a white background.
本発明に用いられるシュウ酸ビスマスの粒度は平均粒径
が１００μｍ以下であることが好ましい。The average particle size of the bismuth oxalate used in the present invention is preferably 100 μm or less.
その理由はエポキシ樹脂＆］［放物にシュウ酸ビスマス
を混合分散させた際、■００μｍ以上の平均粒径では電
子電気部品に被覆させた際表面に斑点状となり、部品の
商品価値を低下させやすくなるばかりでなく、分散が不
充分となりやすく、レーザーが照射された際、シュウ酸
ビスマスが存在しない部分では変色がおこらず、文字や
パターンがとぎれ鮮明な印字ができない場合がある。The reason for this is that when bismuth oxalate is mixed and dispersed in epoxy resin and [paraboloid], ■ If the average particle size is 00 μm or more, when it is coated on electronic and electrical components, it will become speckled on the surface, reducing the commercial value of the component. Not only does it become easier to use, but it also tends to cause insufficient dispersion, and when irradiated with a laser, discoloration does not occur in areas where bismuth oxalate does not exist, and characters and patterns may be interrupted and clear printing may not be possible.
なお、この平均粒径はコールタ−カウンター（日科機＠
製）により得られる粒度分布を重量平均することにより
求めるのが適当であるが、コールタ−カウンター以外の
測定方法により求めてもよい。Note that this average particle size is measured using a Coulter Counter (Nikkaki@
Although it is appropriate to determine the particle size distribution by weight-averaging the particle size distribution obtained by the following methods, it is also possible to determine it by a measuring method other than the Coulter counter.
シュウ酸ビスマスの含有量としては０．５〜２０重量％
が好ましい、この理由は、含有量が０．５重量％以下で
は、レーザーが照射されても変色する度合が小さく鮮明
な印字とならず、一方、２０重量％を越えると、樹脂組
Ｆｌｉ、物の電気絶縁性が低下し電子電気部品用絶縁材
料としての本来の性能を満足しにくくなるためである。The content of bismuth oxalate is 0.5 to 20% by weight
The reason for this is that if the content is less than 0.5% by weight, the degree of discoloration will be small even when irradiated with a laser and clear printing will not be possible, whereas if the content exceeds 20% by weight, the resin composition This is because the electrical insulation property of the material decreases, making it difficult to satisfy the original performance as an insulating material for electronic and electrical parts.
本発明に用いられるエポキシ樹脂としては、例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂等のジクリシジルエーテル型エポキシ樹脂、フ
ェノールノボラック型エポキシ樹脂、タレゾールノボラ
ック型エポキシ樹脂等のノボラック型エポキシ樹脂、グ
リシジルエステル型エポキシ樹脂、グリシシルア亙ン型
エポキシ樹脂、線状脂肪族型エポキシ樹脂、複素環型エ
ポキシ樹脂、ハロゲン化エポキシ樹脂等があげられるが
、これらに限定されるものではない。Examples of the epoxy resin used in the present invention include dicrycidyl ether type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, novolac type epoxy resins such as phenol novolac type epoxy resin, and Talesol novolac type epoxy resin; Examples include, but are not limited to, glycidyl ester type epoxy resins, glycidyl ester type epoxy resins, linear aliphatic type epoxy resins, heterocyclic type epoxy resins, and halogenated epoxy resins.
本発明に用いられる硬化剤および硬化促進剤としては、
酸無水物、ボリア多ン、ノボラック型フェノールｍＷ、
第３級アミン、イ藁ダゾール化合物等があるが、いずれ
を用いてもよい、又必要により公知の無機充填剤、たと
えばジルコン粉末、タルク粉末、結晶シリカ粉末、溶融
シリカ粉末、炭酸カルシウム粉末、マグネシア粉末、ケ
イ酸カルシウム粉末、水和アルミナ粉末、アルミナ粉末
等を配合してもよい。The curing agent and curing accelerator used in the present invention include:
Acid anhydride, boriapolymer, novolac type phenol mW,
There are tertiary amines, straw dazole compounds, etc., but any of them may be used, and if necessary, known inorganic fillers such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia Powder, calcium silicate powder, hydrated alumina powder, alumina powder, etc. may be blended.
本発明により得られる樹脂組成物はシュウ酸ビスマスの
色調により通常白色を呈するため赤、青、緑、黒、白色
等の顔料を併用できる。Since the resin composition obtained by the present invention usually exhibits a white color due to the color tone of bismuth oxalate, pigments of red, blue, green, black, white, etc. can be used in combination.
本発明の樹脂組成物は注型材料等の液状、粉体塗料等の
粉状、成型材料等の顆粒状、塊状等いずれの状態でもよ
い。The resin composition of the present invention may be in any form, such as liquid as a casting material, powder as in a powder coating, granule or block as in a molding material.
本発明の樹脂゛組成物を製造する方法として、例えば粉
体塗料の場合をあげると、所定の割合で秤量した原料成
分をミキサーによって充分混合したのち、エクストルー
ダー、コニーダーあるいはロール等で溶融混練し、次い
で粉砕機にて粉砕する方法等がある。上記方法により得
られた粉体塗料により電子電気部品の絶縁被覆を行う方
法としては、流動浸漬法、静電流動浸漬法、ころがし法
、ふりかけ法、ホットスプレー法、静電スプレー法等一
般の粉体塗装方法が用いられる。As a method for manufacturing the resin composition of the present invention, for example, in the case of powder coating, raw ingredients weighed in a predetermined ratio are thoroughly mixed using a mixer, and then melt-kneaded using an extruder, co-kneader, roll, etc. , and then pulverizing with a pulverizer. Methods for insulating coating electronic and electrical components with the powder coating obtained by the above method include general powder coating methods such as fluidized dipping method, electrostatic dynamic dipping method, rolling method, sprinkle method, hot spray method, and electrostatic spray method. Body painting methods are used.
又、注型材料、成型材料の場合についても公知の技術で
製造でき、絶縁材料として使用できる。In addition, casting materials and molding materials can also be manufactured using known techniques, and can be used as insulating materials.
次に本発明を実施例により更に詳しく説明する。 Next, the present invention will be explained in more detail with reference to Examples.
実施例１
ビスフェノールＡ型エポキシ樹脂
（エポキシ当量９５０） ５０重量部シュウ酸ビ
スマス
（平均ね径１０ｕｍ） ５結晶シリカ粉末
５０ 〃２メチルイξダゾール
１ 〃上記組成物を配合し、ヘンシェルミキサーでブ
レンドし、コニーダーにて溶融混練した後、粉砕機で粉
砕することにより平均粒径６０〜７０μｍｍのエポキシ
樹脂組成物の粉体塗料を得た。Example 1 Bisphenol A type epoxy resin (epoxy equivalent: 950) 50 parts by weight Bismuth oxalate (average diameter 10 um) 5 crystalline silica powder 50 〃2methyl ξdazole
1. The above compositions were blended, blended using a Henschel mixer, melt-kneaded using a co-kneader, and then ground using a grinder to obtain a powder coating of an epoxy resin composition having an average particle size of 60 to 70 μmm.
実施例２
実施例１において、シュウ酸ビスマスの添加量を２０重
量部に替え、他は同様にして平均粒径６０〜７０μｍの
エポキシ樹脂組成物の粉体塗料を得た。Example 2 A powder coating of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained in the same manner as in Example 1 except that the amount of bismuth oxalate added was changed to 20 parts by weight.
比較例１
実施例１において、シュウ酸ビスマスの添加量を０．１
重量部に替え、他は同様にして平均粒径６０〜７０μｍ
のエポキシ樹脂組成物の粉体塗料を得た。Comparative Example 1 In Example 1, the amount of bismuth oxalate added was 0.1
Change the parts by weight and do the same except for the average particle size of 60 to 70 μm.
A powder coating of the epoxy resin composition was obtained.
比較例２
実施例１において、シュウ酸ビスマスの添加量を５０重
量部に替え、他は同様にして平均粒径６０〜７０μｍの
エポキシ樹脂組成物の粉体塗料を得た。Comparative Example 2 A powder coating of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained in the same manner as in Example 1 except that the amount of bismuth oxalate added was changed to 50 parts by weight.
実施例１．２及び比較例１．２の樹脂組成物について硬
化物を作製した。Cured products were produced from the resin compositions of Example 1.2 and Comparative Example 1.2.
この試料に炭酸ガスレーザー（ウシオ電機■製４００型
レーザーマーク、エネルギー密度５ Ｊｏｕｌ／ｄ）を
用いて、１００万分の１秒間所定のマスクを通してレー
ザーを照射して、硬化物の表面にマーキングを施した。This sample was irradiated with a carbon dioxide laser (400 type laser mark manufactured by Ushio Inc., energy density 5 Joul/d) through a prescribed mask for 1/1 million seconds to mark the surface of the cured product. did.
また、上記硬化物の絶縁破壊電圧をＪＩＳＫ６９１１に
より測定した。結果を表−１に示す。Further, the dielectric breakdown voltage of the cured product was measured according to JIS K6911. The results are shown in Table-1.
表
〔発明の効果〕
本発明のレーザー印字に適したエポキシ樹脂組成物を絶
縁被覆材として用いた場合、電気的特性および他の特性
を低下させることなく、レーザーの照射により樹脂表面
に鮮明な印字を施すことのできる被覆を与えることがで
きる。従って、従来より非常に短時間で印字できるため
、電気電子部品の生産工程の合理化をはかることができ
る。Table [Effects of the Invention] When the epoxy resin composition suitable for laser printing of the present invention is used as an insulating coating material, clear printing can be made on the resin surface by laser irradiation without deteriorating electrical properties or other properties. It is possible to provide a coating that can be applied. Therefore, since printing can be performed in a much shorter time than conventionally, it is possible to rationalize the production process of electrical and electronic parts.
Claims (3)
キシ樹脂組成物において、シュウ酸ビスマスを含有する
ことを特徴とするエポキシ樹脂組成物。(1) An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, etc., which is characterized by containing bismuth oxalate.
あることを特徴とする請求項１記載のエポキシ樹脂組成
物。(2) The epoxy resin composition according to claim 1, wherein the average particle size of bismuth oxalate is 100 μm or less.
重量部含有することを特徴とする請求項１又は２記載の
エポキシ樹脂組成物。(3) 0.5 to 20 bismuth oxalate to the composition
The epoxy resin composition according to claim 1 or 2, characterized in that it contains parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193961A JPH0618990B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193961A JPH0618990B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0359064A true JPH0359064A (en) | 1991-03-14 |
| JPH0618990B2 JPH0618990B2 (en) | 1994-03-16 |
Family
ID=16316644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1193961A Expired - Fee Related JPH0618990B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618990B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2050720A1 (en) * | 2007-10-16 | 2009-04-22 | Mondi Business Paper Services AG | Laser and thermally writable surface coating for materials |
| JP2012131885A (en) * | 2010-12-21 | 2012-07-12 | Tokyo Printing Ink Mfg Co Ltd | Ink composition for laser recording, laminate for recording, and recorded matter |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5672047A (en) * | 1979-11-19 | 1981-06-16 | Toshiba Corp | Epoxy resin molding material |
-
1989
- 1989-07-28 JP JP1193961A patent/JPH0618990B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5672047A (en) * | 1979-11-19 | 1981-06-16 | Toshiba Corp | Epoxy resin molding material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2050720A1 (en) * | 2007-10-16 | 2009-04-22 | Mondi Business Paper Services AG | Laser and thermally writable surface coating for materials |
| WO2009049883A1 (en) * | 2007-10-16 | 2009-04-23 | Mondi Business Paper Services Ag | Laser and thermally writeable surface coating for materials |
| JP2012131885A (en) * | 2010-12-21 | 2012-07-12 | Tokyo Printing Ink Mfg Co Ltd | Ink composition for laser recording, laminate for recording, and recorded matter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0618990B2 (en) | 1994-03-16 |
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