JPH0360059A - Semiconductor device - Google Patents

Abstract

PURPOSE:To improve durability of a package by applying a high heat conductivity material onto the main surface of a semiconductor chip fixed on a substrate of the package and bringing the material partly in contact with a cap of the package. CONSTITUTION:A high heat conductivity material 2 is applied onto the upper main surface of a packaged semiconductor chip 1, and a part 5 of the material 2 is caused to be in contact with a cap 6 of the package. Therefore, the heat generated in an IC chip 1 is transmitted via the high heat conductivity material 2 and the part 5 of the material and radiated outside from the cap 6 of the package. Thus, the heat dissipated from the lower surface of the semiconductor chip via the package is reduced so that the durability of the package can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor devices, and particularly to semiconductor devices that easily generate heat, such as semiconductor devices, ICs, and LSIs.

[Conventional technology]

In FIG. 2, in the conventional semiconductor device, a semiconductor chip 1 is fixed onto the main surface inside a substrate 3 of a package, and pads on the semiconductor chip 1 and conductor patterns on the substrate 3 are connected by bonding. They were simply electrically connected by wire 4. A package cap was provided on the wire 4 and the semiconductor chip 1, spaced apart from each other.

In conventional semiconductor devices of this type, inside the package,
It was filled with gas or simply air.

[Problem to be solved by the invention]

In the semiconductor device described above in which gas or simply air is contained in the package, the heat released from the upper main surface of the semiconductor chip 1 is only released through the gas or air, so the heat is released. The drawback was that it was difficult to do.

Also, from the bottom main surface of the semiconductor chip, through the package,
The purpose of the present invention is to solve the above-mentioned drawbacks and to improve the heat dissipation. The object of the present invention is to provide a semiconductor device with good performance, improved package strength, and extended life.

[Means to solve the problem]

The structure of the semiconductor device of the present invention is such that a material having good thermal conductivity is attached to the main surface of a semiconductor chip fixed on a substrate of a package, and the material is brought into partial contact with the cap of the package. It is characterized by being

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1(a) is a sectional view showing a semiconductor device according to an embodiment of the present invention, and FIG. 1(b) is a perspective view showing a portion of a material having high thermal conductivity in FIG. 1(a).

In FIGS. 1(a) and 1(b), in this embodiment, a highly thermally conductive substance 2 is attached to the upper surface of a packaged semiconductor chip 1, and at least a portion 5 of the substance 2 is attached to the upper surface of a packaged semiconductor chip 1. It is configured by contacting the cap 6 of the package. Heat generated in the IC chip 1 is transmitted from the highly thermally conductive material 2 through at least a portion 5 of the material, and is emitted to the outside from the cap 6 of the package.

In FIG. 1(b), a portion of the cap 6 is removed to show a portion 5 and the like.

〔Effect of the invention〕

As explained above, in the present invention, a substance with high thermal conductivity is attached to the upper main surface of a semiconductor chip, and at least a part of this substance is brought into contact with the cap of the package, so that heat generated in the semiconductor chip is absorbed. By discharging heat from the upper surface of the semiconductor chip, the heat dissipated from the lower main surface of the semiconductor chip through the package is reduced, increasing the durability of the package. It has the effect of being able to.

[Brief explanation of drawings]

FIG. 1(a) is a sectional view showing a semiconductor device according to an embodiment of the present invention, FIG. 1(b) is a perspective view showing a part of the inside of FIG. 1(a), and FIG. 2 is a conventional semiconductor device. FIG. 2 is a cross-sectional view showing a semiconductor device. 1... Semiconductor chip, 2... Highly thermally conductive material, 5... Part, 3... Package substrate, 4... ...bonding wire, 6
······cap.

Claims (1)

[Claims] 1. A semiconductor device, characterized in that a substance having good thermal conductivity is attached to the main surface of a semiconductor chip fixed on a substrate of a package, and the substance is partially brought into contact with a cap of the package.