JPH0362288B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a coil device that is used by being attached to an electric circuit board.

(Prior Art) As a conventional coil device, one shown in FIG. 6 can be mentioned. This is made up of a coil 13 having a coil end 13a wound around the center of a winding body 12 consisting of a cylindrical core.

(Problems to be Solved by the Invention) Such a coil device 11 has various drawbacks because it is not provided with any electrode for connecting and regulating the coil terminal 13a of the coil 13. Ta. For example, this coil device 1
1 is mounted on a wiring board 14 having a rectangular notch 14a on its side, a pair of notches 12a, 12b are formed into which opposite sides of the notch 14a are inserted, respectively. The said rolling body 12
This coil device 11 is provided in advance on both end faces of the coil device 11.
After inserting the coil terminal 13a into the notch 14a, the coil terminal 13a had to be connected to the wiring layer 14b provided on the wiring board 14. In this way, the connection process is complicated in that it requires two steps: inserting the coil device 11 and connecting the coil terminals, and the connection process has to rely on manual soldering. There is a drawback that working efficiency is lowered, and since the coil 13 has an extremely thin wire diameter of 0.06 to 0.1 mm, the above drawback is exacerbated and the yield of the coil device 11 is also reduced.

Further, in such a coil device 11, since the coil terminal 13a is not regulated at a predetermined position,
It was not possible to automate the assembly work in terms of positioning to the wiring layer 14b, etc.

The present invention has been made to solve the above-mentioned problems, and is suitable for automation in the manufacturing process, improves assembly efficiency when mounting on an electric circuit wiring board, and is easily compatible with automation. The object of the present invention is to provide a coil device that can be easily mounted on a wiring board.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention has a substantially cylindrical body as a whole, has flanges at both ends, and has a coil wound around the center. flat surfaces formed at corresponding positions on the circumferential surfaces of the flanges at both ends; and a kerf formed in a direction perpendicular to the kerf, each of the kerfs being a kerf having a conductive layer made of conductive paste or metal foil applied to the inner surface of each groove; It has a configuration in which it is drawn out along each groove as a pre-soldered coil terminal.

(Function) It has parallel kerfs and a flat surface perpendicular to the kerfs, and the coil terminal is guided into the kerfs, making installation on the wiring board smooth and easy, and positioning is also easy. Since it is easy, the efficiency of assembly work can be improved, and it can be adapted to automation. Furthermore, when mounting it on a wiring board, positioning is facilitated by utilizing a flat surface.

(Example) The present invention will be specifically described below with reference to the drawings.

FIG. 1 shows the configuration of an embodiment of the coil device of the present invention,
FIG. 2 is a perspective view showing a part of a wiring board on which this coil device is mounted.

3 is a coil device which is an embodiment of the present invention.
The coil device 3 has a coiled body 3a having a flange at both ends, and a flat surface 3 on a part of the circumferential side of the flange.
It forms a substantially cylindrical body having a diameter b, and a coil 4 is wound around the center thereof. Further, grooves 3c, 3c are formed on both end surfaces of the flange portion of the winding body 3a of this coil device 3, passing through the respective centers and extending in a direction perpendicular to the flat surface 3b. Also, each kerf 3
A thin film-like conductive layer 5 is provided on the inner surface of the grooves 3c and 3c, for example, by baking a conductive paste or adhering a metal foil. Coil terminals 4a, 4a drawn out from the coil 4 are placed so as to extend over the conductive layer 5 from the flat surface 3b side of the winding body 3a. In this case, the coil terminals 4a, 4a
Preliminary solder is applied to. The heating during this preliminary soldering causes the insulating coating applied to the coil ends to peel off, exposing the conductive parts. Similarly, if necessary, heat-resistant adhesives 6, 6 are applied to the drawn-out portions of the coil terminals 4a, 4a on the flat surface 3b of the winding body 3a by appropriate means.

Next, an example of mounting the coil device 3 having the above configuration on the wiring board 1 will be described.

As shown in FIG. 1, the wiring board 1 is formed with a recess 2 having a pair of opposing sides 2a, 2a with a distance enough to insert the grooves 3c, 3c of the coil device 3. , and each of these opposing sides has electrode layers 1a, 1a extending to the end thereof.
is formed in an extended manner by printing or vapor deposition.
In addition, each cut groove 3c formed in the coil device 3,
The groove width 3c is approximately the thickness of the substrate 1 (the thickness of the electrode layer 1a is negligible with respect to the thickness of the substrate 1).
The width of the coil device 3 is set to be equal to or slightly wider than that, thereby ensuring the fixed arrangement of the coil device 3 to the substrate 1.

Then, the coil device 3 is inserted into the recess 2 of the substrate 1 so that the flat surface of the coil device 3 comes into contact with the locking surface 2c of the substrate recess. At this time, since the relative spacing and groove width of the grooves 3c, 3c of the coil device 3 are designed to fit into the recess 2 of the substrate 1, as described above, the insertion is performed smoothly. , and since the flat surface 3b and the locking surface 2c of the recess are bonded together via the heat-resistant adhesive 6, both are securely fixed, and when the device is moved for the next process. However, there is no risk that the coil device 3 will fall off from the board 1. Further, since the winding body 3a is formed with a flat surface 3b, positioning during insertion becomes extremely easy. Incidentally, during the insertion and fixation, the coil end 4a is held between the opposite side 2a of the recess 2 of the substrate 1 and the conductive layer 5 formed on the cut groove 3c of the coil device 3.

Even when performing soldering processing such as immersing the device in a solder bath in such a state, the coil device 3 is fixed, so the position does not move. Since the insulating coating applied to the coil is peeled off and the conductive part is exposed, the coil terminal and the conductive layer 5
And the electrical connection with the electrode layer 1a of the substrate is ensured.

The present invention is not limited to the embodiments described above, and various modifications are possible. For example, regarding the structure of the coil device 3, as shown in FIG. 3 and FIG.
The cutting grooves 3c formed at both ends of the groove 3c may be made wider on the flat surface 3b side, and the conductive layer 5 may be provided on the inner surface of the groove 3c to facilitate the insertion operation. Further, as shown in FIG. 5, only a portion of the conductive layer 5 formed in the cut groove 3c remains on the side opposite to the side perpendicular to the flat surface 3b, thereby simplifying the conductive layer forming operation and saving materials. Alternatively, a circular arc portion R may be provided on the extraction surface of the coil terminal 4a so that the flat surface side is deeper than the other surface to prevent disconnection of the coil terminal 4a when it is inserted into the recess of the board 1. There are ways to more reliably prevent this.

[Effects of the invention] Since the coil has parallel cut grooves and a flat surface provided perpendicularly to the cut grooves, and the coil terminal is guided into the cut groove, mounting on the wiring board becomes smooth and easy, and positioning becomes easier. This makes it easier to assemble, making assembly work more efficient and adaptable to automation.Furthermore, when mounting on a wiring board, the use of a flat surface makes positioning easier. It is possible to provide a coil device that performs the following functions.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing one example of the configuration of the coil device of the present invention and the relationship between the wiring board on which it is mounted, and FIGS. 2 to 4 are perspective views showing other embodiments of the present invention, respectively. FIG. 5 is a perspective view showing a conventional example. 3... Coil device, 3a... Winding body, 3b... Flat surface,
3c...kerf, 4...coil, 5...conductive layer.

Claims (1)

[Claims] 1. The entire body is substantially cylindrical, and has flanges at both ends,
A coiled body around which a coil is wound in the center, flat surfaces formed at corresponding positions on the circumferential surfaces of the flanges at both ends, and flat surfaces provided at the end surfaces of the flanges at their respective centers. a kerf formed in a direction perpendicular to the flat surface while passing through the section, and each kerf is a kerf whose inner surface is coated with a conductive layer made of conductive paste or metal foil;
Furthermore, a coil device in which the terminal end of the coil is pre-soldered and drawn out along each groove as a pre-soldered coil terminal. 2. The coil device according to claim 1, wherein the cut groove is formed wider on the side where the flat surface is provided. 3. The cut groove is formed to be deeper on the side where the flat surface is provided.
Coil device described in section.