JPH0361341B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a packaging apparatus for semiconductor devices, and more specifically, to a packaging apparatus for semiconductor devices without using a conventional large molding press. The present invention relates to a simple device for carrying out this process.

[Conventional technology]

Generally, for packaging semiconductor devices and the like, a molding method called transfer molding is used, in which resin is plasticized in a pot, passed through a runner at high temperature and pressure, and then press-fitted into the cavity of a mold.

[Problem that the invention seeks to solve]

When using this method, the terminals of semiconductor devices, etc. that come out outside must be firmly held down with a mold to prevent the resin from leaking out, and the resin is forced in with tens of tons of high pressure. A mold with extremely high precision is required. Moreover, in order to be profitable, a large number of semiconductor devices and the like are simultaneously molded, so the mold must be large and expensive. Therefore, this method is not suitable for anything other than high-volume production of a small number of products. However, recently, the number of semiconductor devices used for certain limited purposes has increased, and although it is sufficient to manufacture small quantities for prototyping, it is difficult to adopt the transfer molding method for such purposes. is unsuitable, and there has been a strong desire for an alternative molding apparatus for simple semiconductor devices, etc. for high-mix, low-volume production.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a simple packaging apparatus for semiconductor devices, etc., which is suitable for high-mix, low-volume production.

Another object of the present invention is to provide a packaging apparatus for semiconductor devices and the like that can perform packaging operations for semiconductor devices and the like at low cost without using large and expensive molds.

[Means for solving problems]

The apparatus according to the present invention comprises a holding part 2 for holding a lead frame 1, and mold heads 3 and 4 arranged on both sides of the holding part 2. In the hold part 2,
There are horizontally long joining plates 39 and 40 which are opened and closed by a cylinder 48. On the plywood boards 39 and 40,
Fitting holes 41 and 42 into which the fitting portions 7 and 8 of the rotary heads 5 and 6 of the mold heads 3 and 4 are loosely fitted are arranged side by side. The number is the same as the number of devices installed in the lead frame 1. The joining plate 39 is fixed on a bridge 45 installed on a moving base 43 via a heat insulating plate 44 (see FIG. 3). Guide bars 46 are attached to the four corners of the bonding board 39. The other bonding plate 40 is slidable on these four guide bars 46. An opening/closing cylinder 48 is attached to the lower side of the joining plate 40 via a bracket 47, and its rod tip is fixed to a horizontal plate 49 passed between two guide bars 46 on the lower side. Pins 50 are installed on the upper and lower surfaces of the insertion hole 42 of the side plate 40 for fitting into pin holes drilled in the side of the lead frame and for positioning the lead frame. In addition, hot jet pipes 51 and 52 that blow out hot air toward the lead frame 1 held between the bonding plates 39 and 40 are installed in each fitting hole 4 of the bonding plates 39 and 40, respectively.
1 and 42 are arranged above and below. The mechanism of the holding section 2 described above is placed on the movable base 43, and the movable base 43 is moved forward by a cam mechanism described below.
A slide guide 55 that straddles a rail 54 laid on a stationary base 53 is fixed on the back side of the movable base 43. A cam motor 56 is installed on the stationary base 53, and a rotating plate 58 having a pair of rollers 57 functioning as cam followers is attached to its rotating shaft. A cam plate 59 that engages with this roller 57 is installed at the end of the movable base 43. cam plate 59
has a large number of deep grooves 59a with which the rollers 57 engage.
is formed (see Figure 2).

The mold heads 3 and 4 are slidably straddled and opposed to each other on a rail 61 laid on a base 60 (see FIG. 1). mold head 3,
4 has a motor 62 installed at the end of the base 60.
A synchro belt 63, which is driven in circulation by, is fixed. The fixing positions of the synchro belt 63 are reversed left and right between the mold head 3 and the mold head 4 when viewed from the motor 62 side. Rotating heads 5 and 6 are rotatably supported between side plates 64 and 65 of mold heads 3 and 4 (see FIG. 2).
The rotating heads 5 and 6 are connected to two sets of miter gears 67 and 6.
Motor 6 attached to side plate 64 via 8
9, the mold head 4 is rotated counterclockwise by 90 degrees (although only the mold head 3 side is shown in the drawing, the mold head 4 has a similar configuration). next,
The internal structure of the rotary heads 5 and 6 will be explained with reference to FIGS. 4 and 5. (In the figure, the rotary heads 5 and 6 are rotated 90 degrees and are in a horizontal state.The mold in FIG. head 4 condition). A recess 66 is provided on the upper surface of the rotating heads 5, 6 to accommodate a boat-shaped semi-molded product (semi-cured product), and two ejector pipes 70, 71 slide from the bottom of the recess 66. Possibly embedded. Vacuum pipes 72, 73 whose upper surfaces are closed are slidably inserted into each ejector pipe 70, 71. The ejector pipes 70 and 71 are connected at their lower portions by an ejector plate 74. The ejector plate 74 has a spring 75
The spring 75 is constantly pressed down by the air supply port 76 and air is supplied from the air supply port 76 to
Move slightly upward against the Below the vacuum pipes 72 and 73 are ejector pipes 70 and 71.
A spring 77 is wrapped around the lower end of the spring 77, and the spring 77 is connected with an ejector plate 78. This ejector plate 78 is constantly pressed down by the spring 77, and is raised when air is supplied from the air supply port 79. A circumferential groove 80 is formed on the upper (left side in FIG. 4) inner surface of the ejector pipes 70, 71 (see FIG. 5). Also, Bakyum pipe 72, 7
Above 3, there is an air inlet 81 that penetrates the pipe wall.
is provided. The air inlet 81 communicates with the outside by lowering the upper ends of the vacuum pipes 72 and 73 to the position of the circumferential groove 80 (they communicate in FIG. 5). And Bakyum pipe 7
An air outlet 82 is formed in a portion below the ejector pipes 70, 71 protruding from the ejector pipes 70, 71.
This air outlet 82 communicates with an air vent passage 83 connected to a vacuum pump. An air inlet passage 84 is provided in the fitting portions 7, 8 of the rotary heads 5, 6, and this also communicates with an air bleed passage 85 connected to a vacuum pump.

In addition, although the configuration of the present invention described above is for molding one semiconductor device or the like, it may be configured such that multiple devices can be molded at the same time by arranging a plurality of recesses 66 in parallel. .

Note that FIG. 6 is a plan view showing an example of the configuration of the entire line incorporating this device, which includes a lead frame supply section 11, a loader section 12, a tablet storage section 13, a tablet transport section 14, and a preheat section 1.
5, mold heads 3, 4, holding section 2, unloader section 19, and lead frame storage section 20 are shown. It is preferable that the entire line is installed on a pedestal A and placed in a nitrogen atmosphere sealed with a cover B covering the pedestal A.

[Effect]

The apparatus according to the present invention is installed in a line for automatically and continuously packaging semiconductor devices. Therefore, we will first explain the flow of the entire line using Figure 6.
Lead frame 1 from lead frame supply section 11
One sheet is sent out vertically in the width direction.
The sent-out lead frame 1 is transferred to the loader section 1
2 is sent to the device according to the invention. During this time, the tablet conveyance section 14 operates, picks up the tablet from the tablet storage section 13, and lifts it up.
Turn it 90 degrees and carry it onto the preheat section 15. There, the tablet is heated and formed into a boat shape in a semi-cured state. Thereafter, the tablet conveying section 14 picks up the boat again, turns it 90 degrees, and conveys it to the mold heads 3 and 4. Then, if necessary, after applying a fusing agent such as a thermosetting resin to the mating surfaces of the boat, the pair of mold heads 3 and 4 are rotated 90 degrees while adsorbing the boat.
After facing each other with the hold part 2 in between, they move close to each other. Then, the lead frame 1 is clamped from both sides, and the boat is fused and bonded to seal the semiconductor device and the like. After the sealing is completed, the motor 62 is reversed so that the mold heads 3, 4 are separated and retracted in opposite directions. At the same time, lead frame 1
advances by one pitch, and the above steps are repeated to seal the second semiconductor device from the front. Thereafter, when all the semiconductor devices and the like are sealed in the same manner, the lead frame 1 is transported by the unloader section 19 and stored in an empty magazine.

Next, the effects of the present invention will be described. When the lead frame 1 is fed into the hold section 2 from the loader section 12, the bonding plate 40 is separated from the bonding plate 39. That is, when the opening/closing cylinder 48 is retracted, the tip of the rod touches the horizontal plate 4 between the guide bars 46.
9, the opening/closing cylinder 48
itself will move in the direction of the horizontal plate 49 (to the right in FIG. 1). Along with this movement, the joining plate 40 to which the opening/closing cylinder 48 is fixed via the bracket 47 also moves and separates from the joining plate 39. When the lead frame 1 is pushed and supplied to a fixed position in this state, the opening/closing cylinder 48 is extended and the joining plate 40 is brought into contact with the joining plate 39. At this time, the pin 50 enters into the pin hole on the side edge of the lead frame, thereby positioning the lead frame 1. When the lead frame 1 is set in place in this way, it is heated to a temperature close to the tablet molding temperature.
Hot air at 180° C. is blown out from the upper and lower hot jet pipes 51 and 52 toward the lead frame 1, thereby heating the lead frame 1.

The boats housed in the recessed portions 66 of the mold heads 3, 4 are coated with a fusing agent by a dispenser as required while facing upward (the state of the mold heads 3 in FIG. 1).

When the boat is housed in the recess 66, no air is supplied from the air supply port 76, and the ejector plate 74 is pressed down by the spring 75. As a result, the upper ends of the ejector pipes 70 and 71 are
It coincides with the bottom surface of the recessed part 66. On the other hand, there is no air supply from the multiple air supply ports 79, and the ejector plate 78 is pressed down by the spring 77.
As a result, the upper ends of the vacuum pipes 72 and 73 are lowered into the circumferential groove 80, and the ejector pipe 7
0,71 upper part, circumferential groove 80, air inlet 81, inside of vacuum pipes 72, 73, air outlet 82
and an air vent passage 83 communicate with each other. In this way, when air is removed from the air removal passage 83 by the vacuum pump, the boat is sucked and firmly adsorbed within the recess 66. When the motor 69 is started in this state, the rotary heads 5 and 6 are rotated 90 degrees through the two sets of miter gears 67 and 68, and face each other with the holding part 2 in between. At that time, the boat becomes vertical, but since it is attracted as described above, the concave part 6
It will not drop out from 6. Next, motor 62
starts and circulates the synchro belt 63,
The mold heads 3 and 4 fixed thereto move toward each other, and the fitting portions 7 and 8 of the rotary heads 5 and 6 are inserted into the fitting holes 4 of the joining plates 39 and 40, respectively.
1,42. Then, packaging is completed by sandwiching the device of the lead frame 1 between the boats from both sides and joining the two boats together. The boats are joined by welding and/or welding. When the fitting parts 7 and 8 enter the fitting holes 41 and 42, the air inside is pressed;
Since there is a slight gap between the side wall of 42 and the circumferential surface of the fitting parts 7 and 8, the compressed air flows through the air inflow path 8.
4 to the air bleed passage 85. In this way, a vacuum is created around the device, and the generation of bubbles during packaging can be prevented. When air is supplied from the air supply port 79 after the joining is completed, the ejector plate 78 rises against the spring 77, causing the vacuum pipes 72 and 73 to rise. As a result, the circumferential groove 80 is closed and suction to the boat is released. Furthermore, when air is supplied from the air supply port 76 and the ejector plate 74 is pushed up against the spring 75, the upper ends of the ejector pipes 70, 71 protrude into the recessed part 66, releasing the boat from the mold. . Then, when the motor 62 rotates in the opposite direction, the fitting parts 7 and 8 come out of the fitting holes 41 and 42, move back to the original position by the opposite effect to that described above, and turn upward by 90 degrees, so that the next boat can move. Wait for supply. In the meantime, in the hold section 2, when the cam motor 56 starts and rotates the rotary plate 58,
A pair of rollers 57 attached to a rotating plate 58
moves in a circle of 180 degrees. Since each roller 57 is engaged with a deep groove 59a of the cam plate, during its circular motion, it slides while rotating within the deep groove 59a.
As a result, the cam plate 59 has one pitch, that is,
It is moved forward by the distance of the deep groove 59a. This deep groove 5
The spacing 9a is equal to the device spacing in the lead frame 1. In this way, the cam plate 59
When the is moved, the hold part 2 fixed on it
They also move together while being supported by a slide guide 55 that straddles the rail 54. Thus, the second device of lead frame 1 is located in the packaging line by mold heads 3,4. Thereafter, each time the rotating plate 58 rotates 180 degrees, the holding section 2 moves forward by one pitch. Each time, packaging is performed by the action of the mold heads 3 and 4 described above. When packaging of all devices is completed in this way, the lead frame 1 is pulled out and conveyed by the unloader section 19 adjacent to the holding section 2, and is stored in a magazine in the lead frame storage section 20. .

In the present invention, the above-described operations are performed in series and continuously.

〔Effect of the invention〕

Since the present invention is as described above, it can be easily incorporated into a manufacturing line, packaging work for semiconductor devices etc. can be performed automatically and efficiently, and manufacturing costs can be reduced because a large mold is not required. This effect is particularly suitable for high-mix, low-volume production.

[Brief explanation of drawings]

Fig. 1 is a front view of an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a side view thereof, Fig. 4 is a longitudinal sectional view showing the internal structure of the rotating head, and Fig. 5 is a longitudinal sectional view of the rotating head. FIG. 6 is a diagram showing the configuration of the ejector pipe and the vacuum pipe, and FIG. 6 is a diagram showing the layout of the entire line incorporating this device. Explanation of symbols: 2...Hold part, 3, 4...Mold head, 5, 6...Rotating head, 7, 8...
...Insertion part, 39, 40...Plug-in board, 41, 42...
...Inset hole, 45...Bridge, 51...Hot jet pipe, 61...Rail.

Claims (1)

[Claims] 1. A holding section 2 for holding and moving a lead frame, mold heads 3 disposed on both sides of the holding section 2,
4, and the holding section 2 includes a pair of bonding plates 39 and 40, one of which is stationary and the other of which is in contact with and separates from the plate to sandwich the lead frame. The side plying board 39 is connected to each of the plying boards 3
The mold heads 3, 40 are fixed on a bridge 45 which is movably installed on a rail 54 which is located below the mold heads 3, 40 and is installed in the longitudinal direction thereof. 4 rotating head 5,
A fitting hole 4 into which fitting parts 7 and 8 protruding from 6 are fitted.
1 and 42 are transparently provided, and the rotary heads 5 and 6 have a built-in boat suction mechanism for packaging, and
The mold heads 3 and 4 can be rotated in the vertical direction by 90 degrees, and can be moved toward and away from each other along a rail 61 disposed perpendicularly to the rail 54. Inset part 7,
8 are the insertion holes 4 of the bonding plates 39 and 40, respectively.
A packaging device for semiconductor devices, etc., which is configured to enter the inside of the device. 2 Into the fitting holes 41 and 42 of the plying plates 39 and 40,
A packaging apparatus for semiconductor devices and the like according to claim 1, wherein hot jet pipes 51 and 52 are provided to heat a lead frame. 3. A packaging device for semiconductor devices, etc., as set forth in claim 1, which is provided with an air release passageway extending from the fitting portions 7, 8 to the rotary heads 5, 6. 4. A packaging apparatus for semiconductor devices, etc., as set forth in claim 1, which is installed in a sealed nitrogen gas atmosphere.