JPH0363485A - temperature control device - Google Patents

temperature control device

Info

Publication number
JPH0363485A
JPH0363485A JP1196952A JP19695289A JPH0363485A JP H0363485 A JPH0363485 A JP H0363485A JP 1196952 A JP1196952 A JP 1196952A JP 19695289 A JP19695289 A JP 19695289A JP H0363485 A JPH0363485 A JP H0363485A
Authority
JP
Japan
Prior art keywords
temperature
liquid medium
heat exchange
controlled
pressure loss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1196952A
Other languages
Japanese (ja)
Other versions
JP2691454B2 (en
Inventor
Ryuichi Ebinuma
隆一 海老沼
Eiji Sakamoto
英治 坂本
Nobutoshi Mizusawa
水澤 伸俊
Takuo Kariya
刈谷 卓夫
Shunichi Uzawa
鵜澤 俊一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP1196952A priority Critical patent/JP2691454B2/en
Priority to EP89309976A priority patent/EP0363098B1/en
Priority to DE68922061T priority patent/DE68922061T2/en
Publication of JPH0363485A publication Critical patent/JPH0363485A/en
Priority to US08/412,101 priority patent/US5577552A/en
Application granted granted Critical
Publication of JP2691454B2 publication Critical patent/JP2691454B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To enable an item of which temperature is controlled to be monitored in a high accuracy by a method wherein a pressure loss in a flow passage ranging from an isothermal water supplying means to a plurality of heat exchanging devices of which temperature is controlled is adjusted by an adjusting valve at the supplying part and another adjusting valve at a recovery side. CONSTITUTION:Liquid medium recoverying passages 12, 13 and 14 have adjusting valves 25, 24 and 23 of which flow passage resistance can be adjusted. A pressure loss is divided by arranging the adjusting valves 19 to 21 at the supplying side, a pressure and a flow rate at the heat exchanging segments 6, 7 and 8 are separately set and the pressures at each of the heat exchanging segments 6, 7 and 8 become substantially the same. With such an arrangement, a temperature increase caused by a pressure loss energy becomes the same degree and temperatures of liquid medium at each of the heat exchanging segments becomes equal to each other. An external part of a room where a temperature controlled item is mounted is provided with a heating part of an isothermal liquid medium supplying means to reduce a temperature variation caused by an external influence on the temperature controlled item.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、半導体露光装置等において用いられる温度制
御装置であって、液媒を利用して被温度制御部の温度を
精密に制御するようにした温度制御装置に関するもので
ある。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a temperature control device used in semiconductor exposure equipment, etc., which uses a liquid medium to precisely control the temperature of a temperature-controlled part. The present invention relates to a temperature control device.

[従来の技術] 従来、精密な寸法管理を要求される半導体露光装置等の
装置においては、温度管理が重要な問題となっており、
例えば露光装置のウェハやマスクの温度管理に関する提
案は数多くなされている。
[Prior Art] Conventionally, temperature control has been an important issue in equipment such as semiconductor exposure equipment that requires precise dimensional control.
For example, many proposals have been made regarding temperature control of wafers and masks in exposure equipment.

特に、液媒を用いた温度管理は、熱伝達率が大きくとれ
ることから制御性が良く実用性が高いという利点があり
、従来より広く用いられている。
In particular, temperature control using a liquid medium has the advantage of good controllability and high practicality due to its large heat transfer coefficient, and has been widely used in the past.

[発明が解決しようとする課題] しかしながら、温度制御対象を精密に温度管理された液
媒と熱的に結合させることによって温度制御させる装置
において、0.01℃程度の精度をもって温度管理する
場合には、恒温液媒供給源から温度制御対象の熱交換部
に至るまでの液媒流路の圧力損失は熱的に無視できない
問題となる。
[Problems to be Solved by the Invention] However, in a device that performs temperature control by thermally coupling a temperature-controlled object with a precisely temperature-controlled liquid medium, it is difficult to control the temperature with an accuracy of about 0.01°C. In this case, the pressure loss in the liquid medium flow path from the constant temperature liquid medium supply source to the heat exchange section whose temperature is to be controlled becomes a thermal problem that cannot be ignored.

例えば、断熱されにチューブを通して水を供給する場合
に、流路の圧力損失を0.5にgf/c1としてこの損
失エネルギーがすべて水の温度上昇になるとすれば、温
度上昇は0.012℃となる。また、複数の温度制御対
象がそれぞれ異なる位置にあり、液媒の通過する流路形
状および流路長がそれぞれ異なるとすれば、これらそれ
ぞれの流路に対して流路損失分による温度上昇の違いが
発生することとなる。したがって、各温度制御対象を同
一温度に制御する場合でも、この流路損失分による温度
上昇の違いのために、精密な温度制御ができなくなって
しまうという欠点があった。
For example, when water is supplied through an insulated tube, if the pressure loss in the flow path is set to 0.5 gf/c1 and all of this lost energy becomes a temperature rise in the water, the temperature rise will be 0.012°C. Become. Furthermore, if multiple temperature control targets are located at different locations, and the flow path shapes and lengths through which the liquid medium passes are different, the temperature rise for each of these flow paths will be different due to the flow path loss. will occur. Therefore, even when controlling each temperature-controlled object to the same temperature, there is a drawback that precise temperature control cannot be performed due to the difference in temperature rise due to the flow path loss.

すなわち、±0.01を程度の精度で複数の温度制御対
象の温度を管理するためには、このような温度制御系臼
らがもつ発熱弁が問題となっていた。
That is, in order to manage the temperatures of a plurality of temperature controlled objects with an accuracy of ±0.01, the heat generating valves of such temperature control system mortars have become a problem.

このために、温度制御装置自身社温度センサーを設置し
、その温度出力によって1つ1つの温度制御対象を個別
に制御する方法があるが、高精度なフィードバック制御
装置を複数個用意しなければならないという欠点があっ
た。
For this purpose, there is a method of installing the temperature control device's own temperature sensor and controlling each temperature control target individually based on its temperature output, but this requires the preparation of multiple highly accurate feedback control devices. There was a drawback.

また、温度制御対象を高精度に温度管理するために、温
度制御対象は一定の温度に管理された恒温室に設置され
る場合が一般的であり、その場合恒温室内の温度管理を
精度良く実現する為には、恒温室内の発熱を小さくする
のが望ましいのであるが、この際に、温度制御装置自身
の発熱は無視できない問題となる。
In addition, in order to control the temperature of the temperature controlled object with high precision, the temperature controlled object is generally installed in a constant temperature room that is controlled at a constant temperature, and in this case, temperature control within the constant temperature room can be achieved with high precision. In order to do this, it is desirable to reduce the heat generated within the constant temperature room, but in this case, the heat generated by the temperature control device itself becomes a problem that cannot be ignored.

本発明の目的は、このような従来技術の問題点に鑑み、
温度制御装置において、簡単な構成により複数の対象に
ついて高精度な温度制御が行なえるようにすることにあ
る。
In view of the problems of the prior art, an object of the present invention is to
An object of the present invention is to enable highly accurate temperature control of a plurality of objects with a simple configuration in a temperature control device.

[課題を解決するための手段] 上記目的を達成するため本発明の温度制御装置は、一定
の恒温液媒を供給する手段と、該供給手段から供給され
た恒温液媒を複数の流路に分配する分配手段と、分配手
段により恒温液媒が分配されるそれぞれの流路に設けら
れた熱交換部と、熱交換部の上流側と下流側とに設けら
れ、分配手段から熱交換部までの流路抵抗を調節する手
段とを備えるようにしている。
[Means for Solving the Problems] In order to achieve the above object, the temperature control device of the present invention includes a means for supplying a constant temperature liquid medium, and a constant temperature liquid medium supplied from the supply means to a plurality of channels. A distribution means for distributing, a heat exchange section provided in each flow path to which the constant temperature liquid medium is distributed by the distribution means, and a heat exchange section provided on the upstream and downstream sides of the heat exchange section, from the distribution means to the heat exchange section. and means for adjusting the flow path resistance.

また、恒温液媒を供給する手段である恒温液媒供給装置
の主要発熱部は、極力、温度制御される装置が設置され
る室の外部に設置するようにしている。
Further, the main heat generating part of the constant temperature liquid medium supply device, which is a means for supplying the constant temperature liquid medium, is installed as far as possible outside the room in which the temperature-controlled device is installed.

[作用] この構成において、複数の温度制御対象に対応して分配
された複数流路の恒温液媒に対し、各流路抵抗調節手段
によって流量と熱交換部に至る圧力損失とが個別に調節
され、これによって複数の温度制御対象それぞれの液媒
流路の圧力損失エネルギーに起因する液媒温度のばらつ
きが補正される。
[Function] In this configuration, the flow rate and pressure loss reaching the heat exchange section are individually adjusted by each flow path resistance adjustment means for the constant temperature liquid medium distributed in multiple flow paths corresponding to multiple temperature control targets. As a result, variations in liquid medium temperature caused by pressure loss energy in the liquid medium flow paths of each of the plurality of temperature controlled objects are corrected.

また、温度制御対象が設置される室の外部に恒温液媒供
給手段の主要発熱部を設置することにより、温度制御対
象の外部の影響に起因する温度変動が小さくなる。
Moreover, by installing the main heat generating part of the constant-temperature liquid medium supply means outside the chamber in which the temperature controlled object is installed, temperature fluctuations caused by external influences on the temperature controlled object are reduced.

[実施例] 以下、図面を用いて本発明の詳細な説明する。[Example] Hereinafter, the present invention will be explained in detail using the drawings.

第1図は、本発明の一実施例心係る温度制御装置の概念
図である。同図において、1は例えば±0.01℃の精
度に温度管理された一定温度および一定流量の恒温液媒
を供給する恒温液媒供給装置である。また、3,4.5
はそれぞれ異なる場所に配置された温度制御対象、6,
7.8はそれぞれの温度制御対象と液媒との熱伝達率が
高くなるように構成された熱交換部、9.to、ttは
断熱チューブで形成された液媒供給路、12.13゜1
4は断熱チェーブで形成された液媒の回収流路である。
FIG. 1 is a conceptual diagram of a temperature control device according to an embodiment of the present invention. In the figure, reference numeral 1 denotes a constant temperature liquid medium supply device that supplies a constant temperature liquid medium whose temperature is controlled to an accuracy of, for example, ±0.01° C. and at a constant flow rate. Also, 3,4.5
are temperature controlled targets placed at different locations, 6,
7.8 is a heat exchange section configured to increase the heat transfer coefficient between each temperature controlled object and the liquid medium; 9. to, tt are liquid medium supply paths formed by heat insulating tubes, 12.13゜1
Reference numeral 4 denotes a liquid medium recovery flow path formed by a heat insulating tube.

これらの液媒供給路9.10.11、熱交換部6,7.
8および液媒の回収流路12゜13.14はそれぞれ(
流れる液媒の流量や流路の形状によって圧力損失が異な
っている場合がある。18および22は精密恒温液媒供
給装置1から複数の温度制御対象の熱交換部6,7.8
へ液媒を分配するための分配器である。分配器18内に
は温度センサ26が設置されており、この温度センサ2
6の示す温度が常に一定であるように恒温液媒供給装置
1が制御される。19,20.21は、液媒供給路9.
to、tt中に設けられた調整弁であり、23,24.
25は液媒回収路14.13.12中に設けられた調整
弁である。
These liquid medium supply channels 9, 10, 11, heat exchange sections 6, 7.
8 and the liquid medium recovery channel 12, 13, and 14, respectively (
Pressure loss may vary depending on the flow rate of the flowing liquid medium and the shape of the flow path. 18 and 22 are heat exchange parts 6, 7.8 for controlling multiple temperatures from the precision constant-temperature liquid medium supply device 1.
This is a distributor for distributing liquid medium to. A temperature sensor 26 is installed in the distributor 18, and this temperature sensor 2
The constant temperature liquid medium supply device 1 is controlled so that the temperature indicated by 6 is always constant. 19, 20.21 are liquid medium supply paths 9.
It is a regulating valve provided in to, tt, and 23, 24.
25 is a regulating valve provided in the liquid medium recovery path 14, 13, 12.

このように構成された温度制御装置において、それぞれ
の熱交換部6,7.8には温度制御対象で発熱する熱を
速やかに取りざるのに十分な流量の液媒を流すことによ
って、温度制御対象の温度の安定化を図っている。その
際、温度制御対象3.4.5はそれぞれ発熱の程度が異
なっているので、液媒の供給を効率よく行なうには、そ
れぞれの発熱の程度に応じて、適切に設計された熱交換
部6,7,81.:適切な流量の液媒を流す必要がある
。そしてこのためには、分配器18から熱交換部6,7
.8に至る流路中に、流量調整用の調整弁を第2図に示
すように、液媒供給路9゜10.11中の調整弁19,
20.21として設けるだけでよく、液媒回収路中の調
整弁23゜24.25は必要ないと考えられる。ところ
が、この場合、分配器1Bから熱交換部6,7.8に至
るまでの圧力損失は異なってくる。
In the temperature control device configured in this way, temperature control is performed by flowing a liquid medium at a flow rate sufficient to quickly remove the heat generated by the temperature controlled object through each of the heat exchange parts 6, 7.8. Efforts are being made to stabilize the temperature of the target. At this time, since the temperature controlled objects 3.4.5 each have different degrees of heat generation, in order to efficiently supply the liquid medium, it is necessary to appropriately design the heat exchange section according to the degree of heat generation of each object. 6,7,81. : It is necessary to flow the liquid medium at an appropriate flow rate. And for this purpose, from the distributor 18 to the heat exchange parts 6, 7
.. As shown in FIG.
It is considered that the adjustment valve 23°24.25 in the liquid medium recovery path is not necessary. However, in this case, the pressure loss from the distributor 1B to the heat exchange sections 6, 7.8 will be different.

すなわち、調整弁19.20.21によって流路抵抗を
調整することによって、それぞれ適切な流量に設定され
た液媒は、分配器18から、液媒供給路9,10,11
、調整弁19,20゜21、熱交換部6,7,8、およ
び液媒回収流路12.13.14を経て分配器22に至
るまでの流路を通過する際に流路の圧力がそれぞれの流
路で異なった様子で下がっていくのである。第3図はこ
の様子を示すものであり、図中の3本の折れ線は各経路
における圧力変化を示している。
That is, by adjusting the flow path resistance with the regulating valves 19, 20, and 21, the liquid medium whose flow rate is set to an appropriate value is transferred from the distributor 18 to the liquid medium supply paths 9, 10, 11.
, regulating valves 19, 20° 21, heat exchange sections 6, 7, 8, and liquid medium recovery channels 12, 13, and 14 to reach distributor 22, the pressure in the channel increases. It descends in different ways in each channel. FIG. 3 shows this situation, and the three broken lines in the figure show pressure changes in each path.

同図に示されるように、熱交換部6.7.8での圧力は
、それぞれの経路で異なっており、分配器18での液媒
の温度は同一であるため、圧力損失エネルギーに起因す
る液媒の温度上昇によって熱交換部での液媒の温度はそ
れぞれ異なることになる。この温度上昇は、液媒が水の
場合、圧力損失0.5kg/c1あたりで0.012℃
であり、±0.01tの精度で温度制御するためには無
視できない値となる。
As shown in the figure, the pressure in the heat exchange section 6.7.8 is different in each path, and the temperature of the liquid medium in the distributor 18 is the same, so the pressure is due to pressure loss energy. The temperature of the liquid medium in the heat exchange section differs depending on the temperature rise of the liquid medium. This temperature rise is 0.012℃ per pressure loss of 0.5kg/c1 when the liquid medium is water.
This is a value that cannot be ignored in order to control the temperature with an accuracy of ±0.01t.

そこで、第1図に示すように、液媒回収路12.13.
14中にも流路抵抗が調整できる調整弁25,24.2
3を設け、供給側(上流側)と回収側(下流側)の調整
弁19〜21と23〜25を用いて圧力損失を振り分け
ることにより、熱交換部6,7.8での圧力と流量とを
個別に設定することができるようにしたのである。この
ようにした場合の各経路における圧力変化の様子を第4
図に示す、熱交換部の上流と下流にある調整弁によって
、各熱交換部での圧力がほぼ同じになるように設定しに
場合を示している。
Therefore, as shown in FIG. 1, liquid medium recovery channels 12, 13.
Adjustment valves 25, 24.2 that can adjust flow path resistance even during 14
3, and distributes the pressure loss using regulating valves 19 to 21 and 23 to 25 on the supply side (upstream side) and recovery side (downstream side), thereby controlling the pressure and flow rate in the heat exchange sections 6 and 7.8. This allows them to be set individually. The state of pressure change in each path in this case is shown in the fourth section.
The figure shows a case in which the pressures in each heat exchange section are set to be approximately the same using regulating valves located upstream and downstream of the heat exchange section.

これによれば、各熱交換部6,7.8に至るまでの圧力
損失が、それぞれの経路で同じ程度になるので、圧力損
失エネルギーに起因する温度上昇も同じ程度になり、そ
れぞれの熱交換部6,7゜8での液媒の温度が等しくな
る。
According to this, the pressure loss up to each heat exchange part 6, 7.8 is the same in each path, so the temperature rise due to pressure loss energy is also the same, and each heat exchanger The temperatures of the liquid medium at portions 6, 7 and 8 become equal.

なお、第4図では、それぞれの熱交換部での液媒の圧力
が同じになる場合について示したが、1つの経路につき
、供給側と回収側の双方の調整弁のバランスを変えるこ
とにより、液媒の流量を変えることなく熱交換部での圧
力が調整できるため、圧力損失エネルギーに起因する温
度上昇を利用して、熱交換部での液媒温度を変えること
もできる。
Although Fig. 4 shows the case where the pressure of the liquid medium in each heat exchange section is the same, by changing the balance of the regulating valves on both the supply side and the recovery side for one route, Since the pressure in the heat exchange section can be adjusted without changing the flow rate of the liquid medium, it is also possible to change the temperature of the liquid medium in the heat exchange section by utilizing the temperature rise caused by pressure loss energy.

ところで、温度制御対象となる装置全体27は外部から
の温度の影響を小さくするために、通常は、温度が一定
に制御された恒温室28内に設置される。この恒温室を
精度よく恒温状態に保つためには、恒温室内の発熱は小
さい方が望ましいのであるが、恒温液媒供給装置1は、
送水ポンプ、高温の1次冷却水の排出路等、大きな発熱
源を含んでいる。そこで、第1図に示すように、これら
の発熱源を含む恒温液媒供給装置1部分を恒温室28の
外部に配置して、恒温液媒供給装置1の発熱源からの熱
の影響を小さくするようにしている。恒温室28は空調
された室であってもよいし、単純に仕切りによって覆わ
れた空間であってもよいし、また、精密な恒温チャンバ
ーであってもよい。
By the way, in order to reduce the influence of temperature from the outside, the entire device 27 that is subject to temperature control is usually installed in a constant temperature room 28 where the temperature is controlled to be constant. In order to accurately maintain a constant temperature in this constant temperature chamber, it is desirable that the heat generation inside the constant temperature chamber is small, but the constant temperature liquid medium supply device 1
It contains large heat sources such as water pumps and high temperature primary cooling water discharge channels. Therefore, as shown in FIG. 1, the part of the constant temperature liquid medium supply device 1 that includes these heat sources is placed outside the constant temperature room 28 to reduce the influence of heat from the heat source of the constant temperature liquid medium supply device 1. I try to do that. The thermostatic chamber 28 may be an air-conditioned room, a space simply covered by a partition, or a precise thermostatic chamber.

[発明の効果] 以上説明したように本発明によれば、恒温水供給手段か
ら複数の温度制御対象の熱交換部に至る流路の圧力損失
を、供給側と回収側の双方の調整弁によって調整できる
ようにしたため、この圧力損失に起因する各熱交換部で
の温度のばらつきを個々に補正することによって1つの
精密恒温水供給手段により複数の温度制御対象を高精度
で管理することが簡単な構成で可能になる。
[Effects of the Invention] As explained above, according to the present invention, the pressure loss in the flow path from the constant temperature water supply means to the plurality of temperature-controlled heat exchange units can be reduced by the regulating valves on both the supply side and the recovery side. Since it can be adjusted, temperature variations in each heat exchange section caused by this pressure loss can be individually corrected, making it easy to manage multiple temperature control targets with high accuracy using one precision constant temperature water supply means. This is possible with this configuration.

また、精密恒温水供給手段の主要発熱部を、温度制御対
象全体が設置される空間から隔てることにより、それら
発熱部の影響が排除されるため、温度制御のより高精度
化を図ることができる。
In addition, by separating the main heat generating parts of the precision constant temperature water supply means from the space where the entire temperature control target is installed, the influence of these heat generating parts is eliminated, making it possible to achieve higher precision in temperature control. .

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明を実施した温度制御装置の概念図、 第2図は、圧力調整弁がない従来の場合の温度制御装置
の概念図、 第3図は、圧力調整ができない従来の場合の流路の圧力
損失の様子を示す説明図、そして第4図は、圧力調整さ
れた第1図の場合の流路の圧力損失の様子を示す説明図
である。 1:恒温液媒供給装置、 2:液媒供給出口、 3.4,5:温度制御対象、 6.7.B:熱交換部、 9.10,11:液媒供給路、 12.13,14:液媒回収路、 19.20,21 :上流側調整弁、 27:温度制御対象となる装置、 23.24,25:下流側調整弁、 18.22:分配器、 26:温度センサー 28:恒温室。 ・嵯樵(屯R 望 く曳や畦や 区 手続補正書(。え) 平成元年 8月29日
Fig. 1 is a conceptual diagram of a temperature control device embodying the present invention. Fig. 2 is a conceptual diagram of a conventional temperature control device that does not have a pressure regulating valve. Fig. 3 is a conceptual diagram of a conventional temperature control device that does not have a pressure regulation valve. FIG. 4 is an explanatory diagram showing the state of pressure loss in the flow path in the case of FIG. 1 in which the pressure is adjusted. 1: Constant temperature liquid medium supply device, 2: Liquid medium supply outlet, 3.4, 5: Temperature controlled object, 6.7. B: heat exchange section, 9.10, 11: liquid medium supply path, 12.13, 14: liquid medium recovery path, 19.20, 21: upstream side regulating valve, 27: device to be temperature controlled, 23. 24, 25: Downstream regulating valve, 18.22: Distributor, 26: Temperature sensor 28: Constant temperature room.・Sagaki (tun R Mokuhiki, ridge and ward procedure amendment form (.e) August 29, 1989

Claims (2)

【特許請求の範囲】[Claims] (1)一定の恒温液媒を供給する手段と、該供給手段か
ら供給された恒温液媒を複数の流路に分配する分配手段
と、分配手段により恒温液媒が分配されるそれぞれの流
路に設けられた熱交換部と、熱交換部の上流側と下流側
とに設けられ、分配手段から熱交換部までの流路抵抗を
調節する手段とを具備することを特徴とする温度制御装
置。
(1) A means for supplying a constant temperature liquid medium, a distribution means for distributing the constant temperature liquid medium supplied from the supply means to a plurality of flow paths, and each flow path to which the constant temperature liquid medium is distributed by the distribution means. A temperature control device comprising: a heat exchange section provided in the heat exchange section; and means provided on the upstream and downstream sides of the heat exchange section to adjust flow path resistance from the distribution means to the heat exchange section. .
(2)恒温液媒供給装置を備え、そこから供給する液媒
によって他の装置の温度を制御する温度制御装置であっ
て、恒温液媒供給装置の主要発熱部は、温度制御される
装置が設置される室の外部に設置されていることを特徴
とする温度制御装置。
(2) A temperature control device that includes a constant-temperature liquid medium supply device and controls the temperature of other devices using the liquid medium supplied from the device, and the main heat generating part of the constant-temperature liquid medium supply device is connected to the device whose temperature is being controlled. A temperature control device characterized in that it is installed outside the room in which it is installed.
JP1196952A 1988-10-03 1989-07-31 Temperature control device Expired - Fee Related JP2691454B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1196952A JP2691454B2 (en) 1989-07-31 1989-07-31 Temperature control device
EP89309976A EP0363098B1 (en) 1988-10-03 1989-09-29 Temperature controlling device
DE68922061T DE68922061T2 (en) 1988-10-03 1989-09-29 Device for regulating the temperature.
US08/412,101 US5577552A (en) 1988-10-03 1995-03-28 Temperature controlling device for mask and wafer holders

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1196952A JP2691454B2 (en) 1989-07-31 1989-07-31 Temperature control device

Publications (2)

Publication Number Publication Date
JPH0363485A true JPH0363485A (en) 1991-03-19
JP2691454B2 JP2691454B2 (en) 1997-12-17

Family

ID=16366387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1196952A Expired - Fee Related JP2691454B2 (en) 1988-10-03 1989-07-31 Temperature control device

Country Status (1)

Country Link
JP (1) JP2691454B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03121400A (en) * 1989-10-03 1991-05-23 Nec Corp Refrigerant supply device to liquid cooling electronic equipment
JP2004511754A (en) * 2000-05-19 2004-04-15 ユニシス コーポレイシヨン System for regulating the temperature of an IC chip with the fluid being heated and cooled as a function of the fluid temperature to and from the heat exchanger for the IC chip

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62119620A (en) * 1985-11-20 1987-05-30 Fujitsu Ltd Constitution system for cooling water supply equipment
JPH02197775A (en) * 1989-01-27 1990-08-06 Koufu Nippon Denki Kk Control system with valve opening and closing state detecting function for cooling device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62119620A (en) * 1985-11-20 1987-05-30 Fujitsu Ltd Constitution system for cooling water supply equipment
JPH02197775A (en) * 1989-01-27 1990-08-06 Koufu Nippon Denki Kk Control system with valve opening and closing state detecting function for cooling device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03121400A (en) * 1989-10-03 1991-05-23 Nec Corp Refrigerant supply device to liquid cooling electronic equipment
JP2004511754A (en) * 2000-05-19 2004-04-15 ユニシス コーポレイシヨン System for regulating the temperature of an IC chip with the fluid being heated and cooled as a function of the fluid temperature to and from the heat exchanger for the IC chip

Also Published As

Publication number Publication date
JP2691454B2 (en) 1997-12-17

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