JPH0361965B2 - - Google Patents
Info
- Publication number
- JPH0361965B2 JPH0361965B2 JP58213356A JP21335683A JPH0361965B2 JP H0361965 B2 JPH0361965 B2 JP H0361965B2 JP 58213356 A JP58213356 A JP 58213356A JP 21335683 A JP21335683 A JP 21335683A JP H0361965 B2 JPH0361965 B2 JP H0361965B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- weight
- low melting
- wire
- silicone resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002844 melting Methods 0.000 claims description 30
- 230000008018 melting Effects 0.000 claims description 30
- 239000000843 powder Substances 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 23
- 229920002050 silicone resin Polymers 0.000 claims description 17
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 14
- 239000001023 inorganic pigment Substances 0.000 claims description 14
- 229910052582 BN Inorganic materials 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 9
- 238000000354 decomposition reaction Methods 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000008199 coating composition Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 27
- 239000011248 coating agent Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 19
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000002245 particle Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 9
- 230000007423 decrease Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229920000592 inorganic polymer Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- MZZSDCJQCLYLLL-UHFFFAOYSA-N Secalonsaeure A Natural products COC(=O)C12OC3C(CC1=C(O)CC(C)C2O)C(=CC=C3c4ccc(O)c5C(=O)C6=C(O)CC(C)C(O)C6(Oc45)C(=O)OC)O MZZSDCJQCLYLLL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- TZHYBRCGYCPGBQ-UHFFFAOYSA-N [B].[N] Chemical compound [B].[N] TZHYBRCGYCPGBQ-UHFFFAOYSA-N 0.000 description 1
- -1 alkyl resins, acrylic Chemical compound 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Organic Insulating Materials (AREA)
Description
本発明は耐熱電線用被覆組成物（以下電線被覆
材という）、特に500℃以上の耐熱性が要求される
原子炉関係、その他の特殊電気機器関係等に用い
られる耐熱電線用の被覆組成物に関する。
従来耐熱性のある電線被覆材としてはポリポロ
シロキサン重合体が知らているが、これは耐熱性
が450℃程度であり、500℃以上で長時間加熱する
と塗膜の分解が起こり電気絶縁性、可とう性がな
くなり使用できないという欠点があつた。（特開
昭57−23629号公報）
本発明は上記欠点を解決した電線被覆材を提供
するもので、窒化硼素（BN）、低融点釉薬、低
融点釉薬の融点よりも高い融点又は分解温度を有
する無機質顔料（以下単に無機質顔料という）及
びシリコーン樹脂を特定の割合で含有させた溶液
を電線用基材に塗布、焼き付ける事により、耐熱
性、絶縁性及び可とう性にすぐれ、しかも急熱、
急冷による焼き付けを行つても剥離、クラツク、
ふくれ等を生じない電線被覆材を提供しようとす
るものである。すなわち、本発明は(A)窒素硼素30
〜80重量％低融点釉薬１〜18重量％、残部が無機
質顔料であり粉末組成物と(B)シリコーン樹脂20〜
60重量％、残部がシリコーン樹脂可溶な有機溶剤
である液状組成物80〜40重量部の割合で含有した
ことを特徴とする。以下さらに本発明を詳しく説
明する。
本発明はBN、低融点釉薬、無機質顔料、シリ
コーン樹脂及びシリコーン樹脂可溶の溶剤を特定
の割合で含有する電線被覆材であつて、これを電
線基材に塗布し、焼き付けると耐熱性、絶縁性に
すぐれた電線が得られる。
まず本発明に係る電線被覆材の成分である粉末
組成物及び液状組成物について説明する。
(A)の粉末組成物はBN粉末、低融点釉薬、無機
質顔料からなるがBN粉末は粉末組成物成分中に
30〜80重量％存在させるが、BN粉末が80重量％
を越えると電線基材との密着性が低下し剥離やク
ラツクが発生し、又30重量％未満では絶縁性及び
耐熱性が低下するので好ましくない。BN粉末は
塗膜に絶縁性、耐熱性を持たせるものであり、そ
のBN純度が低いものは不純物のため絶縁性や耐
熱性が低下するのでその純度が90％以上のものが
好ましい。又その粒径はは電線基材との密着性に
影響が大であるので10μ以下のものが好ましい。
次に低融点釉薬は粉末組成物成分中に１〜18重
量％存在させるが、低融点釉薬が18重量％を越え
ると可とう性や耐熱性が悪くなり又１重量％未満
では電線基材との密着力が低下し塗膜が剥離した
り、クラツクが発生したりするので好ましくな
い。
本発明において低融点釉薬とはその融点が300
〜700℃のものである。この様な融点の低融点釉
薬を配合する理由としては、本発明の電線被覆材
を電線基材に塗布して焼く付ける際に、その塗膜
が電線基材との密着力が低下する温度400℃付近
で軟化し、シリコーン樹脂が熱分解し生成される
SiO2と反応し安定なものとなると共に電線基材
と密着する。又さらに700〜900℃の高温では無機
質顔料と反応し安定なものになり電線基材との密
着性が大となるからである。
無機質顔料は前記BN、低融点釉薬の残部すな
わち粉末組成物成分中に２〜69重量％存在させる
が無機質顔料が69重量％を越えると相対的にBN
含有量が少なくなり潤滑性が低下するので好まし
くない。又２重量％未満では塗膜に剥離やクラツ
クが発生するので好ましくない。
無機質顔料としては市販の酸化チタン、Al2O3
等の白色顔料、酸化鉄（Fe3O4）等の黒色顔料を
用いる事ができ、その粒径としては低融点釉薬と
の反応性、電線基材との密着性を考慮すると10μ
以下のものが好ましく、又その融点又は分解温度
は低融点釉薬の融点よりも高いことが必要であ
る。これはシリコーン樹脂が熱分解する際に生成
するSiO2あるいは低融点釉薬と反応し安定なも
のとなり、焼き付け時や急熱、急冷の際に発生す
る塗膜の剥離、クラツクを防止し密着力の強い塗
膜を作るのに必要なものである。
(B)の液状組成物はシリコーン樹脂と溶剤とから
なるが、シラコーン樹脂は液状組成物成分中に20
〜60重量％含有したものであればよく、シリコー
ン樹脂が60重量％を越えると熱分解時に発生する
ガス量が多くなり塗膜にふくれが発生し20重量％
未満では低温での電線基材への密着力が低下する
と同時に高温時に生成するSiO2の量も少なくな
り電線基材との密着力が低下するので好ましくな
い。シリコーン樹脂としては市販のものが使用で
き、例えばシリコーン樹脂を有機溶剤に溶解した
有機溶剤を含む液状タイプのもの、又これらにさ
らにアルキル樹脂、アクリル樹脂、フエノール樹
脂、エポキシ樹脂等を混合したものがあげられ
る。これらの粘度は1000〜5000cps程度のものが
有利である。シリコーン樹脂は常温から300℃ま
での温度での電線基材への密着性を良くするもの
であり、又粉末組成物に対し結合剤として作用す
るものであり、かつ高温においては熱分解により
生成されたSiO2が低融点釉薬あるいは無機質顔
料と反応して安定なものとなり電線基材と密着す
る役割を果す。
溶剤は液状組成物成分中に40〜80重量％含有さ
せればよく、溶剤が40重量％未満では粉末組成物
との混合性が悪くなり均一に分散する事が難かし
いと同時に塗布する際の作業性も悪くなる。又80
重量％を越えると分散した粉末組成物が沈降分離
しやすくなる。溶剤としてはトルエン、キシレン
の様にシリコーン樹脂と相溶性のあるものであれ
ばよい。これは粉末組成物成分と液状組成物成分
とを混合する際の混合性及び電線基材に塗布する
時の作業性も良好とするものである。
本発明による電線被覆材を製造するには前記し
た割合で粉末組成物成分と液状組成物成分を混合
機に入れ数時間混合すればよい。
この様にして製造したものを電線被覆材に使用
するにはそのまま又はこれをさらに溶剤でこれを
希釈したものをNiメツキ、Ni線等の耐熱性の電
線基材に通常の方法で塗布、焼き付けすればよ
い。又さらにこの被覆層の上に耐熱性の樹脂すな
わちポリイミド、ポリアミドイミド樹脂、エステ
ルイミド樹脂等を塗布、焼き付けすればさらに可
とう性の向上が期待できる。
以下本発明の実施例をあげさらに詳しく説明す
る。なお実施例中の％及び部はいずれも重量基準
で示した。
実施例 １〜４
BN粉末（粒径5μ以下）、低融点釉薬としてフ
リツトガラス（粒径5μ以下、融点500℃）、無機
質顔料として酸化鉄（粒径5μ以下、分解温度
1538℃）を用いた粉末組成物とシリコーン樹脂及
び溶剤としてトルエンを用いた液状組成物とを第
１表に示す割合で配合してボールミルで均一に混
合した。これを直径1.0mmのNiメツキ線（メツキ
厚み2μ）に炉長7.5mmの横型焼き付け機を用い、
焼き付け温度500℃、600℃、700℃とし線速８
ｍ／分で７回焼き付けを行い耐熱絶縁電線を得
た。得られた耐熱絶縁電線の特性を第１表に示
す。
実施例 ５
実施例１の酸化鉄の代りにAl2O3（融点2050℃）
を用いた以外は同様に行つた。
比較例 １
BN粉末（粒径5μ以下）10％、低融点釉薬とし
てフリツトガラス（粒径5μ以下、融点500℃）５
％、無機質顔料として酸化鉄（粒径5μ以下、分
解温度1538℃）85％との割合で混合して得た粉末
組成物40部とシリコーン樹脂40％、溶剤としてト
ルエン60％とからなる液状物を用いた以外は実施
例１と同様に行つた。
比較例 ２
BN粉末（粒径5μ以下）50％、低融点釉薬とし
てフリツトガラス（粒径5μ以下、融点500℃）５
％、無機質顔料として酸化鉄（粒径5μ以下、分
解温度1538℃）45％との割合で混合して得た粉末
組成物40部とシリコーン樹脂５％、溶剤としてト
ルエン95％とからなる液状物60部とを用いた以外
は実施例１と同様に行つた。
比較例 ３
電線被覆材としてポリボロシロキサン樹脂を含
有した無機ポリマー塗料（昭和電線電纜(株)製 商
品名「SMP」塗料）を用いた以外は実施例１と
同様に行つた。
以上実施例、比較例において説明するごとく、
本発明による電線被覆材は従来のポリボロシロキ
サンを含有した無機ポリマー耐熱塗料に比べ耐熱
性、電気絶縁性にすぐれているために500℃以上
の耐熱性が要求される耐熱電線の被覆材として使
用可能である。
The present invention relates to a coating composition for heat-resistant electric wires (hereinafter referred to as electric wire coating material), and in particular to a coating composition for heat-resistant electric wires used in nuclear reactor-related and other special electrical equipment-related applications that require heat resistance of 500°C or higher. . Conventionally, polyporosiloxane polymer is known as a heat-resistant wire coating material, but this has a heat resistance of about 450℃, and if heated at 500℃ or higher for a long time, the coating film will decompose, resulting in electrical insulation and The disadvantage was that it lost its flexibility and could not be used. (Japanese Unexamined Patent Publication No. 57-23629) The present invention provides a wire coating material that solves the above-mentioned drawbacks, and has a melting point or decomposition temperature higher than the melting point of boron nitride (BN), a low melting point glaze, or a low melting point glaze. By applying and baking a solution containing inorganic pigments (hereinafter simply referred to as inorganic pigments) and silicone resins in a specific ratio onto a wire base material, it has excellent heat resistance, insulation properties, and flexibility, and also has rapid heat resistance.
Even if baked by rapid cooling, there will be no peeling, cracking,
The purpose of this invention is to provide a wire covering material that does not cause blisters or the like. That is, the present invention provides (A) nitrogen boron 30
~80% by weight low melting point glaze 1~18% by weight, the balance being inorganic pigment, powder composition and (B) silicone resin 20~
The liquid composition is characterized by containing 60% by weight and the remainder being 80 to 40 parts by weight of a silicone resin-soluble organic solvent. The present invention will be further explained in detail below. The present invention is an electric wire coating material containing BN, a low melting point glaze, an inorganic pigment, a silicone resin, and a silicone resin-soluble solvent in a specific ratio.When this is applied to an electric wire base material and baked, it becomes heat resistant and insulating. Electric wire with excellent properties can be obtained. First, the powder composition and liquid composition that are components of the wire coating material according to the present invention will be explained. The powder composition of (A) consists of BN powder, low melting point glaze, and inorganic pigment, but BN powder is included in the powder composition components.
30-80% by weight, but 80% by weight of BN powder
If it exceeds 30% by weight, the adhesion with the wire base material will decrease and peeling or cracking will occur, and if it is less than 30% by weight, the insulation properties and heat resistance will decrease, which is not preferable. BN powder imparts insulation and heat resistance to the coating film, and if the BN powder is low, the insulation and heat resistance will be reduced due to impurities, so BN powder with a purity of 90% or more is preferable. The particle size is preferably 10 μm or less since it has a large effect on the adhesion to the wire base material. Next, the low melting point glaze should be present in the powder composition component in an amount of 1 to 18% by weight, but if the low melting point glaze exceeds 18% by weight, the flexibility and heat resistance will deteriorate, and if it is less than 1% by weight, it will not work as a wire base material. This is undesirable because it reduces the adhesion of the coating and causes the coating to peel or crack. In the present invention, the low melting point glaze is defined as having a melting point of 300
~700℃. The reason why such a low melting point glaze is blended is that when the wire coating material of the present invention is applied to the wire base material and baked, the temperature at which the coating film loses its adhesion to the wire base material is 400°C. It softens at around ℃ and is generated by thermal decomposition of silicone resin.
It reacts with SiO 2 to become stable and adheres closely to the wire base material. Furthermore, at high temperatures of 700 to 900°C, it reacts with inorganic pigments and becomes stable, resulting in greater adhesion to the wire base material. The inorganic pigment is present in the BN and the remainder of the low melting point glaze, that is, 2 to 69% by weight of the powder composition components, but if the inorganic pigment exceeds 69% by weight, the relative BN
This is not preferable because the content decreases and the lubricity decreases. Further, if the amount is less than 2% by weight, peeling or cracking may occur in the coating film, which is not preferable. Commercially available titanium oxide, Al 2 O 3 is used as an inorganic pigment.
White pigments such as iron oxide (Fe 3 O 4 ) can be used, and black pigments such as iron oxide (Fe 3 O 4 ) can be used, and the particle size is 10 μm considering reactivity with the low melting point glaze and adhesion with the wire base material.
The following are preferred, and their melting point or decomposition temperature must be higher than the melting point of the low melting glaze. This reacts with SiO 2 or low melting point glaze produced when silicone resin thermally decomposes, making it stable, preventing peeling and cracking of the coating film that occurs during baking, rapid heating, and rapid cooling, and improves adhesion. This is necessary to create a strong paint film. The liquid composition (B) consists of a silicone resin and a solvent.
A silicone resin content of ~60% by weight is sufficient; if the silicone resin content exceeds 60% by weight, the amount of gas generated during thermal decomposition increases and the coating film blisters.
If it is less than that, the adhesion to the wire base material at low temperatures decreases, and at the same time, the amount of SiO 2 generated at high temperatures decreases, which is not preferable. Commercially available silicone resins can be used, such as liquid types containing organic solvents in which silicone resins are dissolved in organic solvents, and those mixed with alkyl resins, acrylic resins, phenolic resins, epoxy resins, etc. can give. Advantageously, these have a viscosity of about 1000 to 5000 cps. Silicone resin improves adhesion to wire base materials at temperatures from room temperature to 300°C, and also acts as a binder for powder compositions, and is produced by thermal decomposition at high temperatures. The SiO 2 reacts with the low melting point glaze or inorganic pigment to become stable and play a role in adhering to the wire base material. The solvent should be contained in the liquid composition component in an amount of 40 to 80% by weight; if the solvent is less than 40% by weight, it will have poor miscibility with the powder composition and will be difficult to disperse uniformly, and at the same time will be difficult to coat. Workability also deteriorates. Also 80
When the amount exceeds % by weight, the dispersed powder composition tends to settle and separate. Any solvent may be used as long as it is compatible with the silicone resin, such as toluene and xylene. This improves the mixability when mixing the powder composition component and the liquid composition component and the workability when applying it to the wire base material. In order to manufacture the wire coating material according to the present invention, the powder composition component and the liquid composition component may be placed in a mixer and mixed for several hours in the proportions described above. To use the product manufactured in this way as a wire coating material, apply it as it is or dilute it with a solvent to a heat-resistant wire base material such as Ni plating or Ni wire by the usual method and bake it. do it. Furthermore, if a heat-resistant resin such as polyimide, polyamideimide resin, esterimide resin, etc. is coated and baked on this coating layer, further improvement in flexibility can be expected. EXAMPLES The present invention will be described in more detail below with reference to Examples. Note that all percentages and parts in the examples are expressed on a weight basis. Examples 1 to 4 BN powder (particle size 5μ or less), fritted glass (particle size 5μ or less, melting point 500℃) as a low melting glaze, iron oxide (particle size 5μ or less, decomposition temperature) as an inorganic pigment
A powder composition using a silicone resin and a liquid composition using toluene as a solvent were blended in the proportions shown in Table 1 and uniformly mixed in a ball mill. Using a horizontal baking machine with a furnace length of 7.5 mm, this was applied to a Ni plating wire with a diameter of 1.0 mm (plating thickness of 2 μ).
Baking temperature 500℃, 600℃, 700℃ and linear speed 8
Baking was performed 7 times at m/min to obtain a heat-resistant insulated wire. Table 1 shows the properties of the obtained heat-resistant insulated wire. Example 5 Al 2 O 3 (melting point 2050°C) instead of iron oxide in Example 1
The same procedure was carried out except that . Comparative Example 1 10% BN powder (particle size 5μ or less), fritted glass (particle size 5μ or less, melting point 500℃) as a low melting glaze 5
%, a liquid material consisting of 40 parts of a powder composition obtained by mixing 85% iron oxide (particle size 5μ or less, decomposition temperature 1538°C) as an inorganic pigment, 40% silicone resin, and 60% toluene as a solvent. The same procedure as in Example 1 was carried out except that . Comparative Example 2 50% BN powder (particle size 5μ or less), fritted glass (particle size 5μ or less, melting point 500℃) as a low melting glaze 5
%, a liquid material consisting of 40 parts of a powder composition obtained by mixing 45% iron oxide (particle size 5μ or less, decomposition temperature 1538°C) as an inorganic pigment, 5% silicone resin, and 95% toluene as a solvent. Example 1 was carried out in the same manner as in Example 1 except that 60 parts were used. Comparative Example 3 The same procedure as in Example 1 was carried out except that an inorganic polymer paint containing a polyborosiloxane resin (trade name "SMP" paint, manufactured by Showa Denshin Co., Ltd.) was used as the wire coating material. As explained above in the examples and comparative examples,
The wire coating material of the present invention has superior heat resistance and electrical insulation properties compared to conventional inorganic polymer heat-resistant paints containing polyborosiloxane, and is therefore used as a coating material for heat-resistant wires that require heat resistance of 500°C or higher. It is possible.
【表】
尚第１表において記載した物性値の測定は次の
方法で行つた。
(1) 皮膜厚 三豊(株)製マイクロメーターにより測
定（単位μ）
(2) 可とう性 JIS C3003 8.1.1(2)に準拠（単位
巻き付け合格倍径ｄ）
(3) 絶縁破壊電圧 JIS C3003 11.1に準拠（単位
KV）
(4) 耐熱衝撃性 JIS C3003 14.1(2)に準拠（単位
巻き付け合格倍径ｄ）。[Table] The physical property values listed in Table 1 were measured by the following method. (1) Film thickness Measured with a micrometer manufactured by Mitoyo Co., Ltd. (unit: μ) (2) Flexibility Conforms to JIS C3003 8.1.1(2) (unit winding pass diameter d) (3) Dielectric breakdown voltage JIS C3003 According to 11.1 (units
KV) (4) Thermal shock resistance Compliant with JIS C3003 14.1(2) (unit winding pass diameter d).
Claims (1)
重量％、残部が低融点釉薬の融点よりも高い融点
又は分解温度を有する無機質顔料である粉末組成
物20〜60重量部と(B)シリコーン樹脂20〜60重量
％、残部がシリコーン樹脂可溶な有機溶剤である
液状組成物80〜40重量部の割合で含有してなる耐
熱電線用被覆組成物。1 (A) Boron nitride 30-80% by weight, low melting point glaze 1-18
20 to 60 parts by weight of a powder composition, the balance being an inorganic pigment having a melting point or decomposition temperature higher than the melting point of the low melting point glaze, and (B) 20 to 60 parts by weight of a silicone resin, the remainder being a silicone resin soluble. A coating composition for a heat-resistant electric wire, comprising 80 to 40 parts by weight of a liquid composition that is an organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58213356A JPS60107207A (en) | 1983-11-15 | 1983-11-15 | Coating composition for heat resistant wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58213356A JPS60107207A (en) | 1983-11-15 | 1983-11-15 | Coating composition for heat resistant wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60107207A JPS60107207A (en) | 1985-06-12 |
| JPH0361965B2 true JPH0361965B2 (en) | 1991-09-24 |
Family
ID=16637812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58213356A Granted JPS60107207A (en) | 1983-11-15 | 1983-11-15 | Coating composition for heat resistant wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60107207A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485612U (en) * | 1990-11-30 | 1992-07-24 | ||
| US5519172A (en) * | 1994-09-13 | 1996-05-21 | W. L. Gore & Associates, Inc. | Jacket material for protection of electrical conductors |
-
1983
- 1983-11-15 JP JP58213356A patent/JPS60107207A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60107207A (en) | 1985-06-12 |
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