JPH0362543A - Marking of defective semiconductor device on semiconductor wafer - Google Patents

Abstract

PURPOSE:To surely mark all defective pellets by automatically recognizing marks put at the time of water measurement and making the pellet coordinates of a semiconductor wafer measuring device coincident with those of a device exclusively used for the marking. CONSTITUTION:All the pellets on a semiconductor wafer 2 taken out from a carrier 1 are measured with a probe 3 of a semiconductor wafer measuring instrument 5 and, at the same time, designated pellets are marked with a marker 4. The mapping data obtained as a measured result of the semiconductor wafer 2 are stored on a storing medium of a device 7 exclusively used for the marking. Then the wafer 2 all the pellets of which have been measured is taken out from the carrier 1 and the device 7 recognized the pellets with marks 8 put at the time of wafer measurement by using a CCD 6 and, after making the pellet coordinates at the measuring time coincident with those at the marking time, marking of the defective pellets is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for marking defective semiconductor devices on a semiconductor wafer in a semiconductor wafer inspection process.

[Conventional technology]

Conventionally, when marking with a dedicated marking device based on mapping data of defective semiconductor devices (hereinafter referred to as defective pellets), a method has been used to match the coordinates of the pellet at the time of semiconductor wafer measurement with the coordinates of the pellet at the time of marking. , if there was a target pattern on the semiconductor wafer, the target recognition function was used, but for semiconductor wafers without a target, there was no way to ensure that the coordinates matched, so the coordinates calculated by the alignment device were used as they were. I was using it.

[Problem to be solved by the invention]

The above-mentioned conventional marking method for defective pellets has the disadvantage that, for semiconductor wafers without a target pattern, the pellet coordinates of the semiconductor wafer measuring device and the pellet coordinates of the marking-only device cannot be matched reliably, and the coordinates are There was a possibility of misalignment and incorrect marking.

[Means to solve the problem]

The present invention provides a method for marking defective semiconductor devices on a semiconductor wafer in which mapping data of defective pellets on a semiconductor wafer is stored in a storage medium and marked with a dedicated marking device. After marking the specified pellet, before starting marking defective pellets using the dedicated marking device, the marks made during the semiconductor wafer measurement are automatically recognized, and the pellet coordinates and the marking device are automatically recognized by the semiconductor wafer measuring device. This is a method of marking defective semiconductor devices on a semiconductor wafer by matching the pellet coordinates with the pellet coordinates.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic diagram for explaining one embodiment of the present invention. At the time of semiconductor wafer measurement, all pellets on the semiconductor wafer 2 taken out from the carrier 1 are measured with the probe needle 3 of the semiconductor wafer measurement device 5, and designated pellets are marked with the marker 4. The pellet on the semiconductor wafer 2 with the marking marks 8 is shown in the plan view of FIG. The mapping data of this semiconductor wafer measurement result is stored in the storage medium of the marking-only device 7.

Next, the semiconductor wafer 2 on which all pellets have been measured is taken out from the carrier 1 and marked with a marking device 7.
The CD camera 6 is used to recognize the pellet with the marking mark 8 during the semiconductor wafer measurement, and after matching the pellet coordinates at the time of measurement with the pellet coordinates at the time of marking, marking of defective pellets is started with the marker 4. .

The plan view of FIG. 3 shows the semiconductor wafer 2 with a marking mark 8 on the first measured defective pellet within the specified range 9 of the measured pellets. In this case, the pellets with marking marks 8 made by the semiconductor wafer measuring device 5 are determined to be defective pellets based on the measurement data, and when the marking device 7 recognizes the defective pellets, the good pellets are marked as recognition pellets. It is possible to reliably mark defective pellets without causing any damage.

〔Effect of the invention〕

As explained above, by adopting the present invention, it is possible to mark designated chips when measuring semiconductor wafers using a system that separately has a device for measuring semiconductor wafers and a device for marking defective pellets within semiconductor wafers. This has the effect that even on a wafer without a target pattern, the pellet coordinates of the semiconductor wafer measuring device and the pellet coordinates of the marking-only device can be matched by recognizing the marked pellet during semiconductor wafer measurement.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram for explaining an embodiment of the present invention, and FIGS. 2 and 3 are plan views of a semiconductor wafer, respectively, for explaining an embodiment of the present invention. 1...Carrier, 2...Semiconductor wafer 3...
Probe needle, 4...Marker 5...Semiconductor wafer measuring device, 6...CCD camera, 7...Dedicated marking device, 8...Marking trace, 9...Specified range.

Claims (1)

[Claims] In a method for marking defective semiconductor devices on a semiconductor wafer, in which mapping data of defective pellets on a semiconductor wafer is stored in a storage medium and marked with a dedicated marking device, specified pellets on the semiconductor wafer are marked when measuring the semiconductor wafer. Then, before starting marking defective pellets with a dedicated marking device, by automatically recognizing the marks marked during the semiconductor wafer measurement, the pellet coordinates in the semiconductor wafer measuring device and the pellet coordinates in the marking device can be determined. 1. A method for marking defective semiconductor devices on a semiconductor wafer, the method comprising: matching the .