JPH0361349U - - Google Patents
Info
- Publication number
- JPH0361349U JPH0361349U JP12090189U JP12090189U JPH0361349U JP H0361349 U JPH0361349 U JP H0361349U JP 12090189 U JP12090189 U JP 12090189U JP 12090189 U JP12090189 U JP 12090189U JP H0361349 U JPH0361349 U JP H0361349U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- nozzle
- cooling fluid
- block
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012809 cooling fluid Substances 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、本考案の実施例を示す図であり、第
２図は、第１図の要部拡大図であり、第３図は、
第２図の変形例を示す図である。第４図は、従来
の構造を示す図である。
図において、３……モジユール、３ａ……ブロ
ツク、４……基板、５……ＬＳＩ、７……フイン
、７ａ……ブロツク、８……ノズル、９……浸漬
液、をそれぞれ示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is an enlarged view of the main part of Fig. 1, and Fig. 3 is a diagram showing an embodiment of the present invention.
FIG. 3 is a diagram showing a modification of FIG. 2; FIG. 4 is a diagram showing a conventional structure. In the figure, 3...module, 3a...block, 4...substrate, 5...LSI, 7...fin, 7a...block, 8...nozzle, 9...immersion liquid, respectively.
Claims (1)
該ＬＳＩ５の実装位置に対応して該冷却液９を噴
射してなるノズル８を有するモジユール３と、 からなる冷却構造に於いて、 上記ＬＳＩ５の実装領域内で、且つ上記ノズル
８を中心として同心円状に突出してなるブロツク
３ａを上記モジユール３に形成し、 該ＬＳＩ５を中心として同心円状に突出してな
るブロツク７ａを有するフイン７を該ＬＳＩ５上
に形成し、 該ブロツク３ａと、該ブロツク７ａとが互い違
いに噛み合うように位置合わせされてなることを
特徴とする冷却構造。[Claims for Utility Model Registration] A circuit board 4, an LSI 5 mounted on the board 4, and a cooling fluid passage 10 through which a cooling fluid 9 flows, and the cooling fluid is connected to the mounting position of the LSI 5. a module 3 having a nozzle 8 formed by injecting a nozzle 9; and a block 3a concentrically protruding within the mounting area of the LSI 5 and centered around the nozzle 8 to the module 3; A fin 7 having a block 7a concentrically protruding from the LSI 5 is formed on the LSI 5, and the blocks 3a and 7a are aligned so as to mesh alternately. Features a cooling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090189U JPH0361349U (en) | 1989-10-18 | 1989-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090189U JPH0361349U (en) | 1989-10-18 | 1989-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361349U true JPH0361349U (en) | 1991-06-17 |
Family
ID=31668951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12090189U Pending JPH0361349U (en) | 1989-10-18 | 1989-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361349U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021099770A1 (en) * | 2019-11-18 | 2021-05-27 | Iceotope Group Limited | Heat sink for liquid cooling |
| JP2024014595A (en) * | 2022-07-22 | 2024-02-01 | 三菱重工業株式会社 | liquid immersion cooling device |
-
1989
- 1989-10-18 JP JP12090189U patent/JPH0361349U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021099770A1 (en) * | 2019-11-18 | 2021-05-27 | Iceotope Group Limited | Heat sink for liquid cooling |
| JP2023503012A (en) * | 2019-11-18 | 2023-01-26 | アイスオトープ・グループ・リミテッド | heatsink for liquid cooling |
| US11917796B2 (en) | 2019-11-18 | 2024-02-27 | Iceotope Group Limited | Heat sink for liquid cooling |
| JP2024014595A (en) * | 2022-07-22 | 2024-02-01 | 三菱重工業株式会社 | liquid immersion cooling device |
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