JPH0362532A - Bonding device - Google Patents

Abstract

PURPOSE:To make possible an adhesion of the bonding regions of printed boards onto a carrier by a method wherein through holes are provided in the carrier, on which the printed boards are placed and transferred, the through holes communicate with the opening of a heater block and the printed boards are held by suction. CONSTITUTION:A plurality of boards 2 to be wire bonded are placed and transferred on a carrier 1 of a wire bonding device. A plurality of through holes 4 are provided in this carrier 1 corresponding to a bonding pattern and the holes 4 communicate with an opening 7 of a heater block 6. Moreover, bonding regions of the boards 2 are reliably adhered and fixed on the carrier 1 two- dimensionally by vacuum suction through the opening 7 and a good wire bonding is executed to the flexible boards as well.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a bonding device for a printed circuit board mounted with an IC chip, and in particular, when wire bonding an IC chip and a printed circuit board on a carrier as a wire bonding jig, the wire bonding area of the printed circuit board is bonded onto the carrier. The present invention relates to a bonding device that can reliably bond two-dimensionally. This bonding device is useful for overcoming bonding difficulties caused by the flexibility of printed circuit boards when the printed circuit board is a flexible board. Even in the case of a material having some degree of flexibility, it is useful for the purpose of fixing a substrate on a carrier during bonding.

[Prior art]

Generally, in the manufacturing process of IC chip mounted printed circuit boards, when wire bonding is performed between an IC chip and a printed circuit board, in order to perform wire bonding accurately, the entire printed circuit board, especially the wire bonding area, must be placed on the carrier. It is necessary to reliably adhere and maintain a flat surface. In particular, when the printed circuit board is a flexible board, reliability is required because the board itself is highly flexible and easily deforms. Conventionally, two methods have been provided for fixing such a printed circuit board to a carrier. One of them is the pressing method shown in FIGS. 3 and 4, and the other is the vacuum suction method shown in FIG. In the holding method shown in FIGS. 3 and 4, a printed circuit board 51 with an IC chip 53 mounted at a predetermined position is placed on a carrier 52 and is pressed against the carrier 52 by a holding fitting 50. . Then, one end of each wire 54 for wire bonding is connected to the IC chip 53, and the other end thereof is connected to each terminal 55 of the wiring foil on the printed circuit board 51, as shown in FIG. On the other hand, in the vacuum suction method shown in FIG.
The support of the bonding machine, in which the carrier 52 is a vacuum suction device, is placed on a stand 56 with the printed circuit board 51 being pressed onto the carrier 52 by a presser fitting 50 similar to the presser fitting shown in FIG. career 52
A suction opening 52a is formed in the chip mounting portion. In this method, when air is sucked by the bonding machine, the printed circuit board is firmly fixed on the support 56, and wire bonding is performed after this fixation is achieved.

[Problem to be solved by the invention]

However, the conventional technology using the above-mentioned fixing method is intended for hard substrates, and has the following problems when applied to flexible substrates such as flexible substrates. That is, in the holding method, as clearly shown in FIG.
cannot be suppressed directly. In other words, the presser metal fitting 50 can only press the outer periphery of the bonding area of the printed circuit board 51. Therefore, reliable adhesion of the bonding area of the printed circuit board 51 to the carrier 52, ie, prevention of lifting, cannot be completely guaranteed. In the vacuum suction method, a suction opening 52a is formed in the carrier 52 below the IC chip 53, and a suction opening 56a is also formed in the base 56 of the bonding machine receiver. Since the conventional vacuum suction device is used for a board unit with a fixed shape, this holder is attached to the suction port 5 of the stand 56.
The position of 6a is usually located at the center of the carrier 52, and therefore the position where the printed circuit board 51 can be bonded is limited. However, flexible printed circuit boards such as those used in cameras are also used.
In the case of a printed circuit board, the shape of the board itself is complex and diverse, and limiting the position where bonding is performed on the carrier 52 is a major constraint in terms of design. In particular, since the positioning bins of the carrier 52 are different for each printed circuit board, and the shape thereof is also different, the carrier 52 is attached integrally with a corresponding mounting machine for each printed circuit board. is impossible. Furthermore, since the conventional vacuum suction device is used for a relatively small substrate unit, the suction port is only provided on the back side of the part where the IC chip is mounted. Therefore, it is not possible to completely tightly fix a large substrate such as one used in a camera. For this reason,
Particularly in the case of bonding flexible printed circuit boards for cameras, there is a technical problem in that it is difficult to employ such a vacuum suction method. The present invention has been devised in view of the problems of the prior art as described above and to effectively solve the problems. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a vacuum suction type bonding device that can securely fix printed circuit boards on a carrier even when bonding printed circuit boards of various shapes such as flexible printed circuit boards for cameras. There is a particular thing.

[Structure and operation of the invention]

In order to solve the problems of the prior art and achieve the purpose, the present invention is constructed as follows. That is, a carrier having a plurality of through holes provided corresponding to an IC mounting portion of a printed circuit board, and a heater block having an opening that covers the plurality of through holes are provided,
Vacuum suction is performed through the plurality of through holes and openings while the printed circuit board is mounted on the carrier so as to cover the through holes. If the opening provided in the heater block is designed to be sufficiently large, suction can be sufficiently performed regardless of the position of the through hole provided in the carrier. Therefore, the position of the through hole can be freely determined depending on the position of the IC mounting portion of the printed circuit board. Furthermore, by providing through holes in areas other than the IC chip and bonding areas, the entire IC mounting area can be absorbed, and sufficient flatness can be maintained even on flexible substrates such as flexible substrates. I can do it.

【Example】

A preferred embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the relationship between a printed circuit board and a carrier in an embodiment employing a bonding apparatus according to the present invention, and FIG. 2 is a cross-sectional view taken along the line ■--■ in FIG. In the figure, reference numeral 1 denotes a carrier, which is formed in the form of a belt, on which a printed circuit board 2 is placed at a predetermined location, and is moved from right to left in the diagram, and the printed circuit board 2 to which bonding is to be performed.
is transported to the bonding position, and the printed circuit board 2 after bonding is transported to the recovery side position. In addition, 8 in the figure is I
C chip, 9 is a feed reference guide hole. The printed circuit board 2 of this embodiment has a roughly square shape, has positioning holes at both diagonal ends thereof, and is placed on the carrier 1 while being fitted into the positioning pins 3 on the carrier 1. . In the area covered by the printed circuit board 2 that is positioned on the carrier 1, the positions are approximately even over the entire area so that the flatness of the printed circuit board 2 is not impaired when the printed circuit board 2 is suctioned and fixed to the carrier 1. Through holes 4 are formed at five distributed locations. Lower openings 5 of these five through-holes 4 are formed on the lower surface of the carrier 1, and a heater block 6 equipped with a suction mechanism is moved up and down from below the carrier 1 to open a lower opening in each lower opening 5. It is configured so that it can be connected and disconnected. When adopting such a configuration, the structure of the carrier 1 is simplified,
Its production is also easy. Furthermore, since the heater block 6 operates below the carrier 1, its presence does not pose any hindrance to the bonding process.

【effect】

As is clear from the above description, the present invention provides the following excellent effects. That is, since the suction openings for vacuum suction are formed at multiple positions selected according to the shape of the printed circuit board, the entire wire bonding area of the printed circuit board can be reliably brought into close contact with the carrier in a two-dimensional manner. In the case of a flexible printed circuit board, the difficulty of bonding due to the flexibility of the flexible circuit board can be overcome, and bonding can be carried out while reliably holding the printed circuit board flat on the carrier. In addition, there is no restriction due to the positional relationship between the suction opening formed in the heater block of the bonding machine and the suction opening on the carrier, and the printed circuit board is fixed by suction based only on the relationship between the printed circuit board and the carrier, so it is possible to design the shape of the printed circuit board. The degree of freedom is increased.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the relationship between a printed circuit board and a carrier in an embodiment employing a bonding apparatus according to the present invention, and FIG. 2 is a cross-sectional view taken along the line ■--■ in FIG. Figures 3 to 5 show conventional examples, Figures 3 and 4 are side views and plan views showing a method of fixing a printed circuit board on a carrier using a holding method, and Figure 5 shows a method of fixing a printed circuit board on a carrier using a vacuum suction method. FIG. 3 is a cross-sectional view of main parts showing a method of fixing on a heater block. DESCRIPTION OF SYMBOLS 1... Carrier, 2... Printed circuit board, 3... Positioning pin, 4... Through hole, 5... Lower opening of through hole, 6... Heater pro, 7... Opening, 8...IC chip, 9...Feed standard guide hole Patent applicant Minolta Camera Co., Ltd. agent

Claims (1)

[Claims] (1) In a wire bonding device in which a plurality of printed circuit boards (2) are placed on a carrier (1) and transported, a plurality of through holes (4) are provided corresponding to the bonding pattern of the board placement location. a carrier (1) and an opening (7) provided to correspond to the plurality of through holes (4);
The heater block (6) has a printed circuit board (2) placed thereon so as to cover the through hole (4), and the heater block (6) has a through hole (4) 7) A bonding apparatus characterized in that the printed circuit board (2) is vacuum-adsorbed via the bonding apparatus.