JPH0360142A - Semiconductor measuring equipment - Google Patents

Semiconductor measuring equipment

Info

Publication number
JPH0360142A
JPH0360142A JP1196152A JP19615289A JPH0360142A JP H0360142 A JPH0360142 A JP H0360142A JP 1196152 A JP1196152 A JP 1196152A JP 19615289 A JP19615289 A JP 19615289A JP H0360142 A JPH0360142 A JP H0360142A
Authority
JP
Japan
Prior art keywords
sample
semiconductor sample
groove
semiconductor
metal fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1196152A
Other languages
Japanese (ja)
Inventor
Yoshihito Suzuki
義仁 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1196152A priority Critical patent/JPH0360142A/en
Publication of JPH0360142A publication Critical patent/JPH0360142A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To prevent the scrubbing between a semiconductor sample and a metal fitting for fixing a sample, and eliminate the damage of a measuring surface of the semiconductor sample, by installing the metal fitting for pinching and retaining the sample on a pedestal so as to be able to open and close. CONSTITUTION:An operating rod is pushed against 1 spring 3 so as to be able to insert a semiconductor sample 1 into the groove 2a of a pedestal 2, and a metal fitting 5 for fixing a sample is separated from a side wall of the groove 2a, thereby keeping a space between the metal fitting 5 and the side wall of the groove 2a. The semiconductor sample 1 is inserted into the space formed between the metal fitting 5 and the side wall of the groove 2a, while the operating rod 4 is pushed; the semiconductor sample 1 is balanced, and the operating rod 4 is separated; the semiconductor sample 1 is pinched and retained between the side wall of the groove 2a and the metal fitting 5 by utilizing the spring force of the spring 3, thereby fixing the sample 1 on a pedestal 2. When the semiconductor sample 1 is inserted, the metal fitting 5 is opened, and they do not scrub each other, so that a measuring surface of the semiconductor sample 1 is not damaged.

Description

【発明の詳細な説明】 【産業上の利用分野〕 本発明は半導体測定装置に関し、特に走査型電子顕微鏡
の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor measuring device, and more particularly to an improvement in a scanning electron microscope.

〔従来の技術〕[Conventional technology]

従来、この種の半導体測定装置は第5図及び第6図に示
すように半導体試料lを固定するために、台座2の上面
に溝2aが設けられており、半導体試料lを台座2の溝
2a内に差し込み、該半導体試料lを溝2aの一方の側
壁2bにあてがって立掛け、バネ性をもつU字状固定金
具5を撓めてこれを半導体試料lと溝2aの他方の側壁
2Cとの隙間に圧入し、固定金具5のばね力でもって半
導体試料1を台座2に固定していた。
Conventionally, in this type of semiconductor measuring device, a groove 2a is provided on the upper surface of a pedestal 2 in order to fix the semiconductor sample l, as shown in FIGS. 5 and 6. 2a, the semiconductor sample l is placed against one side wall 2b of the groove 2a, and the semiconductor sample l is placed against the other side wall 2c of the groove 2a by bending the U-shaped fixing metal fitting 5 having spring properties. The semiconductor sample 1 was fixed to the pedestal 2 by the spring force of the fixing fitting 5.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の半導体測定装置は、半導体試料lを台座
2に固定させる際、固定金具5を半導体試料1の測定面
側より圧入するので、半導体試料1や固定金具5の形状
のバラツキにより、半導体試料lの測定面に固定金具5
が接触して半導体試料lの測定面を破壊するという欠点
がある。
In the conventional semiconductor measuring device described above, when fixing the semiconductor sample l to the pedestal 2, the fixing fitting 5 is press-fitted from the measurement surface side of the semiconductor sample 1. Therefore, due to variations in the shape of the semiconductor sample 1 and the fixing fitting 5, Fixing bracket 5 on the measurement surface of sample l
There is a disadvantage that the measurement surface of the semiconductor sample 1 may be destroyed by contact.

本発明の目的は前記課題を解決した半導体測定装置を提
供することにある。
An object of the present invention is to provide a semiconductor measuring device that solves the above problems.

〔発明の従来技術に対する相違点〕[Differences between the invention and the prior art]

上述した従来の半導体測定装置は固定金具を半導体試料
の測定面側より圧入させていたのに対し、本発明は半導
体試料の側面側より固定金具を動かすこと、又は、半導
体試料を固定金具で挾むことにより、半導体試料を台座
に固定するという相違点を有する。
In contrast to the conventional semiconductor measuring device described above, in which the fixture is press-fitted from the measurement surface side of the semiconductor sample, the present invention allows the fixture to be moved from the side surface of the semiconductor sample, or the semiconductor sample to be held between the fixtures. The difference is that the semiconductor sample is fixed to the pedestal by attaching it to the pedestal.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため、本発明の半導体装置装置は台
座と、前記台座に試料を固定する金具とを備えた半導体
測定装置において、試料を台座に挟圧保持する固定金具
を開閉可能に設けたものである。
In order to achieve the above object, the semiconductor device of the present invention is a semiconductor measuring device equipped with a pedestal and a metal fitting for fixing a sample to the pedestal, in which the fixing metal fitting for holding the sample on the pedestal under pressure can be opened and closed. It is something.

〔実施例〕〔Example〕

以下、本発明の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.

(実施例1) 第1図、第2図は本発明の実施例1を示す平面図及び側
面図である。
(Example 1) FIGS. 1 and 2 are a plan view and a side view showing Example 1 of the present invention.

図において、台座2の上面には半導体試料1の板厚より
巾広の溝2a、 2a・・・が設けられている。
In the figure, grooves 2a, 2a, . . . , which are wider than the thickness of the semiconductor sample 1, are provided on the upper surface of the pedestal 2.

本発明は台座2の溝2aの底部に位置させて操作棒4を
溝2aを横切って摺動可能に設け、各溝2a内に試料用
固定金具5を溝2aの側壁に対し平行に立掛けて備え付
け、各試料用固定金具5を操作棒4に垂直に取付け、さ
らに操作棒4を固定金具5が溝2aの側壁に圧着する方
向に付勢したものである。
In the present invention, the operating rod 4 is positioned at the bottom of the groove 2a of the pedestal 2 so as to be slidable across the groove 2a, and a sample fixture 5 is placed in each groove 2a in parallel to the side wall of the groove 2a. Each sample fixing fitting 5 is attached perpendicularly to the operating rod 4, and the operating rod 4 is biased in a direction in which the fixing fitting 5 is pressed against the side wall of the groove 2a.

実施例において、半導体試料lを台座2の溝2aに挿入
できるように、スプリング3に抗して操作棒4を押し、
試料用固定金具5を溝2aの側壁から引き離し、固定金
具5と溝2aの側壁との間にスペースを確保する。次に
、操作棒4を押しながら半導体試料lを、固定金具5と
溝2aの側壁との間に形成された前記スペース内に差し
込み、半導体試料lのバランスをとりながら、操作棒4
を離し、半導体試料1を第1図に一点鎖線で示すように
スプリング3のばね力を利用して溝2aの側壁と固定金
具5との間で挟圧保持し、これを台座2に固定する。
In the embodiment, the operating rod 4 is pushed against the spring 3 so that the semiconductor sample l can be inserted into the groove 2a of the pedestal 2,
The sample fixture 5 is pulled away from the side wall of the groove 2a to ensure a space between the fixture 5 and the side wall of the groove 2a. Next, while pushing the operating rod 4, insert the semiconductor sample l into the space formed between the fixture 5 and the side wall of the groove 2a, and while balancing the semiconductor sample l, hold the operating rod 4.
The semiconductor sample 1 is held under pressure between the side wall of the groove 2a and the fixture 5 using the spring force of the spring 3, as shown by the dashed line in FIG. .

本実施例によれば、半導体試料lを差し込む際には固定
金具5が開いており、半導体試料1と固定金具5とが擦
り合うことがなく、半導体試料lの測定面を破壊するこ
とがない。
According to this embodiment, the fixture 5 is open when the semiconductor sample 1 is inserted, so that the semiconductor sample 1 and the fixture 5 do not rub against each other, and the measurement surface of the semiconductor sample 1 is not damaged. .

(実施例2) 第3図は本発明の実施例2を示す平面図、第4図は同側
面図である。
(Example 2) FIG. 3 is a plan view showing Example 2 of the present invention, and FIG. 4 is a side view of the same.

本実施例では、台座2の溝2a内にバネ性をもつクリッ
プ状固定金具5を備え付けたものであり、固定金具5を
バネ力に抗して押し開き、半導体試料1をバランスをと
りながら、固定金具5に押入し、半導体試料lをクリッ
プ状固定金具5でばね力を利用して挟圧保持して固定す
る。
In this embodiment, a clip-shaped fixing fitting 5 having spring properties is installed in the groove 2a of the pedestal 2. The fixing fitting 5 is pushed open against the spring force, and while the semiconductor sample 1 is balanced, The semiconductor sample 1 is pushed into the fixing metal fitting 5 and held by the clip-shaped fixing metal fitting 5 under pressure using spring force.

本実施例では固定金具5を押し開いて半導体試料lを挿
入するので、半導体試料lの測定面と固定金具5とが擦
り合うことがなく、半導体試料1の測定面の破壊を防止
できる。
In this embodiment, the fixture 5 is pushed open and the semiconductor sample 1 is inserted, so the measurement surface of the semiconductor sample 1 and the fixture 5 do not rub against each other, and damage to the measurement surface of the semiconductor sample 1 can be prevented.

[発明の効果] 以上説明したように本発明は半導体試料と試料用固定金
具の擦り合いを防止し、半導体試料の測定面の破壊をな
くすことができる効果がある。
[Effects of the Invention] As explained above, the present invention has the effect of preventing the semiconductor sample and the sample fixture from rubbing against each other, and eliminating damage to the measurement surface of the semiconductor sample.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第3図は本発明の第1及び第2の実施例を示
す平面図、第2図及び第4図は第1図及び第3図の側面
図、第5図は従来の半導体測定装置を示す平面図、第6
図は第5図の側面図である。 1・・・半導体試料      2・・・台座2・・・
溝          3・・・スプリング4・・・操
作棒       5・・・固定金具第2図 2cL 第5図 第6図
1 and 3 are plan views showing the first and second embodiments of the present invention, FIGS. 2 and 4 are side views of FIGS. 1 and 3, and FIG. 5 is a conventional semiconductor device. Plan view showing the measuring device, No. 6
The figure is a side view of FIG. 1... Semiconductor sample 2... Pedestal 2...
Groove 3...Spring 4...Operation rod 5...Fixing bracket Fig. 2 2cL Fig. 5 Fig. 6

Claims (1)

【特許請求の範囲】[Claims] (1)台座と、前記台座に試料を固定する金具とを備え
た半導体測定装置において、試料を台座に挟圧保持する
固定金具を開閉可能に設けたことを特徴とする半導体測
定装置。
(1) A semiconductor measuring device comprising a pedestal and a metal fitting for fixing a sample to the pedestal, characterized in that the fixing metal fitting for holding the sample on the pedestal under pressure can be opened and closed.
JP1196152A 1989-07-28 1989-07-28 Semiconductor measuring equipment Pending JPH0360142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1196152A JPH0360142A (en) 1989-07-28 1989-07-28 Semiconductor measuring equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1196152A JPH0360142A (en) 1989-07-28 1989-07-28 Semiconductor measuring equipment

Publications (1)

Publication Number Publication Date
JPH0360142A true JPH0360142A (en) 1991-03-15

Family

ID=16353074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1196152A Pending JPH0360142A (en) 1989-07-28 1989-07-28 Semiconductor measuring equipment

Country Status (1)

Country Link
JP (1) JPH0360142A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0619253U (en) * 1992-08-19 1994-03-11 株式会社ニコン Sample holder
CN107452586A (en) * 2017-07-29 2017-12-08 哈尔滨理工大学 A kind of fixture suitable in Quanta200 SEM

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0619253U (en) * 1992-08-19 1994-03-11 株式会社ニコン Sample holder
CN107452586A (en) * 2017-07-29 2017-12-08 哈尔滨理工大学 A kind of fixture suitable in Quanta200 SEM

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