JPH0359065A - Epoxy resin composition suitable for laser printing - Google Patents
Epoxy resin composition suitable for laser printingInfo
- Publication number
- JPH0359065A JPH0359065A JP1193962A JP19396289A JPH0359065A JP H0359065 A JPH0359065 A JP H0359065A JP 1193962 A JP1193962 A JP 1193962A JP 19396289 A JP19396289 A JP 19396289A JP H0359065 A JPH0359065 A JP H0359065A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- silver acetate
- compsn
- resin composition
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 35
- 239000000203 mixture Substances 0.000 title claims description 14
- 238000007648 laser printing Methods 0.000 title description 3
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims abstract description 21
- 229940071536 silver acetate Drugs 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 16
- 238000007639 printing Methods 0.000 abstract description 7
- 239000013078 crystal Substances 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 abstract 2
- 230000002411 adverse Effects 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 230000006196 deacetylation Effects 0.000 abstract 1
- 238000003381 deacetylation reaction Methods 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 229910001923 silver oxide Inorganic materials 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 229960004887 ferric hydroxide Drugs 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- KYARBIJYVGJZLB-UHFFFAOYSA-N 7-amino-4-hydroxy-2-naphthalenesulfonic acid Chemical compound OC1=CC(S(O)(=O)=O)=CC2=CC(N)=CC=C21 KYARBIJYVGJZLB-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Thermal Transfer Or Thermal Recording In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気電子部品のｗＡ縁被被覆用いられ、レー
ザーの照射によりその絶縁被覆表面に鮮明な印字を施す
ことのできるレーザー印字に遺したエポキシ樹脂組成物
に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is used for coating the wA edge of electrical and electronic parts, and is a technology that is used for laser marking that can clearly print on the surface of the insulating coating by irradiation with a laser. The present invention relates to an epoxy resin composition.
〔従来の技術）
従来、エポキシ樹脂組成物により絶縁被覆された電気電
子部品に特性や型番を明示するため印字をする際、熱硬
化性のインクや紫外線硬化性のインクが用いられている
が、工程の合理化を日的としてより短時間で印字できる
方法が要求されている。[Prior Art] Conventionally, thermosetting ink or ultraviolet curable ink has been used when printing to clearly indicate the characteristics and model number of electrical and electronic parts coated with an epoxy resin composition. There is a need for a method that can print in a shorter time to streamline the process.
この対応方法の１つとして、レーザーの照射による印字
システムが注目されている。このレーザー印字システム
は、文字やパターン状にレーザーを照射された部分が熱
エネルギーにより変色する、あるいは照射された部分が
昇華し表面粗化され、光の散乱によって文字やパターン
が識別できるものであり、この方法の印字時間は０．０
１秒以下であり、従来の熱あるいは紫外線硬化性のイン
クが硬化に数分〜数１０分を必要とするのに比べ、大幅
に短縮されるものである。As one method for dealing with this problem, a printing system using laser irradiation is attracting attention. In this laser printing system, the part of the text or pattern that is irradiated with the laser changes color due to thermal energy, or the part that is irradiated sublimates and becomes roughened, and the text or pattern can be identified by the scattering of light. , the printing time of this method is 0.0
The curing time is less than 1 second, which is significantly shorter than the conventional heat or ultraviolet curable ink, which takes several minutes to several tens of minutes to cure.
しかし、従来のエポキシ樹脂ｍ酸物の絶縁被覆にレーザ
ーを照射した場合、単に被覆表面を粗化するのみで、変
色がおこらず、鮮明な文字やバタ−ンを印字することが
できなかった。However, when a conventional epoxy resin m-acid insulation coating is irradiated with a laser, the coating surface is merely roughened, no discoloration occurs, and clear characters and patterns cannot be printed.
最近、従来のエポキシ樹脂組成物に黄色の水酸化第二鉄
を含有させると、レーザー照射によって黄色から褐色に
変色することが見い出された（特開昭６２−５０３６０
号公報）。Recently, it has been discovered that when a conventional epoxy resin composition contains yellow ferric hydroxide, the color changes from yellow to brown when irradiated with a laser (Japanese Patent Laid-Open No. 62-50360
Publication No.).
しかし、水酸化第二鉄は黄色であるため、黄、燈色のよ
うな色相にしか用いることができず、青や緑色の下地、
特に淡色系の下地に黒色のレーザ明色からレーザーによ
り黒色に変色する樹脂組成物を得んとして鋭意検討した
結果、酢酸銀を含有させるとレーザーを照射した際無色
から黒色に変色することを見出し、更にこの知見に基づ
き種々研究を進めて本発明を完成するに至ったものであ
る。However, since ferric hydroxide is yellow, it can only be used for hues such as yellow and light blue;
In particular, as a result of intensive studies aimed at obtaining a resin composition that changes color from a bright black color to black when irradiated with a laser on a light-colored base, it was discovered that when silver acetate is added, the color changes from colorless to black when irradiated with a laser. Furthermore, based on this knowledge, various studies were conducted and the present invention was completed.
本発明の目的とするところは電気的特性および他の緒特
性を低化させることなく、レーザーの照射により樹脂表
面に鮮明な印字を施すことのできる硬化物を与えるエポ
キシ樹脂＆１１戒物を提供するレーザー印字に適したエ
ポキシ樹脂＆ｌｌ威物に関するものである。The object of the present invention is to provide an epoxy resin and 11 precepts that provide a cured product that can be clearly printed on the surface of the resin by laser irradiation without degrading the electrical properties or other properties. This article relates to epoxy resin suitable for laser printing.
本発明のエポキシ樹脂ｍ酸物に酢酸銀を用いる理由を以
下述べる。The reason why silver acetate is used as the epoxy resin m-acid of the present invention will be described below.
酢酸銀は無色の結晶であり、加熱すると１５０〜２５０
°Ｃで脱酢酸し酸化銀（ｒ）に変化し、黒色となる。Silver acetate is a colorless crystal, and when heated, it becomes 150-250
It is deaceticated at °C and turns into silver (r) oxide, turning black.
従って、酢酸銀を含有したエポキシ樹脂組成物に対し文
字やパターン状にレーザーを照射すると、樹脂表面がレ
ーザーの熱エネルギーにより加熱され、樹脂中に含有さ
れた酢酸銀が上記化学反応を生じ黒色となる。すなわち
レーザーに照射された部分のみ黒色となり、照射されな
い部分は白色のままのため、白色の下地に黒色の文字や
パターンを鮮明に印字することができる。Therefore, when an epoxy resin composition containing silver acetate is irradiated with a laser in the form of letters or patterns, the resin surface is heated by the laser's thermal energy, and the silver acetate contained in the resin undergoes the above chemical reaction, turning black. Become. In other words, only the parts irradiated by the laser turn black, and the parts not irradiated remain white, making it possible to clearly print black characters and patterns on a white background.
本発明に用いられる酢酸銀の粒度は平均粒径が１００μ
ｍ以下であることが好ましい、その理由はエポキシ樹ｉ
組成物に酢酸銀を混合分散させた際、１００μｍ以上の
平均粒径では電子電気部品に被覆させた際表面に斑点状
となり、部品の裔晶価値を低下させやすくなるばかりで
なく、分散が不充分となりやすく、レーザーが照射され
た際、酢酸銀が存在しない部分では変色がおこらず、文
字やパターンがとぎれ鮮明な印字ができない場合がある
。The average particle size of silver acetate used in the present invention is 100 μm.
The reason for this is that the epoxy resin i
When silver acetate is mixed and dispersed in the composition, if the average particle size is 100 μm or more, it will not only cause spots to appear on the surface when coated on electronic and electrical parts, but also tend to reduce the crystal value of the parts, as well as cause poor dispersion. When irradiated with a laser, discoloration does not occur in areas where silver acetate is not present, and characters and patterns may be interrupted and clear printing may not be possible.
なお、この平均粒径はコールタ−カウンター（日科機■
Ｉｔ）により得られる粒度分布を重量平均することによ
り求めるのが適当であるが、コールタ−カウンター以外
の測定方法により求めてもよい。Note that this average particle size is measured using a Coulter counter (Nikkaki ■).
Although it is appropriate to determine by weight averaging the particle size distribution obtained by It), it may also be determined by a measuring method other than Coulter counter.
酢酸銀の含有量としては０８５〜２０重量％が好ましい
、この理由は、含有量が０．５重量％以下では、レーザ
ーが照射されても変色する度合が小さく鮮明な印字とな
らず、一方、２０重量％を越えると、樹脂組成物の電気
絶縁性が低下し電子電気部品用絶縁材料としての本来の
性能を満足しにくくなるためである。The content of silver acetate is preferably 0.85 to 20% by weight, because if the content is less than 0.5% by weight, the degree of discoloration is small even when irradiated with a laser, and clear printing cannot be achieved. This is because if the amount exceeds 20% by weight, the electrical insulation properties of the resin composition will decrease, making it difficult to satisfy the original performance as an insulating material for electronic and electrical parts.
本発明に用いられるエポキシ樹脂としては、例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂等のジクリシジルエーテル型エポキシ樹脂、フ
ェノールノボラック型エポキシ樹脂、タレゾールノボラ
ック型エポキシ樹脂等のノボラック型エボキン樹脂、グ
リシジルエステル型エポキシ樹脂、グリシジルアミン型
エポキシ樹脂、線状脂肪族型エポキシ樹脂、複素環型エ
ポキシ樹脂、ハロゲン化エポキシ樹脂等があげられるが
、これらに限定されるものではない。Epoxy resins used in the present invention include, for example, dicrycidyl ether type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, novolac type evoquine resins such as phenol novolac type epoxy resin, Talezol novolac type epoxy resin, etc. Examples include, but are not limited to, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, linear aliphatic type epoxy resins, heterocyclic type epoxy resins, and halogenated epoxy resins.
本発明に用いられる硬化剤および硬化促進剤としては、
酸無水物、ポリアミン、ノボラック型フェノール樹脂、
第３級アミン、イミダゾール化合物等があるが、いずれ
を用いてもよい、又必要により公知の無機充填剤、たと
えばジルコン粉末、タルク粉末、結晶シリカ粉末、溶融
シリカ粉末、炭酸カルシウム粉末、マグネシア粉末、ケ
イ酸カルシウム粉末、水和アルミナ粉末、アルξす粉末
等を配合してもよい。The curing agent and curing accelerator used in the present invention include:
Acid anhydride, polyamine, novolac type phenolic resin,
Tertiary amines, imidazole compounds, etc. may be used, and if necessary, known inorganic fillers such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, Calcium silicate powder, hydrated alumina powder, aluminum powder, etc. may also be blended.
本発明により得られる樹脂組成物は酢酸銀の色調により
通常白色を呈するため、赤、青、緑、黒色等の顔料を併
用できる。Since the resin composition obtained by the present invention usually exhibits a white color due to the color tone of silver acetate, pigments such as red, blue, green, and black can be used in combination.
本発明の樹脂組成物は注型材料等の液状、粉体塗料等の
粉状、成型材料等の顆粒状、塊状等いずれの状態でもよ
い。The resin composition of the present invention may be in any form, such as liquid as a casting material, powder as in a powder coating, granule or block as in a molding material.
本発明の樹脂＆［Ｉ酸物を製造する方法として、例えば
粉体塗料の場合をあげると、所定の割合で秤量した原料
成分をミキサーによって充分混合したのち、エクストル
ーダー、コニーダーあるいはロール等で熔融混練し、次
いで粉砕機にて粉砕する方法等がある。上記方法により
得られた粉体塗料により電子電気部品の絶縁被覆を行う
方法としては、流動浸漬法、静電流動浸漬法、ころがし
法、ふりかけ法、ホットスプレー法、静電スプレー法等
一般の粉体塗装方法が用いられる。As a method for producing the resin & [I acid of the present invention, for example, in the case of powder coating, raw materials weighed in a predetermined ratio are sufficiently mixed in a mixer, and then melted in an extruder, co-kneader, roll, etc. There are methods such as kneading and then pulverizing with a pulverizer. Methods for insulating coating electronic and electrical components with the powder coating obtained by the above method include general powder coating methods such as fluidized dipping method, electrostatic dynamic dipping method, rolling method, sprinkle method, hot spray method, and electrostatic spray method. Body painting methods are used.
又、注型材料、成型材料の場合についても公知の技術で
製造でき、絶縁材料として使用できる。In addition, casting materials and molding materials can also be manufactured using known techniques, and can be used as insulating materials.
次に本発明を実施例により更に詳しく説明する。 Next, the present invention will be explained in more detail with reference to Examples.
実施例１
ビスフェノールＡ型エポキシ樹脂
（エポキシ当量９５０） ５０重量部酢酸銀
（平均粒径１７μｍ） ５結晶シリカ粉末
５０
２メチルイξダゾール ｌ 〃上記組成物を配
合し、ヘンシェルミキサーでブレンドし、コニーダーに
て溶融混練した後、粉砕機で粉砕することにより平均粒
径６０〜７０μｍのエポキシ樹脂組成物の粉体塗料を得
た。Example 1 Bisphenol A type epoxy resin (epoxy equivalent: 950) 50 parts by weight Silver acetate (average particle size 17 μm) 5 crystalline silica powder 50 2 methylidazole 1 The above compositions were blended, blended in a Henschel mixer, and placed in a co-kneader. After melt-kneading, the mixture was pulverized using a pulverizer to obtain a powder coating of an epoxy resin composition having an average particle size of 60 to 70 μm.
実施例２
実施例１において、酢酸銀の添加量を２０重量部に替え
、他は同様にして平均粒径６０〜７０μｍのエポキシ樹
脂ｍ酸物の粉体塗料を得た。Example 2 In Example 1, except that the amount of silver acetate added was changed to 20 parts by weight, a powder coating of an epoxy resin m-acid having an average particle size of 60 to 70 μm was obtained.
比較例１
実施例１において、酢酸銀の添加量を０．１重量部に替
え、他は同様にして平均粒径６０〜７０μｍのエポキシ
樹脂＆ｌＩ放物の粉体塗料を得た。Comparative Example 1 In Example 1, except that the amount of silver acetate added was changed to 0.1 part by weight, a powder coating of an epoxy resin &lI compound having an average particle size of 60 to 70 μm was obtained.
比較例２
実施例１において、酢酸銀の添加量を５０重量部に替え
、他は同様にして平均粒径６０〜７０μｍのエポキシ樹
脂組成物の粉体塗料を得た。Comparative Example 2 A powder coating of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained in the same manner as in Example 1 except that the amount of silver acetate added was changed to 50 parts by weight.
実施例１．２及び比較例１．２の樹脂＆ｌｌ或物放物い
て硬化物を作製した。A cured product was prepared by using the resins of Example 1.2 and Comparative Example 1.2.
この試料に炭酸ガスレーザー（ウシオ電機■製４００型
レーザーマーク、エネルギー密度６Ｊｏｕｌ／ｃｄ）を
用いて、１００万分の１秒間所定のマスクを通してレー
ザーを照射して、硬化物の表面にマーキングを施した。This sample was irradiated with a carbon dioxide laser (400 type laser mark manufactured by Ushio Inc., energy density 6 Joul/cd) through a prescribed mask for 1/1 million seconds to mark the surface of the cured product. .
また、上記硬化物の絶縁破壊電圧をＪＩＳＸ６９１１に
より測定した。結果を表−１に示す。Further, the dielectric breakdown voltage of the cured product was measured according to JISX6911. The results are shown in Table-1.
表−１
〔発明の効果〕
本発明のレーザー印字に適したエポキシ樹脂組成物を絶
縁被覆材として用いた場合、電気的特性および他の特性
を低下させることなく、レーザーの照射により樹脂表面
に鮮明な印字を施すことのできる被覆を与えることがで
きる。従って、従来より非常に短時間で印字できるため
、電気電子部品の生産工程の合理化をはかることができ
る。Table 1 [Effects of the Invention] When the epoxy resin composition suitable for laser marking of the present invention is used as an insulating coating material, laser irradiation can clearly mark the resin surface without deteriorating electrical properties or other properties. It is possible to provide a coating that can be printed with a wide range of characters. Therefore, since printing can be performed in a much shorter time than conventionally, it is possible to rationalize the production process of electrical and electronic parts.
Claims (3)
キシ樹脂組成物において、酢酸銀を含有することを特徴
とするエポキシ樹脂組成物。(1) An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, etc., which is characterized by containing silver acetate.
特徴とする請求項１記載のエポキシ樹脂組成物。(2) The epoxy resin composition according to claim 1, wherein the average particle size of silver acetate is 100 μm or less.
することを特徴とする請求項１又は２記載のエポキシ樹
脂組成物。(3) The epoxy resin composition according to claim 1 or 2, which contains 0.5 to 20 parts by weight of silver acetate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193962A JPH0618991B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193962A JPH0618991B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0359065A true JPH0359065A (en) | 1991-03-14 |
| JPH0618991B2 JPH0618991B2 (en) | 1994-03-16 |
Family
ID=16316662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1193962A Expired - Lifetime JPH0618991B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618991B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6317925A (en) * | 1986-07-09 | 1988-01-25 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
-
1989
- 1989-07-28 JP JP1193962A patent/JPH0618991B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6317925A (en) * | 1986-07-09 | 1988-01-25 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0618991B2 (en) | 1994-03-16 |
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