JPH036013A - semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To coat a chemical liquid film of a uniform thickness by a method wherein a semiconductor substrate is vacuum-sucked and fixed to a base plate and a misty coating chemical liquid which has been mixed uniformly with a carrier gas is sprayed on the surface of the semiconductor substrate in a state that an edge part has been masked. CONSTITUTION:A base 5 vacuum-sucks a semiconductor substrate 4; a mask 3 with which an edge part of the semiconductor substrate is covered is arranged at the upper part of the semiconductor substrate 4. A duct 2 has the following structure: it is provided with a spray nozzle 1 at its inside; a carrier gas flows from one end; the other end is opened at the upper part of the semiconductor substrate 4. Consequently, a coating liquid which has become misty by using the spray nozzle 1 is mixed with the carrier gas inside the duct 2 and is sprayed on the surface of the semiconductor substrate as a uniform mixed gas. Thereby, a chemical liquid film of a uniform thickness can be coated.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to semiconductor manufacturing equipment, and particularly to semiconductor manufacturing equipment used to spray various coating chemicals onto the surface of a semiconductor substrate to form a uniform chemical film. Regarding equipment.

[Conventional technology]

Conventionally, this type of semiconductor manufacturing equipment has had one or more spray nozzles fixed above the semiconductor substrate or movable in the horizontal direction, and the semiconductor substrate has been vacuum-adsorbed onto a rotatable base.

[Problem to be solved by the invention]

The conventional semiconductor manufacturing equipment described above has a spray nozzle above the semiconductor substrate, so the distance from the spray point to the coating surface is different between the center and the outer periphery of the semiconductor substrate, resulting in variations in coating film thickness. be.

In addition, since the semiconductor substrate is rotated, the coating liquid flows around the edges and back surface of the semiconductor substrate, causing peeling of the film and etching residue in subsequent steps.

[Means to solve the problem]

The semiconductor manufacturing apparatus of the present invention includes a base for vacuum-chucking a semiconductor substrate, a mask for covering an edge portion of the semiconductor substrate vacuum-chucking to the base, a duct in which an opening is located above the mask, and a duct in the duct. The device includes a spray nozzle that introduces a coating chemical solution in the form of a mist, and a means for supplying a carrier gas from behind the spray nozzle.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention.

The substrate 5 vacuum-chucks the semiconductor substrate 4, and a mask 3 is placed above the semiconductor substrate 4 to cover the edge portion of the semiconductor substrate. The duct 2 has a spray nozzle 1 therein, and has a structure in which a carrier gas flows from one end, and the other end is opened toward the semiconductor substrate 4.

As a result, the coating chemical liquid atomized by the spray nozzle 1 mixes with the carrier scum in the duct 2, becomes a uniform gas mixture, and is sprayed onto the surface of the semiconductor substrate, so that a uniform chemical film can be applied. At this time, the mask 3 prevents the coating chemical from adhering to the edge portions and back surface of the semiconductor substrate.

FIG. 2 is a longitudinal sectional view showing a second embodiment of the invention.

In this embodiment, a plate with a large number of holes or a mesh-like baffle plate 6-1.6-2.6-3 is installed inside the duct 2, and a mist-like coating chemical solution and a carrier gas are connected to each other. This has the advantage that the mixture becomes more uniform and the uniformity of the chemical liquid film thickness on the surface of the semiconductor substrate is improved.

〔Effect of the invention〕

As explained above, the present invention fixes a semiconductor substrate to the substrate by vacuum suction, and sprays a mist coating solution uniformly mixed with a carrier gas onto the surface of the semiconductor substrate while masking the edges. This has the effect of being able to apply a chemical film of uniform thickness. Furthermore, it can prevent the coating chemical from adhering to the edges and back surface of the semiconductor substrate, and eliminates peeling of the chemical film and etching residue, which has the effect of reducing the generation of dust. .

[Brief explanation of drawings]

FIG. 1 is an IN@ side view showing the first embodiment of the present invention, and FIG.
The figure is a longitudinal sectional view showing the second embodiment. ] ・Spray nostle, 2... duct, 3... mask,
4 semiconductor substrate, 5... base, 6-1', 6-2.63...
・Block board.

Claims (1)

[Claims] A base for vacuum suctioning a semiconductor substrate, a mask covering an edge portion of the semiconductor substrate vacuum suctioned to the base, a duct having an opening located above the mask, and a spraying chemical solution in the duct. A semiconductor manufacturing apparatus comprising: a spray nozzle for introducing carrier gas; and means for supplying carrier gas from behind the spray nozzle.