JPH0361350U - - Google Patents
Info
- Publication number
- JPH0361350U JPH0361350U JP1989120902U JP12090289U JPH0361350U JP H0361350 U JPH0361350 U JP H0361350U JP 1989120902 U JP1989120902 U JP 1989120902U JP 12090289 U JP12090289 U JP 12090289U JP H0361350 U JPH0361350 U JP H0361350U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- coolant
- path
- recovery
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、本考案の実施例を示す図であり、第
２図は、本考案のモジユール分解斜視図であり、
第３図は、従来の全体構造を示す図であり、第４
図は、従来のモジユール一部断面斜視図である。
図において、１……モジユール、２……プレー
ト、３……第１の板、４……第２の板、５……ノ
ズル、６……回収孔、８……ミゾ、８ａ……供給
路、８ｂ……回収路、９……基板、１０……ＬＳ
Ｉ、１６……シリンダ、をそれぞれ示す。
FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is an exploded perspective view of a module of the present invention.
FIG. 3 is a diagram showing the conventional overall structure, and the fourth
The figure is a partially sectional perspective view of a conventional module. In the figure, 1...module, 2...plate, 3...first plate, 4...second plate, 5...nozzle, 6...recovery hole, 8...groove, 8a...supply channel , 8b... Recovery path, 9... Board, 10... LS
I, 16... cylinders are shown respectively.
Claims (1)
基板４に実装されたＬＳＩ５の実装位置に対応し
て冷却液を噴射するノズル７を有する冷却モジユ
ール構造に於いて、 冷却液を供給する供給路８ａおよび回収する回
収路８ｂが形成されたプレート２と、 該供給路８ａに対応して形成されたノズル５お
よび該回収路８ｂに対応して設けられた回収孔６
が一対に設けられた第１の板３と、 該一対のノズル５および回収孔８に対応して穿
孔されるシリンダ１６が形成された第２の板４と
、 から構成されることを特徴とする冷却モジユール
構造。[Claims for Utility Model Registration] In addition to forming the flow path 8 in which the cooling liquid circulates,
In a cooling module structure having a nozzle 7 that injects a coolant in accordance with the mounting position of an LSI 5 mounted on a substrate 4, a plate 2 is provided with a supply path 8a for supplying the coolant and a recovery path 8b for recovering the coolant. and a nozzle 5 formed corresponding to the supply path 8a and a recovery hole 6 formed corresponding to the recovery path 8b.
It is characterized by being composed of a first plate 3 provided in a pair, and a second plate 4 in which a cylinder 16 is formed to correspond to the pair of nozzles 5 and the recovery hole 8. Cooling module structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989120902U JPH0361350U (en) | 1989-10-18 | 1989-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989120902U JPH0361350U (en) | 1989-10-18 | 1989-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361350U true JPH0361350U (en) | 1991-06-17 |
Family
ID=31668952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989120902U Pending JPH0361350U (en) | 1989-10-18 | 1989-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361350U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008042132A (en) * | 2006-08-10 | 2008-02-21 | Yokogawa Electric Corp | Cooling system |
-
1989
- 1989-10-18 JP JP1989120902U patent/JPH0361350U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008042132A (en) * | 2006-08-10 | 2008-02-21 | Yokogawa Electric Corp | Cooling system |
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