JPH0361990B2 - - Google Patents
Info
- Publication number
- JPH0361990B2 JPH0361990B2 JP61140860A JP14086086A JPH0361990B2 JP H0361990 B2 JPH0361990 B2 JP H0361990B2 JP 61140860 A JP61140860 A JP 61140860A JP 14086086 A JP14086086 A JP 14086086A JP H0361990 B2 JPH0361990 B2 JP H0361990B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- indicating material
- temperature indicating
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電線、金属パイプ等に装着、加熱し
て、半田付けと絶縁保護あるいは防蝕保護等を同
時に処理する示温材付フラツクスを内蔵した半田
接続用部品に関するものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention has a built-in flux with a temperature indicator that is attached to electric wires, metal pipes, etc. and heated to provide soldering, insulation protection, corrosion protection, etc. at the same time. This relates to solder connection parts.
（従来の技術）
従来の示温材付フラツクス内蔵半田リング入り
チユーブは第３図に示すように熱収縮チユーブ１
内に半田リング２（示温材入りフラツクス３を半
田表面にコーテイングしてある）を装着したもの
である。これを電線に装着加熱し、半田付けと絶
縁保護あるいは防蝕保護を同時に処理している。(Prior art) A conventional tube with a flux built-in solder ring and a temperature indicator is a heat-shrinkable tube 1 as shown in Fig. 3.
A solder ring 2 (the solder surface is coated with flux 3 containing a temperature indicating material) is attached inside. This is attached to the wire and heated to provide soldering and insulation protection or corrosion protection at the same time.
なお、フラツクスは上述のような半田付け完了
温度を、その温度での変色によつて知らしめる示
温材が含有されている。 Incidentally, the flux contains a temperature indicating material which indicates the soldering completion temperature as described above by changing color at that temperature.
（発明が解決しようとする問題点）
従来の半田接続用部品すなわち示温材付フラツ
クス内蔵の半田リング入りチユーブを電線芯材に
装着した際の収縮初期、中期、後期の状態をそれ
ぞれ第４図イ，ロ，ハに示して説明する。(Problems to be Solved by the Invention) Figure 4 shows the initial, middle, and late stages of shrinkage when a conventional solder connection component, that is, a tube with a solder ring containing a built-in flux with a temperature indicator, is attached to a wire core material. , B, and C are shown and explained.
イは収縮チユーブ１を電線芯材４に装着した収
縮初期で、示温材付フラツクス３、半田リング２
に大きな変化は認められない。 A is the initial stage of contraction when the shrink tube 1 is attached to the wire core material 4, the flux with temperature indicator 3, the solder ring 2
No major changes were observed.
しかし、ロの収縮中期（60〜80℃）において
は、半田がとける前（フラツクスの融点は60〜80
℃、半田の融点は143〜183℃）に示温材付フラツ
クスがロのように流動状態となり、収縮チユーブ
の収縮力でフラツクスが両サイドに逃げる。な
お、この収縮中期の温度では示温材は変化しな
い。 However, before the solder melts (the melting point of flux is 60 to 80℃) in the middle of contraction (60 to 80℃)
℃, the melting point of the solder is 143 to 183℃), the flux with a temperature indicator becomes fluid as shown in (B), and the shrinkage force of the shrink tube causes the flux to escape to both sides. Note that the temperature indicating material does not change at this temperature during the middle stage of contraction.
収縮後期にはハのように示温材付フラツクス３
は半田部位から全くおしのけられてしまう。 In the late stage of contraction, flux 3 with temperature indicator is applied as shown in C.
is completely pushed away from the solder area.
従つて、半田表面に示温材が残らず観察困難で
ある上、半田の温度も正確に指示できない。 Therefore, no temperature indicating material remains on the solder surface, making it difficult to observe, and it is also impossible to accurately indicate the temperature of the solder.
これは示温材が流動的なフラツクスに含有され
ているからである。 This is because the temperature indicating material is contained in a fluid flux.
この点が本発明の解決しようとする問題点であ
る。 This point is the problem that the present invention attempts to solve.
（問題点も解決するための手段）
フラツクスを半田内に分散・混合させ、示温材
を直接半田表面にコーテイングすることにして、
フラツクスと示温材を分離させた。(Means to solve the problem) We decided to disperse and mix the flux into the solder and coat the temperature indicating material directly on the solder surface.
The flux and temperature indicating material were separated.
（作用）
フラツクスを半田内に分散・混合させ、示温材
を半田表面にコーテイングさせているので示温材
が流されることがない。(Function) Since the flux is dispersed and mixed in the solder and the temperature indicating material is coated on the solder surface, the temperature indicating material will not be washed away.
（実施例）
第１図は本発明の示温材付フラツクス内蔵半田
リング１０入りチユーブのチユーブを省略した実
施例説明図で、半田１１はその中にフラツクス粒
１２を分散させ、その外側に示温材１３をコーテ
イングしてある。(Example) Fig. 1 is an explanatory view of an embodiment of a tube containing flux built-in solder ring 10 with a temperature indicating material of the present invention, in which the tube is omitted. 13 is coated.
第２図は、第１図の半田リング１０を装着した
熱収縮チユーブの使用状況を示すもので、イは収
縮初期の状態で１は熱収縮チユーブ、１０は半田
リング、ロは収縮後期の状態で示温材１３が収縮
完了まで流されることなく半田表面に残る。 Figure 2 shows the usage of the heat-shrinkable tube with the solder ring 10 of Figure 1 attached, where A is the initial state of contraction, 1 is the heat-shrinkable tube, 10 is the solder ring, and B is the late-shrinkage state. The temperature indicating material 13 remains on the solder surface without being washed away until the shrinkage is completed.
本実施例に用いられる(1)透明または半透明な熱
収縮チユーブの材質例、(2)示温材の例、(3)フラツ
クスの例を以下に列挙する。 Listed below are (1) examples of the material of the transparent or translucent heat-shrinkable tube, (2) examples of the temperature indicating material, and (3) examples of the flux used in this example.
(1) 透明または半透明な熱収縮チユーブの材質
架橋ポリエチレン 架橋ナイロン６
架橋EVA 架橋ナイロン12
架橋EEA 架橋6.6ナイロン
架橋難燃塩素化ポリエチレン
その他架橋ポリオレフイン混合物
PVC
難燃PVC
PVDF
ETFE
(2) 示温材の例
ACid Red73
（Ｐフエルアゾアニリンとして２−ナフトール
６，８−ジスルホン酸から誘導されるジアゾ染
料）
Pigment Red3
（２−ニトロ−Ｐ−トルイジンと２−ナフトー
ルから誘導されるアゾ染料）
チモールブルー
Pigment Red52
（２−アミノ−５−クロロ−Ｐ−トルエンスル
ホン酸と３−ヒドロキシ−２−ナフトエ酸から
誘導されるアゾ染料）
ブレモクレソルグリーン
Solvent Red24
（４−０−トリルアゾ−０−トルイジンと２ナ
フトールから誘導されるアゾ染料）
Pigment Yellow5
（０−ニトロアニリンとアクトアクタニライド
から誘導されるアゾ染料）
Basic Violet14
（アニリンとトルイジンから誘導される物質）
Pigment Orange2
（０−ニトロアニリンと２−ナフトールから誘
導されるアゾ染料）
(3) フラツクスの例
AC：無機塩化物フラツクス（粉末状）
Ｒ：非活性化ロジンフラツクス（粉末状および
プラスチツク樹脂状）
RMA：弱活性化ロジンフラツクス（粉末状お
よびプラスチツク樹脂状）
RA：活性化ロジンフラツクス（粉末状および
プラスチツク樹脂状）
および上記を溶剤にとかした液状
（発明の効果）
本発明の半田接続用部品は、示温材が直接半田
に付着しているので、示温材の変化が明瞭に観察
できるのが大きな効果である。(1) Materials of transparent or translucent heat shrink tube Cross-linked polyethylene Cross-linked nylon 6 Cross-linked EVA Cross-linked nylon 12 Cross-linked EEA Cross-linked 6.6 nylon Cross-linked flame-retardant chlorinated polyethylene Other cross-linked polyolefin mixture PVC Flame-retardant PVC PVDF ETFE (2) Temperature indicating material Examples ACid Red73 (Diazo dye derived from 2-naphthol 6,8-disulfonic acid as P-ferlazoaniline) Pigment Red3 (Azo dye derived from 2-nitro-P-toluidine and 2-naphthol) Thymol Blue Pigment Red52 (Azo dye derived from 2-amino-5-chloro-P-toluenesulfonic acid and 3-hydroxy-2-naphthoic acid) Bremocresol Green Solvent Red24 (from 4-0-tolylazo-0-toluidine and 2-naphthoic acid) Pigment Yellow5 (Azo dye derived from 0-nitroaniline and acto-actanilide) Basic Violet14 (Substance derived from aniline and toluidine) Pigment Orange2 (Substance derived from 0-nitroaniline and 2-naphthol) (3) Examples of fluxes AC: Inorganic chloride flux (powder form) R: Non-activated rosin flux (powder form and plastic resin form) RMA: Weakly activated rosin flux (powder form and plastic resin form) (resin form) RA: activated rosin flux (powder form and plastic resin form) and liquid form obtained by dissolving the above in a solvent (effects of the invention) In the solder connection parts of the present invention, the temperature indicating material is directly attached to the solder. Therefore, a major effect is that changes in the temperature indicating material can be clearly observed.
第１図は本発明の半田接続用部品の最重要部で
ある半田リングの斜視図、第２図は第１図の半田
リングを装着した収縮チユーブの使用状態を示す
もので、イはチユーブの収縮初期、ロはチユーブ
の収縮後期の説明図、第３図は従来の示温材入り
フラツクス付半田リング入り熱収縮チユーブの説
明図、第４図は第３図の使用状況図で、イは収縮
初期、ロは収縮中期、ハは収縮後期の説明図であ
る。
１……熱収縮チユーブ、２……半田リング（示
温材入りフラツクスを半田表面にコーテイングし
てある）、３……示温材入りフラツクス、４……
電線芯材、１０……本発明に係る半田リング、１
１……半田、１２……フラツクス粒、１３……示
温材。
Fig. 1 is a perspective view of the solder ring, which is the most important part of the solder connection component of the present invention, and Fig. 2 shows the shrink tube in use with the solder ring of Fig. 1 attached. Figure 3 is an explanatory diagram of a heat-shrinkable tube containing a solder ring with a flux containing a temperature indicator; Fig. 4 is a diagram of the usage situation of Figure 3; An explanatory diagram of the early stage, (b) the middle stage of systole, and (c) the late stage of systole. 1...Heat shrink tube, 2...Solder ring (flux containing temperature indicator is coated on the solder surface), 3...Flux containing temperature indicator, 4...
Electric wire core material, 10...Solder ring according to the present invention, 1
1...Solder, 12...Flux grains, 13...Temperature indicating material.
Claims (1)
縮性チユーブからなる物品であつて、前記半田部
材内にフラツクスが分散されているとともに、該
半田部材の外周表面に示温材層が設けられ、前記
熱収縮性チユーブが前記示温材の変色を少なくと
も透視できる程度に透明または半透明であること
を特徴とする半田接続用部品。1. An article consisting of a heat-shrinkable tube in which a ring-shaped solder member is attached, in which flux is dispersed within the solder member, and a temperature indicating material layer is provided on the outer peripheral surface of the solder member, A component for solder connection, wherein the heat-shrinkable tube is transparent or translucent to the extent that at least the discoloration of the temperature indicating material can be seen through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14086086A JPS62296378A (en) | 1986-06-16 | 1986-06-16 | Parts for solder connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14086086A JPS62296378A (en) | 1986-06-16 | 1986-06-16 | Parts for solder connection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62296378A JPS62296378A (en) | 1987-12-23 |
| JPH0361990B2 true JPH0361990B2 (en) | 1991-09-24 |
Family
ID=15278425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14086086A Granted JPS62296378A (en) | 1986-06-16 | 1986-06-16 | Parts for solder connection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62296378A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0159945B1 (en) * | 1984-04-13 | 1991-01-02 | Raychem Pontoise S.A. | Device for forming solder connections |
-
1986
- 1986-06-16 JP JP14086086A patent/JPS62296378A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62296378A (en) | 1987-12-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |