JPH0361329U - - Google Patents
Info
- Publication number
- JPH0361329U JPH0361329U JP12247489U JP12247489U JPH0361329U JP H0361329 U JPH0361329 U JP H0361329U JP 12247489 U JP12247489 U JP 12247489U JP 12247489 U JP12247489 U JP 12247489U JP H0361329 U JPH0361329 U JP H0361329U
- Authority
- JP
- Japan
- Prior art keywords
- single crystal
- semiconductor single
- wafers
- cutting device
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の半導体単結晶切断装置の一実
施例を示す動作斜視図、第２図ａ，ｂは同じく本
装置の平面図及び側面図、第３図はマルチワイヤ
ソーの斜視図、第４図ａ及びｂはマルチワイヤソ
ーの平面図及び側面図、第５図は斜め方向切断時
の説明図である。
１……多溝滑車、２……ワイヤ、３……半導体
単結晶、４……テーブル、８Ａ……移動側送り装
置、８Ｂ……固定側送り装置、９……滑車、１０
……錘。
FIG. 1 is an operational perspective view showing an embodiment of the semiconductor single crystal cutting device of the present invention, FIGS. 2a and 2b are a plan view and side view of the device, and FIG. 4a and 4b are a plan view and a side view of the multi-wire saw, and FIG. 5 is an explanatory view when cutting in an oblique direction. DESCRIPTION OF SYMBOLS 1... Multi-groove pulley, 2... Wire, 3... Semiconductor single crystal, 4... Table, 8A... Moving side feeding device, 8B... Fixed side feeding device, 9... Pulley, 10
... Weight.
Claims (1)
に研磨液を供給しながら半導体単結晶を押当てて
複数枚のウエハに切断する切断装置において、前
記半導体単結晶を前記多溝滑車の軸方向に対し切
断線に沿つて斜め方向に昇降させる半導体単結晶
送り装置を設けたことを特徴とする切断装置。 In a cutting device that cuts a semiconductor single crystal into a plurality of wafers by pressing a semiconductor single crystal while supplying a polishing liquid to a continuously moving wire stretched across a multi-groove pulley, the semiconductor single crystal is cut into a plurality of wafers. A cutting device characterized by being provided with a semiconductor single crystal feeding device that moves the semiconductor single crystal up and down diagonally along the cutting line with respect to the direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12247489U JPH0361329U (en) | 1989-10-19 | 1989-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12247489U JPH0361329U (en) | 1989-10-19 | 1989-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361329U true JPH0361329U (en) | 1991-06-17 |
Family
ID=31670471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12247489U Pending JPH0361329U (en) | 1989-10-19 | 1989-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361329U (en) |
-
1989
- 1989-10-19 JP JP12247489U patent/JPH0361329U/ja active Pending