JPH0362917A - Formation of electrode of electronic component - Google Patents

Abstract

PURPOSE:To make the thickness of an electrode thin and to form a strip-shaped electrode whose end part is angular by forming two or more through slits or many through holes in a strip shape as a whole, arranging an electronic component so as to stride the through slits or the through holes, piling electrode paste to a specified height so as to exceed the upper surface of a plate material, and applying the electrode paste on the end surface of the electronic component and on one surface continued from said end surface. CONSTITUTION:In a plate material 3, a width W1 of the entire part of two or more through slits 3a or many through holes 3b is made to be a size corresponding to a width W2 of one electrode. The plate material 3 is placed on a container 4. Electrode paste 2 is stored in the container. An electronic component 1 is placed on the plate material 3 so that an end surface 1a of the electronic component 1 strides the through slits 3a. A pushing plate 5a provided in a compressing means 5 is pushed down, and the electrode paste 2 is pushed. Part of the electrode paste 2 is pushed out through the through slits 3a. The cross sectional area of each through slit or each through hole is small, and one electrode is formed with the electrode paste group having the small cross sectional area. Therefore, the increase in attaching amount of the paste can be suppressed. Even if the upper end part of the piled-up paste on the plate material becomes a round shape by surface tension, the part is small. Therefore, the thickness of the electrode can be made uniform, and the surface can be made to be an angular state.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an end surface 1a of an electronic component 1 and two surfaces lb connected thereto, as shown in FIG. 11, for example.

The present invention relates to a method for forming an electrode of an electronic component for forming a band-shaped electrode 2 on a portion 1b.

Conventionally, the electrodes mentioned above have been formed by screen printing, but when this method is used, the screen changes over time due to damage and elongation of the screen, resulting in variations in the electrode dimensions and the formed electrodes colliding with the end surface. There are problems such as misalignment between the two consecutive surfaces, and the applicant of the present application has proposed an electrode forming method that can prevent changes in the screen over time and misalignment of the electrodes (Japanese Patent Application No. 63-321629).

In this method, as shown in FIG. 12(a), a slit plate 13 in which a through slit 13a is formed with a width corresponding to the width of the electrode to be formed is positioned above the electrode paste 12 bath. 13, the electronic component 1 is placed so that the end surface 1a straddles the through slit 13a as shown in FIG.
As shown in FIG. 2(C), the electrode paste 12 is raised to a certain height beyond the top surface of the slit plate work 3, and then the electronic component 1 is removed as shown in FIG. 12(d), and As shown in e), the electrode paste 12 is formed in a strip shape on the end surface 1a of the electronic component 1 and the two surfaces lb, lb connected thereto.

However, in the case of the proposed method, one slit is used for one strip electrode, so when forming a wide electrode, , it is necessary to use a wide slit, and as a result, as the amount of electrode paste increases, the electrode, mainly the electrode portion formed on the end surface 1a, becomes thicker, or as shown in FIG. There was a problem in that the end portions of the electrode 12 portions formed on the two surfaces lb, lb were rounded due to the surface tension of the paste.

In addition, when applied to the capacitor with a fuse shown in FIG. 14 and the end of the electrode 12a is rounded, the length of the fuse wire 16 may be changed due to positional variations in the installation of the fuse wire, as shown in FIG. 15. For example, when the fuse wire 16 is installed as shown in a, the fuse wire 16 becomes long, and when installed as shown in b, the fuse wire 16 becomes short, resulting in variations in fusing characteristics.

The present invention has been made to solve such problems,
An object of the present invention is to provide a method for forming an electrode for an electronic component, which allows the thickness of the electrode to be kept relatively constant, and also allows the formation of a band-shaped electrode with angular ends.

6 2 The present invention provides a method for forming an electrode over an end surface of a plate-shaped electronic component and at least one surface connected thereto, in which two or more through slits or a large number of through holes are formed throughout one electrode. A plate material formed into a strip shape and having a width of the entire strip shape corresponding to the width of the electrode is positioned above the electrode paste bath, and an end surface is placed on the plate material so as to straddle the through slit or through hole. The method is characterized in that after or prior to arranging the electronic components, the electrode paste is heaped up to a certain height beyond the top surface of the plate material, and the electrode paste is applied to the end surface of the electronic component and at least one surface connected thereto.

In the present invention, as shown in FIG. 7 and FIG. Since there is no dimension corresponding to the width circle 2, the cross-sectional area of each through-slit or through-hole is small, and one electrode is formed by a group of electrode pastes with a small cross-sectional area inserted through the through-slits and through-holes. Therefore, it is possible to suppress the increase in the amount of adhesion of the electrode paste, and even if the upper end of the raised electrode paste on the plate material becomes rounded due to surface tension, the thickness of the electrode can be made uniform, and the surface connected to the end face of the electronic component can be made uniform. can be made into an angular state.

The present invention will be explained in detail below. FIG. 1 shows an electrode forming apparatus suitable for use in the present invention. This device consists of a plate material 3 in which a through slit 3a is formed, a container 4 on which the plate material 3 is placed and in which an electrode paste 2 bath is stored, and a pressurizer provided on the side of the container 4. When the electrode paste 2 is pressed by pressing down a pressing plate 5a provided on the pressing means 5, a part of the electrode paste 2 is pushed out from the through slit 3a.

As shown in FIG. 7, the through slits 3a are two or more,
For example, in this example, a set of four electrodes are formed into a band shape, and the overall width W thereof is formed to correspond to the width of one electrode to be formed. In addition, the plate material 3 and the container 4
The joint with the electrode paste 2 is sealed to prevent leakage of the electrode paste 2.

After completing the predetermined preparations such as heating the electrode paste 2 bath to a predetermined temperature, first, as shown in FIG. 2, the electronic component 1 is held upright by a holding member (not shown), etc.
The electronic component I is placed on the plate material 3 so that the end surface 1a of the electronic component 1 on which the electrode is to be formed straddles the through slit 3a. At this time, there may be a gap between the plate material 3 and the electronic component 1, or they may be in contact with each other.

Next, as shown in FIG. 3, the pressurizing means 5 is pressurized to push out a desired amount of the electronic component paste 2 through the through hole l-3a of the plate material 3. As a result, the electronic component paste 2 is raised on the plate material 3. At this time, since two or more through slits 3a are provided for one electrode 2 as described above, the cross-sectional area of each through slit becomes small, and as shown in FIG. Even if each upper end of the electrode paste 2 inserted through the electrode paste 2 is rounded, it can be made smaller than in the conventional case shown by the broken line, and the height can be made uniform. Then, the two groups of electrode pastes in this state contact and adhere to the end surface 1a of the electronic component 1 and the two adjacent surfaces lb, lb. In addition, when the number of electrodes (hardened electrode paste) 2 to be formed on the electronic component 1 is 2 or more, 1
A plurality of sets of two or more through slits 3a corresponding to one electrode may be formed in the plate material 3 according to the number of electrodes 2.

After that, the electronic component paste 2 on the plate material 3 is returned into the container 4, and then the electronic component 1 is lifted up as shown in FIG.

Then, as shown in FIG. 5, the electronic component 1 has two sides lb
, lb, with the ends of the electrode 2 attached to the surfaces 1a, lb being relatively angular.

A band-shaped electrode 2 having a U-shaped cross section over 1b is simultaneously formed in one electrode forming process. Note that the electronic component 1 may be lifted before the electrode paste 2 is returned into the container 4.

Here, regarding the width and spacing of each through slit 3a in one set, in cases where it is problematic that one electrode is not integrated, such as the electrode of a fused capacitor,
The dimensions are such that the electrode pastes 2 inserted through adjacent through slits 3a come into contact with each other and come together as a whole. Conversely, if such integration is not required, the electrode pastes 2 inserted through the through slits 3a may be attached to the electronic component 1 in a state where they are separated from each other, or the electrode pastes 2 may be attached to the electronic component 1 in a state where they are separated from each other. The electrode paste 2 may be attached to the electronic component l in a similar state.

Then, as shown in FIG. 6, the electrode paste 2 adhering to the upper surface of the plate material 3 is scraped off using a scraping tool 6.

This scraping is unnecessary if the electrode paste 2 is not attached to the upper surface of the plate material 3. Thereafter, the electrode forming process described above is repeated for the next electronic component.

In this embodiment, the plate material 3 is provided with through slits, but the present invention is not limited to this. For example, as shown in FIG. It is also possible to form two sets of these into strips, the overall width W of which corresponds to the width -2 of the electrode to be formed. The formation pattern of the through holes 3b is not limited to this example, but can take various other patterns.
As long as the overall width W is regulated, a random arrangement may be possible.

Further, in this embodiment, the electronic component 1 is placed on the plate material 3 first, and then the electrode paste 2 is extruded onto the plate material 3, but in the present invention, the electrode paste 2 is first extruded onto the plate material 3, The electronic component 1 may later be placed on the plate material 3 on which the electrode paste 2 is piled up to form the electrode 2.

In the embodiment described above, the pressurizing means 5 is provided on the side surface of the container 4 to push the electrode paste 2 onto the plate material 3, but the present invention is not limited to this. As shown, the container 4 is placed inside the vacuum case 7, etc., and the tube 8 provided to communicate with the container 4 is taken out to the outside of the vacuum case 7, etc., and the inside of the vacuum case 7, etc. is connected to a vacuum pump (not shown). The electrode paste 2 may be drawn up onto the plate material 3 by suction and pressure reduction (indicated by an open arrow). Further, as shown in FIG. 10, a side plate 9 is placed around the plate 3 so that the upper end thereof is higher than the upper surface of the plate 3.
The electrode 2 may be formed on the electronic component 1 by attaching such a plate material 3 to the electrode paste 2 bath and causing the electrode paste 2 to bulge at a constant height from the through slit 3a.

Further, in the above embodiment, the electronic component 1 is placed directly on the plate material 3, but the present invention is not limited to this. You may try to increase the quality. Increasing the adhesion in this manner has the advantage that spreading of the electrode paste attached to the electronic component 1 during application due to wetting can be suppressed, and the staining of the plate material 3 can also be reduced.

Furthermore, the present invention provides a structure in which a large number of electronic components 1 are mounted on the plate material 3.
By arranging them to form electrodes, multi-processing is possible.

In addition, here, the end surface 1a and the two surfaces lb, l connected to this end surface 1a.
An example is given when forming an electrode on surface b, but the two surfaces l
A similar effect can be obtained when electrodes are formed on one of the surfaces b and lb and the end surface 1a.

As detailed above, in the case of the present invention, the entire width of two or more through slits or a large number of through holes formed in a band shape does not have a size corresponding to the width of one electrode. Therefore, the cross-sectional area of each through-slit or through-hole is small, and one electrode is formed by a group of electrode pastes with a small cross-sectional area that are inserted through the through-slits and through-holes. Also, even if the upper end of the raised electrode paste 4° on the plate becomes rounded due to surface tension, it is small.
The thickness of the electrode can be made uniform, and the surface connected to the end face of the electronic component can be made angular.

Further, in a capacitor with a fuse in which an electrode is formed by applying the present invention, there are effects such as being able to prevent variations in fusing characteristics.

[Brief explanation of drawings]

Fig. 1 is a longitudinal cross-sectional view showing an electrode forming apparatus suitable for carrying out the present invention, Fig. 2.3.4 is a longitudinal cross-sectional view showing an implementation state of the present invention, and Fig. 5 is a longitudinal cross-sectional view showing an electrode forming apparatus suitable for carrying out the present invention. FIG. 6 is a perspective view showing a state in which a scraping operation is being performed in conjunction with the present invention, and FIG. Plan view shown, No. 9,
10 is a sectional view and a perspective view showing another embodiment of the present invention, FIG. 11 is a perspective view showing the shape of an electrode formed on an electronic component, FIG. 12 is an explanatory diagram of a conventional electrode forming method, and FIG. Figures 1 through 15 are explanatory diagrams of problems caused by the conventional electrode forming method. 1... Electronic component, la... End surface, 1b... End surface 1
Surface connected to a, 2... Electrode (and electrode paste), 3
Plate material, 3a... Through slit, 3b... Through hole, 4... Container, 5... Pressurizing means, 7... Vacuum case.

Claims (1)

[Claims] (1) In a method of forming an electrode over an end surface of a plate-shaped electronic component and at least one surface connected thereto, two or more through slits or a large number of through holes are formed in a band shape as a whole for one electrode, and positioning a plate material whose entire strip width corresponds to the width of the electrode above the electrode paste bath, and arranging electronic components on this plate material so that the end surface straddles the through slit or through hole, A method for forming an electrode for an electronic component, the method comprising: thereafter or prior to this, applying the electrode paste to a certain height beyond the top surface of the plate material, and applying the electrode paste to the end surface of the electronic component and at least one surface connected thereto.