JPH0361357A - Evaporating source and vapor deposition device using this device - Google Patents

Abstract

PURPOSE:To provide the evaporating source which is improved in the capacity to make vapor deposition treatment per equipment installation surface and the vapor deposition device for which this source is used by providing a supporting member which is supported freely tiltably to a mounting base and is fixed in a prescribed posture and a holding hearth which positions and holds a sublimatable material for vapor deposition to this supporting member. CONSTITUTION:The supporting plate 22 is set at an arbitrary tilting angle theta by a tilting and supporting mechanism in order to operate the evaporating source 20. The holding hearth 30 is eventually obliquely disposed according to the tilting posture of the plate 22 at this tim, but a material pellet 35 is solid and is surely held by the hearth and, therefore, there is no possibility that the pellet 35 deviates in position from the hearth 30. The pellet 35 evaporates successively with the direction orthogonal with the tilting posture of the plate 22 as an evaporation direction S when the pellet 35 existing in the specific position P of the heath 30 is irradiated with an electron beam Bm from an electron gun unit 40. Since the hearth 30 rotates intermittently in an arrow (m) direction the fresh pellets 35 are successively supplied to the position P and the continuous vapor deposition treatment is executed until all of 6 pieces of the pellets 35 are consumed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an evaporation source that evaporates a deposition material by irradiation with an electron or ion beam, and a evaporation apparatus using the same, and particularly relates to an evaporation device that expands the installation area. The present invention relates to a new type of evaporation source that is extremely effective in improving the productivity of forming thin films on objects, and to a vapor deposition apparatus using the same.

[Conventional technology]

In a conventional vapor deposition apparatus, for example, as shown in FIG. 13, a hearth 102 serving as an evaporation source containing vapor deposition material M is disposed at the center bottom of a vacuum chamber 101, and the vapor deposition material M in the hearth 102 is On the other hand, electron beam B
For example, a pair of electron guns 103 are arranged to be irradiated with electron beam Bm, while a plurality of substrates 104 as thin film formation targets are arranged above the vacuum chamber 101, and the evaporation material M is evaporated by the electron beam Bm. , one in which a vapor deposition material M is attached to the surface of the substrate 104 is known (
Agne Co., Ltd.'s "Vacuum Technology" by Siegfried Schiller and Ulrich Heisig [translated by Japan Vacuum Technology Co., Ltd.]
(See pages 50-51).

In FIG. 13, reference numeral 105 is a deflection electrode for guiding the electron beam Bm from the electron gun 1.03 toward the vapor deposition material M in the hearth 102.

[Problem to be solved by the invention]

Incidentally, the hearth 102 as an evaporation source used in a conventional vapor deposition apparatus was designed mainly assuming a meltable vapor deposition material M, and had a so-called crucible-type receiving structure, so that the arrangement posture of the hearth 102 was horizontal. limited to direction,
Inevitably, the region to which the vapor deposition material M can be deposited is restricted vertically upward.

Therefore, when depositing a film on a plurality of substrates 104, it is necessary to arrange the plurality of substrates 104 vertically above the hearth 102 within a range where the deposition conditions are uniform. When the substrate 104 itself becomes larger, it is difficult to secure a space for placing the substrate 104 unless the installation area of the vacuum chamber 101 itself is expanded, and the processing capacity per installation area of the vacuum chamber 101 becomes smaller. That had reached a plateau.

The present invention has been made in view of the above-mentioned technical problems, and provides an evaporation source that makes it possible to improve the evaporation processing capacity per installation area of equipment, and a evaporation apparatus using the same. be.

[Means to solve the problem]

That is, the evaporation source according to the present invention focuses on a sublimable evaporation material, and is attached to a support member that is tiltably supported with respect to a base and fixed in a predetermined posture, and a sublimable evaporation source attached to this support member. The apparatus is characterized by comprising a holding hearth in which the vapor deposition material is positioned and held.

Further, the vapor deposition apparatus according to the present invention includes a vacuum chamber, an evaporation source having the above-described structure arranged in the center of the vacuum chamber, and an electron or ion beam directed toward the sublimable evaporation material held in the evaporation source. a beam gun that irradiates the evaporation source, a thin film formation object holding means that is provided surrounding the evaporation source and holds a number of thin film formation objects substantially vertically in a removable manner; The present invention is characterized by comprising a rotation drive means for relatively rotating the object holding means.

In such technical means, the sublimable evaporation material used in the evaporation source can be appropriately selected depending on the application, including tin-doped indium oxide (ITO).

Further, the support structure for the support member may be modified in design as long as the support member is supported by a tilt support mechanism that is freely tiltable, and the support member can be restrained at any position.

Furthermore, the holding hearth can hold the vapor deposition material so that its position does not shift according to the tilted posture of the support member, and in addition, cooling water or electric current can be introduced to maintain the evaporation conditions of the vapor deposition material. If possible, the design may be changed as appropriate.

In addition, from the viewpoint of realizing continuous vapor deposition for a long time by increasing the amount of the vapor deposition material charged, the holding hearth structure includes a rotatable rotary nozzle 1 having a receiving portion for the sublimable vapor deposition material on the surface portion. It is preferable to use one consisting of a rotating hearth main body and a material holder for holding a sublimable vapor deposition material positioned in a receiving part of the rotating hearth main body. In this case, the rotating hearth body may be rotated continuously so as to sequentially consume the entire ring-shaped vapor deposition material, considering the evaporation rate of the vapor deposition material, or may be rotated continuously so as to sequentially consume the entire ring-shaped vapor deposition material. When unit vapor deposition materials are individually arranged, the rotation may be intermittently so that each unit vapor deposition material is sequentially consumed.

Furthermore, in the invention of a vapor deposition apparatus using such an evaporation source, if the vacuum chamber is designed to allow the thin film formation target to be taken in and taken out and to maintain a desired degree of vacuum, You may change the design as appropriate.

In addition, the number of evaporation sources installed in the vacuum chamber does not necessarily have to be one; if the adhesion treatment area is expanded in the vertical direction, multiple evaporation sources can be installed in the vertical direction. It is preferable to design the

Furthermore, regarding the placement position of the beam gun, as the inclination position of the support member changes, the beam irradiation position on the evaporation material held in the holding hearth also changes, so the beam gun and the holding nozzle change. The beam gun may be fixedly disposed on the support member so that the relative position of the beam gun does not change, or the beam gun may be designed to change its tilted attitude or beam trajectory in accordance with the tilted position of the support member. is necessary.

Further, as a holding means for a thin film forming object, it may be manufactured in advance exclusively for a thin film forming object of a predetermined size.
From the viewpoint of increasing versatility as a vapor deposition apparatus, the drum-shaped attachment provided surrounding the evaporation source as a thin film forming object holding means is attached to the frame, and this drum-shaped attachment is attached to the frame in the circumferential direction. Designed to accommodate thin film formation objects of various sizes, such as having an object holder in which a predetermined number of thin film formation objects are removably arranged in the vertical direction. It is preferable.

In this case, from the viewpoint of further increasing the versatility of the object holder, it is possible to variably set the thin film formation object holding area of the object holder according to the vertical dimension or width direction dimension of the thin film formation object. It is preferable to design it as follows.

Furthermore, the rotation driving means rotates at least one of the thin film formation object holding means and the evaporation source at a predetermined speed so that the vapor deposition material evaporated from the evaporation source uniformly adheres to the surrounding thin film formation object. As long as it is designed to do so, the design can be changed as appropriate.

[Effect]

In the above-mentioned technical means, since the evaporation source holds the sublimable vapor deposition material at an arbitrary inclination angle, the main direction of evaporation of the vapor deposition material can be arbitrarily set without being constrained to the vertical direction. be able to.

In addition, in the above vapor deposition apparatus, the main direction of evaporation of the sublimable vapor deposition material from the evaporation source is set in advance in an arbitrary direction toward the side of the vacuum chamber, and the rotational drive means is directed toward the evaporation source to form a thin film. Since the object holding means is relatively rotated, the evaporation material evaporated from the evaporation source is directed to the entire area around the evaporation source centered on the main evaporation direction, and is uniformly deposited on the surface of the thin film formation object.

〔Example〕

Hereinafter, the present invention will be described in detail based on embodiments shown in the accompanying drawings.

FIGS. 1 and 2 show an embodiment of a vapor deposition apparatus to which the present invention is applied.

In the same figure, reference numeral 1 denotes a vacuum channel, 20 (specifically 20a, 20b) evaporation sources disposed in a pair above and below in the vertical direction of the central part of the vacuum channel, 40 (specifically 40a, 20b), 40b) is the evaporation material M(
In this example, tin-doped indium oxide [:ITO])
An electron gun unit 50 irradiates an electron beam to a substrate holding device 90 that holds a substrate G on which a thin film is to be formed.
is a rotational drive device that rotates the substrate holding device 50.

In this embodiment, a vacuum chamber 1 is installed on a pedestal 2, and a cylindrical chamber body 3 whose top and bottom are closed.
Door openings 4 and 5 are respectively opened in opposing parts of the peripheral wall of , an opening/closing door 6.7 is attached to each door opening 4, 5 so as to be openable and closable, and each opening/closing door 6.7 is opened. The structure is such that a substrate G on which a thin film is to be formed can be taken in and out of the vacuum channel 1. Further, a vacuum pump IO is connected to the bottom wall of the chamber body 2 through a high vacuum gate valve 9, and a roughing pump unit t-12 is connected to the vacuum pump IO through a communication pipe 11. It is connected. Furthermore, a back heater 13 is provided throughout the inner circumferential wall of the vacuum chamber 1, and heats the substrate G placed around the vacuum chamber 1 to a predetermined temperature to deposit tin-doped indium oxide, which is the evaporation material M. It is designed to maintain the adhesion of ITO).

In addition, the lower evaporation source 20a is mounted on the lower side using a bracket 21.
(specifically 21a) is installed at the bottom of the vacuum chamber 1, while the upper evaporator #20a is installed at the top of the vacuum chamber l via a bracket 21 (specifically 21b). Supported by hanging.

In this embodiment, the evaporation source 20 is particularly shown in FIG. 3(a).
As shown in (b), the above-mentioned installation includes a support plate 22 tiltably supported by a bracket 21, and a holding hearth 3 for holding the vapor deposition material M disposed on the support plate 22.
0.

To be more specific, the support structure of the support plate 22 is such that a pair of support brackets 23 are installed upright on the bracket 21, and
A pair of hollow rotary shafts 24 (specifically, 24a and 24b) are rotatably supported via a bearing member 26, and a pair of protruding pieces 2 are provided on both sides of the support plate 22.
5 is provided protrudingly, and the rotary shaft 24 is fixed to this protruding piece 25, and furthermore, the output shaft of a pulse motor 28 as an actuator is connected to one end of the rotary shaft 24 via a rotation angle adjustment mechanism 27. The pulse motor 28 is appropriately rotated based on positional information specified on a control panel (not shown), and the tilt attitude of the support plate 22 is set to a desired one.

In this embodiment, the rotation angle adjustment mechanism 27 is mounted on a vertically extending drive shaft 201 rotated by the output shaft of a pulse motor 28 fixed to the bracket 21, as shown in FIG. 3(b). , a transmission shaft 203 that transmits the rotation of this drive shaft 201 in a substantially horizontal direction via a bevel gear 202, and this transmission shaft 20.
a transmission gear 2 that transmits the rotation of No. 3 to the rotating shaft 24;
04. Incidentally, reference numeral 205 is a bearing member that rotationally supports the transmission shaft 203.

The holding hearth 30 also has a rotating shaft 3 on the surface side of the support plate 22, as shown in FIGS. 3 and 4.
1, and a plurality of circular material receiving parts 34 attached to the surface of the rotary hearth main body 32 and arranged at predetermined angular intervals in the circumferential direction, for example, six A clamp ring 3 is fixed to the base plate 33 with screws 37 in order to restrain and hold the individually formed base plate 33 and the disc-shaped material pellets 35 which are the vapor deposition material M bonded to each material receiving part 34.
6. Note that the reference numeral 39 is a cover that covers the material pallet 35 other than the portion to be vapor-deposited.

In this embodiment, the rotating shaft body 31 is connected to the support plate 2
The pulse motor 301 is connected to the output shaft of a pulse motor 301 as an actuator through a rotation support mechanism 300 provided on the back side of the 2, and the pulse motor 301 rotates the material pellets 35 at predetermined time intervals (in this embodiment, the material pellets 35 are The material pellets 35 are intermittently rotated by the rotation angle between the material pellets 35 in sufficient time to be consumed by the electron beam.

The rotation support mechanism 300 is mounted, for example, on a drive shaft 30 extending in the vertical direction that is rotated by the output shaft of the pulse motor 301 fixed to the bracket 21.
2, the rotation of this drive shaft 302 is controlled by the bevel gear 30.
3, and is rotatably supported in the hollow portion of the one rotary shaft 24a via a bearing member 304, and a first transmission shaft 305 that is approximately parallel to the first transmission shaft 305. A second transmission shaft 307 is arranged and rotatably supported via a bearing member 306 fixed to the support plate 22, and a belt consisting of a pulley and a belt that transmits driving force from the first transmission shaft 305 to the second transmission shaft 307. a transmission system 308 and a bevel gear 3 that transmits the rotation of the second transmission shaft 307 to the rotating shaft body 31;
09.

Further, a cooling water channel (not shown) into which cooling water is introduced is formed in the rotating hearth main body 32, and cooling water from a cooling water supply device 320 is supplied to this cooling water channel. ing.

In this embodiment, the cooling water supply device 320 includes a hearth cooling water supply section 3 fixed to the bracket 21.
21, and a cooling device that guides the cooling water from the hearth cooling water supply section 321 from the center of the rotating shaft body 31 to the cooling channel through the hollow part of the rotating shaft 24b on the side where the rotational support mechanism 300 is not provided. It includes a water introduction pipe 322 and a cooling water discharge pipe 323 that returns water from the cooling water channel to the cooling water supply section 321 from the center of the rotating shaft body 31 through the hollow part of the rotating shaft 24b.

Furthermore, the rotating hearth main body 32 is connected to the vacuum chamber 1 via a power supply harness (not shown).

Furthermore, in this embodiment, the electronic gun unit 4
0 is fixed to the other side of the surface of the support plate 22, and an electron gun 42 that irradiates the electron beam Bm into the unit case 4I and an electron beam Bm from the electron gun 42.
A deflection electrode 43 that is deflected by a predetermined angle (270° in this embodiment) is housed. And electronic gun 42
After being deflected by the deflection electrode 42, the electron beam Bm is led out to the outside through the beam aperture 44 of the unit case 41, and is irradiated onto the material pellet 35 located at a specific position on the holding hearth 3o. It has become. still,
In FIG. 3(b), reference numeral 45 is a harness for supplying power to the electron gun unit 4o.

Further, as shown in FIGS. 1 and 2, the substrate holding device 5o has a drum-shaped attachment disposed around the vacuum chamber 1 that is attached to a frame 51, and this attachment is detachably attached to a frame 5I. It is composed of a plurality of substrate holders 60.

In this embodiment, as shown in FIG. 5, the frame 51 has an upper ring 52 disposed above the vacuum chamber 1 and a lower ring 53 disposed below the vacuum chamber 1. and a plurality of connecting bars 54 connecting the upper ring 52 and the lower ring 53,
It is fixed onto a rotational drive ring 55 via a plurality of connection supports 56 .

The rotation drive ring 55 has a plurality of guide rollers 57 projecting downward, and the guide rollers 57 are slidably moved along a ring-shaped guide rail 58 provided at the bottom of the vacuum chamber l. By doing so, rotational operation is possible.

On the other hand, as shown in FIGS. 1, 2, and 6, the substrate holders 60 are mounted in a predetermined number (15 in this embodiment) along the circumference of the frame 51, and Several (three in this embodiment) substrates G are held in a substantially vertical posture.

To be more specific, the substrate holder 6 according to this embodiment
0, as shown in FIGS. 7 to 9, a pair of holder vertical frames 61.62 extending vertically along both sides of the substrate G in the width direction, and the holder vertical frames 61.62.
It is provided with a plurality of (five in this embodiment) holder horizontal frames 71 to 75 which are installed with screws 65 between them.

A large number of mounting holes 63 for the holder horizontal frames 71 to 75 are provided in the holder vertical frame 61.62 in consideration of various substrate G sizes, and approximately at the vertical center of the holder vertical frame 61.62. A handle 64 is provided for carrying.

Further, a locking hook 76 is welded to approximately the center of the uppermost holder horizontal frame 71, and the locking hook 76 is attached to and released from the upper ring 52 of the frame 51.
A positioning guide 59 for positioning the locking hook 7G is provided at a position corresponding to the mounting position of each substrate holder 60.

Further, first holder clampers 77 are provided on both sides of the lower edge of the uppermost holder horizontal frame 71, and second holder clampers 78 are provided on the second and third holder horizontal frames 72 and 73. A third holder clamper 79 is fixed to the fourth stage holder horizontal frame 74 with screws 80, respectively. In this embodiment, the lowermost holder horizontal frame 75 is not provided with a holder clamper due to the vertical dimension of the substrate G to be attached.

In this embodiment, the first holder clamper 77 is attached to a base 81 by fixing a hook-shaped clamp plate spring 82 to which the upper edge of the board G is fixed with a screw 80.
In addition, the second holder clamper 78 is installed by recessing a holding groove 83 on the upper edge of the base 81 to which the lower edge of the board G is locked, and when installed, the upper edge of the board G is locked to the base 81. Furthermore, the third holder clamper 79 is installed by recessing a holding groove 83 into which the lower edge of the board G is locked on the upper edge of the base. It was established.

Further, the rotation drive device 90 is connected to a rotation drive motor 91 disposed at the bottom of the vacuum chamber 1 and a rotation shaft 92 of the rotation drive motor 91, as shown in FIGS. 2 and 5 in particular. It is composed of a pinion gear 93 and a rack 94 carved on the inner peripheral edge of the rotary drive ring 55 and with which the pinion gear 93 meshes.

Next, the operation of the evaporation source and vapor deposition apparatus according to this embodiment will be explained.

First, the operation of the evaporation source 20 will be described. As shown in FIG. 3, the support plate 22 is set to an arbitrary tilt attitude (tilt angle θ) by a tilt support mechanism not shown.

At this time, the holding hearth 30 is also attached to the supporting plate 22.
However, since the material pellets 35 are solid and are securely held in the holding hearth 30, there is no possibility that the material pellets 35 may fall out of the holding hearth 30 or be misaligned. There is no concern that this will happen. When the electron beam Bm from the electron gun unit 40 is irradiated onto the material pellet 35 at a specific position P of the holding hearth 30, the material pellet 35 mainly evaporates in the direction perpendicular to the tilted attitude of the support plate 22. It evaporates sequentially in direction S.

Further, since the holding hearth 30 intermittently rotates in the direction of arrow m, new material pellets 35 are sequentially supplied to the electron beam irradiation position P, and all six material pellets 35 are consumed. A continuous deposition process can be performed until the process is completed.

Next, to describe the operation of the vapor deposition apparatus, for example, the first
As shown in the figure, as an initial setting condition, the lower evaporation source 20
The tilt posture of the support plate 22 of a is set to the tilt angle θl, and the area A1 corresponding to the lower area of the substrate holder 60 is selected as the adherable area A1 of the evaporation material M evaporated from the holding hearth 30, while the upper evaporation source The tilt posture of the support plate 22 of 20b is set to a tilt angle θ2, and an area corresponding to the upper area of the substrate holder 60 is selected as the adhesion area A2 of the vapor deposition material M evaporated from the holding hearth 30.

With such initial settings made, the inside of the vacuum chamber l is opened, and the substrate holding device 5o is attached to the frame 5.
After setting the substrate holder 60 holding the substrate G in advance on the vacuum chamber 1, the inside of the vacuum chamber 1 is adjusted to a predetermined vacuum environment.

Thereafter, the pair of evaporation sources 20a and 20b perform the evaporation operation of the evaporation material M, and the rotation drive device 90
When the substrate holding device 50 is rotated in the direction of the arrow n, the evaporation materials M from the evaporators 1120a and 20b are evaporated toward adhesion areas AI and A2, respectively, and are not held by the substrate holding device 50. All of the substrates G that are present are in the attachable area A1. Since it passes through A2, the substrate G held by each substrate holder 60 of the substrate holding device 50 is uniformly adhered with the vapor deposition material M.

Furthermore, since the substrate holding device 50 utilizes the side space within the vacuum chamber l as a space for arranging the substrates G in the vertical direction, even if the number of substrates G to be attached increases, the number of substrates G The staff space does not expand in the horizontal direction, and the situation where the equipment installation area increases unnecessarily is effectively avoided.

Furthermore, in this embodiment, since the amount of vapor deposition material M charged at one time can be sufficiently increased, the continuous vapor deposition time can be made sufficiently long, and thick film vapor deposition can be realized.

It should be noted that the design of each component in the above embodiments may be changed as appropriate within the scope of realizing the basic functions. For example, as a modification of the holding hearth 30, as shown in FIG. A ring-shaped material pellet 35' is accommodated, and the outer peripheral edge of this material pellet 35' is restrained and held by a clamp ring 36°, and the material pellet 35' is
The inner circumferential edge of the holder may be restrained and held by a disk-shaped clamp plate 38.

In this case, since the material pellets 35' are continuously exposed in a ring shape, it is possible to continuously rotate the rotating hearth main body 32 to sequentially consume the material pellets 35' as a whole. can.

Further, in the above embodiment, pulse motors 28 and 3 are used as actuators for tilting the support plate 22 or rotating the holding hearth by 3 degrees.
01 is disposed in the vacuum chamber 1, but the present invention is not limited to this. For example, as shown in FIG. 12, a through hole 210 (330) is provided in the wall of the vacuum chamber 1,
Vacuum chamber 1 corresponding to this through hole 210 (330)
Install the pulse motor 28 (301) in the outside atmosphere of
The pulse motor 28 (
The output shaft 211 (33I) from 301) is inserted through the vacuum seal member 212 (332), and the output shaft 21
1 (331) to the universal shaft 21
3 (333).

Bevel gear 214 (334), transmission shaft 215 (3
35) etc. via the support plate 22. It may also be transmitted to the holding hearth 33.

In this case, a pulse motor 28 as an actuator,
Regarding 301, since there is no need to use a vacuum one,
The actuator can be made inexpensive.

〔Effect of the invention〕

As explained above, according to the evaporation source according to claims 1 and 2, the main direction of evaporation of the sublimable evaporation material can be set in any direction, so that the thin film formation object can be arranged easily. The side space of the vacuum chamber can be effectively utilized without being restricted by the space vertically above the vacuum chamber.

In particular, according to the evaporation source according to claim 2, the so-called crucible saint, in which the amount of evaporation material charged at one time is limited by the capacity of the saucer, is more difficult to charge at one time than the evaporation source with a tray configuration. Since the amount can be increased, continuous deposition over a long period of time can be realized.

Further, according to the vapor deposition apparatus according to any one of claims 3 to 6, it becomes possible to use the entire lateral space in the vacuum chamber located around the evaporation source as a space for arranging the thin film forming object. Therefore, even if the thin film forming target becomes larger, it is possible to uniformly adhere a large number of thin film forming targets without unnecessarily expanding the equipment installation space. The vapor deposition processing capacity can be increased compared to conventional methods.

Furthermore, according to the vapor deposition apparatus according to the fourth aspect, since a plurality of evaporation sources are arranged in the vertical direction, it is possible to set a different adhesion possible area for each evaporation source. Therefore, the adhesion possible area based on the evaporation source can be expanded in the vertical direction without increasing the equipment installation area.

Further, according to the vapor deposition apparatus according to claim 5, the thin film forming object holding means has a structure in which a predetermined number of object holders can be freely engaged and detached from a ring-shaped frame provided in the vacuum chamber. Therefore, if you prepare object holders that are compatible with various sizes of thin film forming objects in advance,
The vapor deposition apparatus can be used universally for thin film formation targets of various sizes.

In particular, according to the vapor deposition apparatus according to claim 6, changes in the dimensions of the thin film forming target in the vertical direction can be absorbed by one target holder, thereby increasing the versatility of the target holder. be able to.

[Brief explanation of drawings]

FIG. 1 is a perspective explanatory view showing a schematic configuration of an embodiment of an evaporation source and a vapor deposition apparatus using the same according to the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG. )(b) is a partially cutaway front explanatory view and a partially cutaway plan view showing details of the evaporation source used in the example, FIG. 4 is a perspective view showing details of the holding hearth used in the example, and FIG. The figure shows details of the ring-shaped frame and rotational drive means of the substrate holding means used in the example, taken in the direction of the arrow V in FIG. 2, and FIG. 6 shows the arrangement positional relationship of the substrate holder used in the example. Fig. 7 is a perspective view showing the details of the substrate holder; Fig. 8 is a view taken from the direction x in Fig. 7;
The figures are a sectional view taken along the line IX-IX in FIG. 7, FIG. 10 is an explanatory diagram showing the operating state of the vapor deposition apparatus according to the embodiment, FIG. FIG. 12 is a schematic diagram showing a modification of the drive system for tilting the support plate 22 or rotating the holding hearth 30 used in the embodiment, and FIG. 13 is an explanatory diagram showing an example of a conventional vapor deposition apparatus. It is. [Explanation of symbols] M... Vapor deposition material Bm... Electron beam... Vacuum chamber 20... Evaporation source 21... Mounted on bracket 22... Support plate 30... Holding hearth 32... Rotating hearth main body 3.1... Material receiving part 36.36'... Clamp ring 38... Clamp plate 42... Electronic gun 50... Board holding device 51... Frame 60...・Substrate holder 61, 62...Holder vertical frame E to 75...Holder horizontal frame 6...Locking hooker to 79...Holder clamper 0...Rotation drive device

Claims (1)

[Scope of Claims] 1) An evaporation source (20) holding a vapor deposition material (M) to be evaporated by irradiation with an electron or ion beam, which is tiltably supported with respect to a mounting base (21) and has a predetermined position. A support member (22) that is fixed in a posture, and a support member (22) that is fixed in a posture.
22) and a holding hearth (30) in which the sublimable vapor deposition material (M) is positioned and held. 2) In the device according to claim 1, the holding hearth (30) is provided with a receiving part (34, 34') for the sublimable vapor deposition material (M) on the surface thereof, and has a rotating part that rotates continuously or intermittently. Consisting of a hearth body (32) and a material holder (36, 36', 38) that holds the sublimable vapor deposition material (M) positioned in the receiving part (34, 34') of the rotating hearth body (32). An evaporation source characterized by: 3) a vacuum chamber (1); an evaporation source (20) according to claim 1 or 2 disposed in the center of the vacuum chamber (1);
a beam gun (42) that irradiates an electron or ion beam (Bm) to the sublimable evaporation material (M) held in the evaporation source (20); (G) is removably held substantially vertically (50); and the evaporation source (2).
1. A vapor deposition apparatus comprising: a rotational drive means (90) for rotating a thin film forming object holding means (50) relative to 0). 4) The vapor deposition apparatus according to claim 3, wherein a plurality of evaporation sources (20) are arranged in the vertical direction. 5) In the device according to claim 3 or 4, the thin film forming object holding means (50) includes a drum-shaped mounting frame (51) provided surrounding the evaporation source (20), and this drum-shaped mounting frame. A predetermined number of object holders (60) are disposed so as to be freely engageable and detachable in the circumferential direction of the object holder (51), and a predetermined number of thin film forming objects (G) are removably held in the vertical direction. A vapor deposition apparatus characterized by: 6) In the product according to claim 5, the object holder (60) includes a pair of holder vertical frames (6) extending along both sides in the width direction of the thin film forming object (G).
1, 62) and a plurality of holder horizontal frames (61, 62), which are provided with holder clampers (77, 78, 79) that are installed between the holder vertical frames (61, 62) and hold the upper and lower ends of the thin film forming object (G). a frame (71, 72, 73, 74, 75), and the holder horizontal frame (71, 72, 73, 74, 75) according to the vertical dimension of the thin film forming object (G).
A vapor deposition apparatus characterized in that the position can be adjusted by moving along a holder vertical frame (61, 62).