JPH0362304B2 - - Google Patents
Info
- Publication number
- JPH0362304B2 JPH0362304B2 JP27844785A JP27844785A JPH0362304B2 JP H0362304 B2 JPH0362304 B2 JP H0362304B2 JP 27844785 A JP27844785 A JP 27844785A JP 27844785 A JP27844785 A JP 27844785A JP H0362304 B2 JPH0362304 B2 JP H0362304B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- edge
- circuit
- frame
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、電子機器に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to electronic equipment.
（従来の技術）
第４図および第５図に薄型電子機器の従来の実
装形態を示す。ａは上面の内側周部と下面の内側
周部とに段部ｂ，ｃをそれぞれ形成した外縁材
で、この外縁材ａの各段部ｂ，ｃに表面平滑性及
び静電気対策のための金属板ｄ，ｄをそれぞれ嵌
着し、これら外縁材ａと二枚の金属板ｄ，ｄとで
囲まれた空部内に半導体素子等の回路部品ｅ，ｅ
…が実装された回路基板ｆを収納したものであ
る。(Prior Art) FIGS. 4 and 5 show conventional mounting forms of thin electronic devices. A is an outer edge material in which stepped portions b and c are formed on the inner circumferential portion of the upper surface and the inner circumferential portion of the lower surface, respectively, and each step portion b and c of this outer edge material a is coated with metal for surface smoothness and static electricity countermeasures. The plates d and d are fitted respectively, and circuit parts e and e such as semiconductor elements are placed in the space surrounded by the outer edge material a and the two metal plates d and d.
It houses a circuit board f on which... are mounted.
上記した実装形態において、第４図は、下側の
金属板ｄの上面に接着剤ｇを塗布し、この接着剤
ｇに回路部品ｅの下側面を接着して回路基板ｆを
固定した構造のものであり、第５図は、下側の金
属板ｄの上面にハーフエツチング等により部品逃
げ部ｈを形成し、この部品逃げ部ｈに回路部品ｅ
の下端部を嵌合するとともに、下側の金属板ｄの
部品逃げ部ｈを除く上面と回路基板ｆの下面とを
接着剤ｇで接着固定した構造のものである。 In the above-mentioned mounting form, FIG. 4 shows a structure in which an adhesive g is applied to the upper surface of the lower metal plate d, and a circuit board f is fixed by bonding the lower surface of the circuit component e to the adhesive g. 5, a component relief part h is formed on the upper surface of the lower metal plate d by half etching etc., and a circuit component e is formed in this component relief part h.
The lower end portions of the lower metal plate d are fitted together, and the upper surface of the lower metal plate d excluding the component relief portion h and the lower surface of the circuit board f are bonded and fixed with an adhesive g.
（発明が解決しようとする問題点）
しかしながら、上記した構成の電子機器では、
以下に示すような問題があつた。(Problems to be solved by the invention) However, in the electronic device having the above configuration,
I had a problem as shown below.
外縁材ａの成型性により薄型化に限度があ
り、しかも使用できる材料の制約を受ける。 There is a limit to how thin it can be made due to the moldability of the outer edge material a, and there are also restrictions on the materials that can be used.
接着する範囲が狭く、しかも回路基板ｆと金
属板ｄとの間に隙間ｉを生じるため、十分な強
度が得られない。 Since the bonding area is narrow and a gap i is created between the circuit board f and the metal plate d, sufficient strength cannot be obtained.
外縁材ａを必要とするため部品点数が多く、
しかも第５図に示す構造のものではハーフエツ
チング等が必要であり、製造コストの低減化に
限度がある。 Since the outer edge material a is required, there are many parts,
Moreover, the structure shown in FIG. 5 requires half-etching, which limits the reduction in manufacturing costs.
（問題点を解決するための手段）
本発明の電子機器は、各種回路部品が実装され
た回路基板と、下面外周部に内形状が前記回路基
板の外形状と略同形状の縁部が形成され、この縁
部の内方に前記回路部品と嵌合する逃げ部が形成
されるとともに、上面に金属板が埋設された合成
樹脂製接着シートからなる上フレームと、上面外
周部に内形状が前記回路基板の外形状と略同形状
の縁部が形成され、この縁部の内方に前記回路部
品と嵌合する逃げ部が形成された合成樹脂製接シ
ートからなる下フレームとからなり、前記回路基
板が前記上フレームと下フレームとで挟持される
とともに、三者が一体的に接着固定されたもので
ある。(Means for Solving the Problems) An electronic device of the present invention includes a circuit board on which various circuit components are mounted, and an edge portion whose inner shape is approximately the same as the outer shape of the circuit board at the outer periphery of the lower surface. A relief part for fitting the circuit component is formed inside this edge, and an upper frame made of a synthetic resin adhesive sheet with a metal plate embedded in the upper surface, and an inner shape on the outer periphery of the upper surface. a lower frame made of a synthetic resin contact sheet, which has an edge having substantially the same shape as the outer shape of the circuit board, and has a relief part formed inwardly of the edge to fit with the circuit component; The circuit board is sandwiched between the upper frame and the lower frame, and the three are integrally bonded and fixed.
（作用）
上フレームの下面外周部に形成された縁部と下
フレームの上面外周部に形成された縁部、上フレ
ームの下面と回路基板の上面、および下フレーム
の上面と回路基板の下面がフレーム自体の接着力
によりそれぞれ接着され、回路基板と上下各フレ
ームとの間に隙間を生じることなく、三者が一体
的に固定される。(Function) The edge formed on the outer periphery of the lower surface of the upper frame, the edge formed on the outer periphery of the upper surface of the lower frame, the lower surface of the upper frame and the upper surface of the circuit board, and the upper surface of the lower frame and the lower surface of the circuit board They are bonded together by the adhesive strength of the frames themselves, and the circuit board and the upper and lower frames are fixed together without any gaps between them.
（実施例）
以下、本発明の一実施例を第１図ないし第３図
を参照して説明する。(Example) An example of the present invention will be described below with reference to FIGS. 1 to 3.
第１図は本発明の電子機器の構造を示してい
る。同図において、１は回路基板、２は合成樹脂
製接着シートからなる上フレーム、３は合成樹脂
製接着シートからなる下フレームである。 FIG. 1 shows the structure of an electronic device according to the present invention. In the figure, 1 is a circuit board, 2 is an upper frame made of a synthetic resin adhesive sheet, and 3 is a lower frame made of a synthetic resin adhesive sheet.
回路基板１には複数個の挿通穴４，４…が開設
されており、半導体素子等の各種回路部品５，５
…はこの挿通穴４，４…にそれぞれ挿通された形
で回路基板１に実装されている。 A plurality of insertion holes 4, 4... are formed in the circuit board 1, and various circuit parts 5, 5 such as semiconductor elements etc. are formed in the circuit board 1.
... are mounted on the circuit board 1 by being inserted into the insertion holes 4, 4, respectively.
上フレーム２は、下面外周部に内形状が前記回
路基板１の外形状と略同形状の縁部６が形成さ
れ、この縁部６の内方に前記回路部品５，５…の
上端部と嵌合する逃げ部９，９…が形成されると
ともに、上面に金属板７が埋設されてなるもので
ある。この上フレーム２は、第３図に示すよう
に、平板状の合成樹脂製接着シート８を用い、こ
の接着シートの上面に金属板７を埋設（貼り合わ
せ）する工程と、下面に縁部６および逃げ部９，
９…を形成する工程とを熱プレス成形により同時
に行うことによつて形成される。 The upper frame 2 has an edge 6 whose inner shape is approximately the same as the outer shape of the circuit board 1 on the outer circumference of the lower surface, and inside the edge 6 are formed the upper ends of the circuit components 5, 5... Relief portions 9, 9, . . . to fit are formed, and a metal plate 7 is embedded in the upper surface. As shown in FIG. 3, this upper frame 2 is constructed by using a flat synthetic resin adhesive sheet 8, embedding (bonding) a metal plate 7 on the upper surface of this adhesive sheet, and forming an edge 6 on the lower surface. and relief part 9,
It is formed by simultaneously performing the step of forming 9... by hot press molding.
また、下フレーム３は、上面外周部に内形状が
前記回路基板１の外形状と略同形状の縁部１１が
形成され、この縁部１１の内方に前記回路部品
５，５…の下端部と嵌合する逃げ部１４，１４…
が形成されるとともに、下面に金属板１２が埋設
されてなるものである。この下フレーム３は、第
２図に示すように、平板状の合成樹脂製接着シー
ト８を用い、この接着シートの下面に金属板１２
を埋設（貼り合わせ）する工程と、上面に縁部１
１および逃げ部１４，１４…を形成する工程とを
熱プレス成形により同時に行うことによつて形成
される。 Further, the lower frame 3 has an edge 11 whose inner shape is approximately the same as the outer shape of the circuit board 1 on the outer peripheral part of the upper surface, and the lower ends of the circuit components 5, 5... are formed inside this edge 11. Relief portions 14, 14...
is formed, and a metal plate 12 is embedded in the lower surface. As shown in FIG. 2, this lower frame 3 uses a flat synthetic resin adhesive sheet 8, and a metal plate 12 is attached to the lower surface of this adhesive sheet.
The process of embedding (bonding)
1 and the step of forming relief portions 14, 14, . . . are simultaneously performed by hot press molding.
なお、金属板７，１２は電子機器の表面を平滑
にするため、および静電気対策のために貼着され
ている。 Note that the metal plates 7 and 12 are attached to make the surface of the electronic device smooth and to prevent static electricity.
上記した各構成部材において、下フレーム３の
逃げ部１４，１４…に回路部品５，５…の下端部
を嵌合して、回路基板１の下面と下フレーム３の
上面とを接着し、上フレーム２に形成された逃げ
部９，９…に回路部品５，５…の上端部を嵌合し
て、回路基板１の上面と上フレーム２の下面とを
接着し、さらに、上フレーム２の縁部６と下フレ
ーム３の縁部１１とを接着して、これら回路基板
１、上フレーム２、および下フレーム３が一体的
に接着固定されてなるものである。 In each of the above-mentioned structural members, the lower ends of the circuit components 5, 5... are fitted into the relief parts 14, 14... of the lower frame 3, the lower surface of the circuit board 1 and the upper surface of the lower frame 3 are adhered, and the upper The upper ends of the circuit components 5, 5... are fitted into the relief parts 9, 9... formed in the frame 2, and the upper surface of the circuit board 1 and the lower surface of the upper frame 2 are adhered. The circuit board 1, the upper frame 2, and the lower frame 3 are integrally adhesively fixed by bonding the edge 6 and the edge 11 of the lower frame 3.
回路基板１、上フレーム２、および下フレーム
３の接着固定は、回路基板１を上フレーム２と下
フレーム３とで挟持した状態で上下両フレーム
２，３を熱プレス成形することにより同時に行わ
れる。 The circuit board 1, the upper frame 2, and the lower frame 3 are bonded and fixed at the same time by hot press molding both the upper and lower frames 2 and 3 while the circuit board 1 is held between the upper frame 2 and the lower frame 3. .
（発明の効果）
以上説明したように、本発明によれば、超薄型
の電子機器を実現することができる。また、回路
基板の上面と下面の全体を下フレームと上フレー
ムとによつて接着固定できるので、電子機器全体
の強度を向上することができる。さらに、別構成
の外縁材を必要としないので、部品点数の削減が
可能であり製造コストの低減化を図ることができ
る。(Effects of the Invention) As explained above, according to the present invention, an ultra-thin electronic device can be realized. Further, since the entire upper and lower surfaces of the circuit board can be adhesively fixed by the lower frame and the upper frame, the strength of the entire electronic device can be improved. Furthermore, since a separate outer edge material is not required, the number of parts can be reduced and manufacturing costs can be reduced.
第１図は本発明の電子機器の縦断面図、第２図
および第３図は平板上の合成樹脂製接着シートか
ら下フレームおよび上フレームを形成する工程を
模式的に示した図、第４図および第５図は従来の
電子機器の縦断面図である。
１…回路基板、２…上フレーム、３…下フレー
ム、５…回路部品、６，１１…縁部、７，１２…
金属板、９，１４…逃げ部。
FIG. 1 is a longitudinal sectional view of the electronic device of the present invention, FIGS. 2 and 3 are diagrams schematically showing the process of forming a lower frame and an upper frame from a synthetic resin adhesive sheet on a flat plate, and FIG. 1 and 5 are vertical cross-sectional views of conventional electronic equipment. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Upper frame, 3... Lower frame, 5... Circuit component, 6, 11... Edge, 7, 12...
Metal plate, 9, 14... relief part.
Claims (1)
外周部に内形状が前記回路基板の外形状と略同形
状の縁部が形成され、この縁部の内方に前記回路
部品と嵌合する逃げ部が形成されるとともに、上
面に金属板が埋設された合成樹脂製接着シートか
らなる上フレームと、 上面外周部に内形状が前記回路基板の外形状と
略同形状の縁部が形成され、この縁部の内方に前
記回路部品と嵌合する逃げ部が形成された合成樹
脂製接着シートからなる下フレームとからなり、 前記回路基板が前記上フレームと下フレームと
で挟持されるとともに、三者が一体的に接着固定
されたことを特徴とする電子機器。[Scope of Claims] 1. A circuit board on which various circuit components are mounted, and an edge whose inner shape is approximately the same as the outer shape of the circuit board is formed on the outer periphery of the lower surface, and inside this edge, the An upper frame made of a synthetic resin adhesive sheet with a relief part that fits into the circuit component and a metal plate embedded in the upper surface; and a lower frame made of a synthetic resin adhesive sheet, in which an edge is formed and a relief part for fitting the circuit component is formed inside the edge, and the circuit board is connected to the upper frame and the lower frame. An electronic device characterized by being sandwiched between the two parts and having the three parts integrally adhesively fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27844785A JPS62137858A (en) | 1985-12-11 | 1985-12-11 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27844785A JPS62137858A (en) | 1985-12-11 | 1985-12-11 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62137858A JPS62137858A (en) | 1987-06-20 |
| JPH0362304B2 true JPH0362304B2 (en) | 1991-09-25 |
Family
ID=17597463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27844785A Granted JPS62137858A (en) | 1985-12-11 | 1985-12-11 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62137858A (en) |
-
1985
- 1985-12-11 JP JP27844785A patent/JPS62137858A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62137858A (en) | 1987-06-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |