JPH0361884B2 - - Google Patents
Info
- Publication number
- JPH0361884B2 JPH0361884B2 JP5422483A JP5422483A JPH0361884B2 JP H0361884 B2 JPH0361884 B2 JP H0361884B2 JP 5422483 A JP5422483 A JP 5422483A JP 5422483 A JP5422483 A JP 5422483A JP H0361884 B2 JPH0361884 B2 JP H0361884B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- hole
- mask
- base material
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明は基材内のスルーホールの欠陥を検知す
る方法に係り、特に前記スルーホールの欠陥から
の透過光のコントラストを向上させ検知するスル
ーホール検査方法に関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a method for detecting defects in through-holes in a substrate, and particularly to a method for detecting defects in through-holes by improving the contrast of transmitted light from defects in the through-holes. Concerning hole inspection method.
(2) 技術の背景
近年、プリント基板等が実装密度を上げる為多
層基板と成り、その製造技術の向上と共に信頼性
の上からも検査技術の高度化が要望されている。
このプリント基板に設けられているスルーホール
の検査はスルーホールの中の欠陥を発見するもの
で有る。即ちこれはプリント基板に嵌通孔をあ
け、その中にメツキ液を入れ半田メツキ等を施す
時、スルーホールが細長い為、メツキ液が入らず
スルーホールに欠陥を生じる事による為に必要な
ものである。従つてこのプリント基板のスルーホ
ールの検査は製品の信頼性上欠かせないものであ
る。(2) Background of the technology In recent years, printed circuit boards and the like have become multilayer boards to increase packaging density, and as well as improvements in manufacturing technology, there is a demand for more sophisticated inspection technology in order to improve reliability.
This inspection of the through holes provided in the printed circuit board is to discover defects within the through holes. In other words, this is necessary because when a through hole is drilled in a printed circuit board and a plating liquid is poured into the hole to perform solder plating, etc., the through hole is long and narrow, and the plating liquid does not enter, causing defects in the through hole. It is. Therefore, inspection of the through holes of printed circuit boards is essential for product reliability.
(3) 従来技術と問題点
従来、前述のスルーホールの検査は目視により
行なわれていたが多層プリント基板でスルーホー
ルが細長くなり目視では無理が生じ、而も検査出
来る数も限られる欠点を有していた。更に、上述
の欠点を踏まえて自動的に検査する方法がある。
この方法は被検査体のスルーホールに遮光マスク
を設け、マスク以外からの照射光がスルーホール
の欠陥から透過するのを検知するものである。然
し乍ら、被検査体のスルーホールの欠陥が小さい
と透過する光量が少なく、高速で検査するにはス
ルーホールとマスクを僅かに離さなければなら
ず、その隙間から漏れた光とコントラストがつか
ず、区別が出来ない為に正確な検査が不可能にな
る欠点を有していた。(3) Prior art and problems Conventionally, the inspection of the above-mentioned through-holes was carried out visually, but the through-holes in multilayer printed circuit boards become long and thin, making it difficult to visually inspect them, and there is also the drawback that the number that can be inspected is limited. Was. Furthermore, there are automatic inspection methods that take into account the above-mentioned drawbacks.
In this method, a light-shielding mask is provided in a through-hole of an object to be inspected, and the transmission of light from a source other than the mask through a defect in the through-hole is detected. However, if the defects in the through-holes of the object to be inspected are small, the amount of light that passes through is small, and in order to perform high-speed inspection, the through-holes and the mask must be separated slightly, and there is no contrast with the light leaking through the gap. It has the disadvantage that accurate inspection is impossible because it cannot be distinguished.
(4) 発明の目的
本発明は上記従来の欠点に鑑み、被検査体のス
ルーホールの欠陥からの透過光と前述スルーホー
ルとマスクの隙間から漏れた光のコントラスト向
上の為に基材内に蛍光物質を混入させ、前述のス
ルーホールの欠陥から前述の漏れた光と異なる波
長の透過光を検知するスルーホール検査方法を提
供することを目的とするものである。(4) Purpose of the Invention In view of the above-mentioned conventional drawbacks, the present invention provides a method for improving the contrast between the transmitted light from the defective through-hole of the object to be inspected and the light leaking from the gap between the through-hole and the mask. The object of the present invention is to provide a through-hole inspection method in which a fluorescent substance is mixed and transmitted light of a wavelength different from the light leaked from the defective through-hole is detected.
(5) 発明の構成
そしてこの目的は本発明によれば光を用いてス
ルーホールの欠陥を検知する方法に於いて、前記
スルーホールが設けられている基材内に前記光と
異なる波長を発する蛍光物質を混入し、前記スル
ーホールの下面に該スルーホールを遮光するマス
クを設けて、前記マスクの下方向部から該マスク
と該マスクの回りに前記光を照射する事により、
前記スルーホールの上方向部に前記スルーホール
の欠陥を透過した前記基材内の蛍光を検知する装
置を設けた事を特徴とするスルーホール検査法を
提供することによつて達成される。(5) Structure of the Invention According to the present invention, in a method of detecting a defect in a through hole using light, a wavelength different from that of the light is emitted into a base material in which the through hole is provided. By mixing a fluorescent substance, providing a mask on the lower surface of the through hole to shield the through hole from light, and irradiating the light onto the mask and around the mask from the lower part of the mask,
This is achieved by providing a through-hole inspection method characterized in that a device for detecting fluorescence in the base material that has passed through defects in the through-hole is provided above the through-hole.
(6) 発明の実施例
以下本発明一実施例を図面に基づいて詳述す
る。(6) Embodiment of the Invention An embodiment of the present invention will be described below in detail based on the drawings.
図は本発明一実施例の動作を示す一部断面図の
概略図である。同図に於いて、マスク７の下方向
部からの光１３例えば紫外線の照射で基材４例え
ば多層のプリント基板には透明部材１４例えばガ
ラスを透過した光８が入射する。前述の光８は基
材４内で散乱し、蛍光物質９例えば硫化亜鉛
（ZnS）を励起し、蛍光１０をスルーホール５の
欠陥６より放出する。この蛍光は集光部３、光り
検知器１等の装置に検知される。集光部３の例え
ばレンズは前述のスルーホール５の上方向部に配
置し、蛍光１０とスルーホール５とマスク７の隙
間からの漏れ光１１の合成光１２を集光する。前
述集光された合成光１２は例えばフイルター２で
蛍光１０を透過し光検知器１で検知する構成とな
つている。 The figure is a schematic partial cross-sectional view showing the operation of an embodiment of the present invention. In the figure, light 13, for example, ultraviolet light, is irradiated from the lower part of a mask 7, and light 8 that has passed through a transparent member 14, for example, glass, enters a base material 4, for example, a multilayer printed circuit board. The aforementioned light 8 is scattered within the base material 4 and excites a fluorescent substance 9 such as zinc sulfide (ZnS), and fluorescence 10 is emitted from the defect 6 of the through hole 5. This fluorescence is detected by devices such as the condenser 3 and the light detector 1. For example, a lens of the condensing section 3 is disposed above the above-mentioned through hole 5, and condenses the combined light 12 of the fluorescent light 10 and the leaked light 11 from the gap between the through hole 5 and the mask 7. The above-mentioned combined light 12 is configured to pass through a fluorescent light 10 through a filter 2 and to be detected by a photodetector 1, for example.
同図に於いて、スルーホール５が設けられてい
る基材４に高エネルギー（波長の短い）光８を照
射する。この時、被検査体であるスルーホール下
方向部にはマスク７が配設されており、マスク７
以外の部分の基材４には光８が照射される事にな
る。プリント基板等の基材４には硫化亜鉛
（ZnS）等の蛍光物質９が混入しているので、透
明部材１４を透過した光８は基材４内を散乱し
て、その散乱光８′により蛍光物質を発光させる
事になる。この発光した光はスルーホール５の欠
陥部６から透過光１０として放出する。この時、
スルーホール５から放出する光１２には前述の透
過光１０とスルーホール５とマスク７の隙間から
の漏れ光１１が含まれる事に成る。次は前述の光
をレンズ等の集光部３で集光させる。そしてこの
集光部３は僅かな光でものちの光検知器１で検出
出来る役目をしている。この集光された光には透
過光１０と漏れ光１１が含まれているので、検査
に不必要な漏れ光１１を除去する為フイルター２
を通して、透過光１０が光検知器１に入射する様
にする。尚、このフイルター２は基材４に照射し
た光が紫外線である場合、紫外線カツトフイルタ
ーとする事により透過光１０を透過する。従つ
て、光検知器１にはフイルター２を通つた透過光
１０が入射するのでスルーホール５の欠陥６の検
知が容易となる。所謂、透過光１０と漏れ光１１
の波長が著しく異なるのでＳ／Ｎが良く、検出の
コントラスト向上に繋がつている。故にマスクパ
ターン上の基材４を僅かに離せるので、基材４を
高速で移動させスルーホールの検査が高速で処理
される。尚、このマスクパターンは、図示されて
いない治具で固定されている。そして基材４は図
示されていない例えばＸ−Ｙステージにより高速
に移動する。 In the figure, high energy (short wavelength) light 8 is irradiated onto a base material 4 in which a through hole 5 is provided. At this time, a mask 7 is disposed below the through hole, which is the object to be inspected.
The light 8 will be irradiated onto the other parts of the base material 4. Since the base material 4 such as a printed circuit board is mixed with a fluorescent substance 9 such as zinc sulfide (ZnS), the light 8 transmitted through the transparent member 14 is scattered within the base material 4, and the scattered light 8' This will cause the fluorescent substance to emit light. This emitted light is emitted from the defective portion 6 of the through hole 5 as transmitted light 10. At this time,
The light 12 emitted from the through hole 5 includes the aforementioned transmitted light 10 and the leaked light 11 from the gap between the through hole 5 and the mask 7. Next, the above-mentioned light is condensed by a condenser 3 such as a lens. The light condensing section 3 has the role of allowing the light detector 1 to detect even a small amount of light. Since this focused light includes transmitted light 10 and leakage light 11, a filter 2 is used to remove the leakage light 11 that is unnecessary for inspection.
The transmitted light 10 is made to enter the photodetector 1 through the photodetector 1. Incidentally, when the light irradiated onto the base material 4 is ultraviolet rays, this filter 2 is configured as an ultraviolet ray cut filter to transmit the transmitted light 10. Therefore, since the transmitted light 10 that has passed through the filter 2 is incident on the photodetector 1, defects 6 in the through-holes 5 can be easily detected. So-called transmitted light 10 and leaked light 11
Since the wavelengths of the two are significantly different, the S/N ratio is good, which leads to improved detection contrast. Therefore, since the base material 4 on the mask pattern can be slightly separated, the base material 4 can be moved at high speed and through-hole inspection can be performed at high speed. Note that this mask pattern is fixed with a jig (not shown). The base material 4 is then moved at high speed by, for example, an X-Y stage (not shown).
(7) 発明の効果
以上、詳細に説明した様に、本発明によればス
ルーホールの僅かな欠陥からの非常に少量の透過
光でもスルーホールの欠陥からの透過光とスルー
ホールとマスクの隙間からの漏れ光の波長が著し
く異なり、而も光検知器の前に漏れ光を除去する
フイルターを配設してあるので、容易に検出し、
スノーホールの欠陥を検知出来る有用な効果を有
する。更に、自動的にスルーホールの欠陥を検査
する際は、マスクをスルーホールに密着せず、僅
かに離して行なえるので、高速で動作を行なえる
効果を有する。(7) Effects of the Invention As explained above in detail, according to the present invention, even a very small amount of transmitted light from a slight defect in a through hole can cause the transmitted light from the defect in the through hole and the gap between the through hole and the mask to disappear. The wavelength of the light leaking from the light source is significantly different, and since a filter is placed in front of the photodetector to remove the light leakage, it can be easily detected.
It has a useful effect of detecting defects in snow holes. Further, when automatically inspecting through holes for defects, the mask can be slightly separated from the through holes without being brought into close contact with them, which has the effect of allowing high-speed operation.
図は本発明一実施例の一部断面図の概略的構成
図である。
１……光検知器、２……フイルター、３……集
光部、４……基材、５……スルーホール、６……
欠陥部、７……マスク、９……蛍光物質、１４…
…透明部材。
The figure is a schematic diagram of a partially sectional view of an embodiment of the present invention. 1... Photodetector, 2... Filter, 3... Light collecting section, 4... Base material, 5... Through hole, 6...
Defect part, 7...mask, 9...fluorescent material, 14...
...Transparent member.
Claims (1)
法に於いて、前記スルーホールが設けられている
基材内に前記光と異なる波長を発する蛍光物質を
混入し、前記スルーホールの下面に該スルーホー
ルを遮光するマスクを設けて、前記マスクの下方
向部から該マスクと該マスクの回りに前記光を照
射する事により、前記スルーホールの上方向部に
前記スルーホールの欠陥を透過した前記基材内の
蛍光を検知する装置を設けた事を特徴とするスル
ーホール検査法。 ２ 前記光が紫外線で、前記蛍光を検知する装置
が前記スルーホールよりの光を集光する手段と前
記蛍光を透過する手段と、前記透過した光を検知
する手段である事を特徴とする特許請求の範囲第
１項記載のスルーホール検査法。 ３ 前記透過手段が紫外線カツトフイルターであ
る事を特徴とする特許請求の範囲第２項記載のス
ルーホール検査法。[Scope of Claims] 1. In a method of detecting defects in through-holes using light, a fluorescent substance that emits a wavelength different from that of the light is mixed into a base material in which the through-hole is provided, and the through-hole is By providing a mask on the lower surface of the hole to shield the through hole from light, and irradiating the light from the lower part of the mask to the mask and around the mask, the upper part of the through hole is illuminated. A through-hole inspection method comprising a device for detecting fluorescence in the base material that has passed through the defect. 2. A patent characterized in that the light is ultraviolet rays, and the device for detecting the fluorescence includes means for condensing the light from the through-hole, means for transmitting the fluorescence, and means for detecting the transmitted light. A through-hole inspection method according to claim 1. 3. The through-hole inspection method according to claim 2, wherein the transmitting means is an ultraviolet cut filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5422483A JPS59180315A (en) | 1983-03-30 | 1983-03-30 | Through-hole inspecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5422483A JPS59180315A (en) | 1983-03-30 | 1983-03-30 | Through-hole inspecting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59180315A JPS59180315A (en) | 1984-10-13 |
| JPH0361884B2 true JPH0361884B2 (en) | 1991-09-24 |
Family
ID=12964562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5422483A Granted JPS59180315A (en) | 1983-03-30 | 1983-03-30 | Through-hole inspecting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59180315A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61169708A (en) * | 1985-01-22 | 1986-07-31 | Fujitsu Ltd | Method and apparatus for pattern recognition |
| JPH0439523Y2 (en) * | 1985-05-20 | 1992-09-16 | ||
| JPS61290311A (en) * | 1985-06-19 | 1986-12-20 | Hitachi Ltd | Apparatus and method for inspecting soldered zone |
-
1983
- 1983-03-30 JP JP5422483A patent/JPS59180315A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59180315A (en) | 1984-10-13 |
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