JPH0360045U - - Google Patents
Info
- Publication number
- JPH0360045U JPH0360045U JP12208189U JP12208189U JPH0360045U JP H0360045 U JPH0360045 U JP H0360045U JP 12208189 U JP12208189 U JP 12208189U JP 12208189 U JP12208189 U JP 12208189U JP H0360045 U JPH0360045 U JP H0360045U
- Authority
- JP
- Japan
- Prior art keywords
- base
- sensor chip
- leads
- lead
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000007788 liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例の要部構成説明図、
第２図は第１図のＢ−Ｂ断面図、第３図は第１図
の要部拡大図、第４図は従来より一般に使用され
ている従来例の構成説明図、第５図は第４図のＡ
−Ａ断面図である。
１…センサチツプ、１１…凹部、１２…ダイア
フラム、１３…歪み検出センサ、２…基板、２１
…大気圧基準室、２２…貫通孔、３…大気導通パ
イプ、４…ベース、５…ボデイ、５１…測定室、
５２…接液ダイアフラム室、５３…連通孔、６１
…接液ダイアフラム、６２…封入液、６３…ケー
ス、６４…ケーブル、７…ハーメチツク端子７１
…リード、７２…絶縁体、７３…シールド体。
FIG. 1 is an explanatory diagram of the main part of an embodiment of the present invention.
Fig. 2 is a sectional view taken along the line B-B in Fig. 1, Fig. 3 is an enlarged view of the main part of Fig. 1, Fig. 4 is an explanatory diagram of the configuration of a conventional example commonly used, and Fig. 5 is a sectional view taken along line B-B in Fig. 1. A in figure 4
-A sectional view. DESCRIPTION OF SYMBOLS 1... Sensor chip, 11... Recessed part, 12... Diaphragm, 13... Strain detection sensor, 2... Substrate, 21
...Atmospheric pressure reference chamber, 22...Through hole, 3...Atmospheric communication pipe, 4...Base, 5...Body, 51...Measurement chamber,
52...Liquid contact diaphragm chamber, 53...Communication hole, 61
...liquid diaphragm, 62...filled liquid, 63...case, 64...cable, 7...hermetic terminal 71
...Lead, 72...Insulator, 73...Shield body.
Claims (1)
号を外部に取出すハーメチツク端子とを具備する
半導体圧力計において、 平行に設けられた複数のリードと 該リード間を絶縁する絶縁体と 前記複数のリードと前記ベースとの間に設けら
れ該リードとベースとを電気的に絶縁するパイプ
状のシールド体と を備えるハーメチツク端子を 具備したことを特徴とする半導体圧力計。[Scope of Claim for Utility Model Registration] A sensor chip made of a semiconductor, a substrate that holds the sensor chip, a mount member to which one end is connected to the substrate, a base to which the other end of the mount member is connected, and the base to which the sensor chip is attached. A semiconductor pressure gauge comprising a hermetic terminal for extracting electrical signals from the sensor chip to the outside, comprising: a plurality of parallel leads, an insulator for insulating between the leads, and a space between the plurality of leads and the base. 1. A semiconductor pressure gauge comprising a hermetic terminal including a pipe-shaped shield provided in the lead and the base to electrically insulate the lead and the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12208189U JPH0360045U (en) | 1989-10-18 | 1989-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12208189U JPH0360045U (en) | 1989-10-18 | 1989-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0360045U true JPH0360045U (en) | 1991-06-13 |
Family
ID=31670097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12208189U Pending JPH0360045U (en) | 1989-10-18 | 1989-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0360045U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4553984B1 (en) * | 2009-04-23 | 2010-09-29 | 三菱電機エンジニアリング株式会社 | Electromagnetic transducer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117642B2 (en) * | 1980-11-11 | 1986-05-08 | Uroko Seisakusho Co Ltd |
-
1989
- 1989-10-18 JP JP12208189U patent/JPH0360045U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117642B2 (en) * | 1980-11-11 | 1986-05-08 | Uroko Seisakusho Co Ltd |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4553984B1 (en) * | 2009-04-23 | 2010-09-29 | 三菱電機エンジニアリング株式会社 | Electromagnetic transducer |
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