JPH0362952A - Surface mounting type glass container for electronic component - Google Patents

Abstract

PURPOSE:To increase the mechanical strength of the junction part between glass and a seal ring remarkably by forming a surrounding recess groove at the junction plane between the seal ring and a bottom plate. CONSTITUTION:A surrounding recess groove 11a is formed at one side surface of a seal ring 11 by mechanical machining and the like. Glass is heated and melted, and a bottom plate 12 in a flat plate shape or a shape having a recessed cross section is molded. When the glass is solidified, one side surface of the seal ring wherein the recess groove 11a is formed is fixed. A metal cap 13 is mounted on the other side surface of the seal ring 11. The container is sealed in an airtight manner by seam welding. Since the recess groove 11a is formed at the junction plane between the seal ring 11 and the bottom plate 12, the junction area can be made remarkably large. Therefore, the sufficient junction area is obtained even in the compact container. Since the peripheral part of the bottom part is coupled into the groove part 11a, sufficient junction strength can be obtained. Damages are not received by heating when the seam welding is performed.

Description

Detailed Description of the Invention (Technical Field of the Invention) The present invention relates to a surface-mounted glass container for electronic components.
In particular, it relates to improvements in the attachment structure between the seal ring and the bottom plate.

(Technical Background of the Invention and Problems thereof) Recently, surface-mounted components have been widely used in various electronic components for the purpose of automating assembly processes and increasing packaging density.

For this reason, even surface-mounted crystal resonators are manufactured. FIG. 2 is a perspective view showing an example of a conventional container for a crystal resonator of this type, and FIG. 3 is a sectional view.

In the figure, 1 is a metal seal ring formed into a substantially rectangular shape. A bottom plate 2 made of ceramic or the like is airtightly attached to one side of the seal ring 1 using adhesive, low-melting glass, brazing material, etc. to form a container. Note that in the case of joining using brazing material, for example, a metal film is baked onto a predetermined portion of the bottom plate 2, and the seal ring 1 is attached thereto. Furthermore, an electrode 2a for mounting on a printed circuit board or the like is formed on the outer surface of the bottom plate 2.

This container houses electronic components (not shown), such as a crystal piece whose resonant frequency is adjusted to a predetermined resonance frequency by forming electrodes on the plate surface.

Then, a metal lid 3 is placed on the other side of the seal ring 1, and a welding current is applied while a roller electrode is transferred along the periphery of the lid 3 to perform seam welding.

In order to prevent the lid 3 from shifting during welding, the peripheral edge 3a of the lid 3 facing the seal ring 1 is formed thin.

Such sea 11 welding has less adverse effects of heat on the electronic components housed inside compared to, for example, sealing with a glass lid using low melting point glass, and moreover, it uses a metal lid. Therefore, its mechanical strength is also good.

By the way, such containers in which ceramic is used for the bottom plate 2 have good adhesion to the seal ring l and are less likely to cause leakage, but ceramics have low dimensional accuracy due to large shrinkage during firing, and are also costly. There is an expensive problem.

For this reason, it is considered to use glass for the bottom plate, which has high dimensional accuracy during molding and is low in cost. It is considered that it can be molded into

However, in such a device, the strength of the joint between the glass bottom plate 2 and the seal ring 1 is low, and when the heat generated during seam welding spreads to the joint surface between the seal ring 1 and the bottom plate 2, There were problems such as peeling and cracking of the bottom plate due to thermal strain.

In order to compensate for the strength of the joint, the joint area must be widened, and for this reason, containers with small shapes have a problem in that the joint area is too small to be put to practical use.

(Object of the Invention) The present invention has been made in view of the above circumstances, and it is possible to significantly increase the mechanical strength of the joint portion between the glass and the seal ring in a container using a glass bottom plate, and to reduce the cost. The object of the present invention is to provide a surface-mounted glass container for electronic components that is inexpensive, has high dimensional accuracy, has good airtightness, and can be significantly downsized.

(Summary of the Invention) The present invention airtightly attaches a glass bottom plate to one side of a metal seal ring to form a container, stores electronic components inside, and seam-welds it to the other side of the seal ring. This is a device for airtightly welding a metal lid body by the above method, and is characterized in that a circumferential concave groove is formed on the joint surface of the seal ring with the bottom plate.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the cross-sectional view shown in FIG. 1, taking a surface-mounted container for a crystal resonator as an example.

In the figure, 11 is Kovar molded into a substantially rectangular ring shape, 42
This is a seal ring made of nickel silver, etc. and,
A circular concave groove 11a is formed on one side of the seal ring 11 by machining or the like.

Then, the glass is heated and melted to form a bottom plate 12 having a flat plate shape or a concave cross section, and when solidifying the bottom plate 12, one side of the seal ring 11 on which the groove 11a is formed is fixed. .

Moreover, an electrode 12a for mounting on a printed circuit board or the like is formed on the outer surface of the bottom plate 12.

This container houses an electronic component (not shown), such as a quartz crystal piece whose resonant frequency is adjusted to a predetermined resonance frequency by cutting and polishing a quartz crystal at a predetermined angle and forming excitation electrodes on the plate surface.

A metal lid body 13 is attached to the other side of the seal ring 11.
is placed and hermetically sealed by seam welding.

With such a configuration, the bottom plate 12 of the seal ring 11
Since the concave groove 11a is formed on the joint surface with the groove 11a, the joint area can be significantly increased, and a sufficient joint area can be obtained even in a small container. Since the parts fit in and solidify, sufficient joint strength can be obtained and there is no damage caused by heat generated during seam welding.

Note that the present invention is not limited to the above embodiments,
For example, although the above embodiment has been explained using a crystal resonator as an example, it can of course be applied to various electronic components such as filters, oscillators, and integrated circuit elements. It can also be applied to things such as bottom plates.

(Effects of the Invention) As detailed above, according to the present invention, the mechanical strength of the joint between the glass and the seal ring can be increased, the cost is low, and the electronic device can be used for small-sized products. Can you provide surface-mounted glass containers for parts?

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view showing an example of a conventional container, and FIG. 3 is a sectional view of the container shown in FIG. 2. 11...Seal ring 11a...Concave groove 12...Bottom plate 13...Lid body

Claims (1)

[Claims] A metal seal ring, a glass bottom plate airtightly attached to one side of the seal ring to form a container, electronic components housed in the container, and other than the above seal ring. a metal lid hermetically welded to the side surface by seam welding, and a surface mounting surface of an electronic component, characterized in that a circumferential groove is formed on the joint surface of the seal ring with the bottom plate. shaped glass container.