JPH036365A - Sputtering device - Google Patents
Sputtering deviceInfo
- Publication number
- JPH036365A JPH036365A JP14194389A JP14194389A JPH036365A JP H036365 A JPH036365 A JP H036365A JP 14194389 A JP14194389 A JP 14194389A JP 14194389 A JP14194389 A JP 14194389A JP H036365 A JPH036365 A JP H036365A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vacuum chamber
- adhesion prevention
- peripheral wall
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 230000008020 evaporation Effects 0.000 claims description 28
- 238000001704 evaporation Methods 0.000 claims description 28
- 230000002265 prevention Effects 0.000 claims description 28
- 238000012423 maintenance Methods 0.000 abstract description 16
- 230000008021 deposition Effects 0.000 abstract 4
- 230000008016 vaporization Effects 0.000 abstract 4
- 238000009834 vaporization Methods 0.000 abstract 4
- 230000000181 anti-adherent effect Effects 0.000 description 4
- 230000003373 anti-fouling effect Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000037237 body shape Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、真空槽の壁面に蒸発源を設けているスパッタ
リング装置において、蒸発物が基板面以外の真空槽内壁
に付着するのを防ぐために設ける防着板に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to a sputtering apparatus in which an evaporation source is provided on the wall of a vacuum chamber, in order to prevent evaporated substances from adhering to the inner wall of the vacuum chamber other than the substrate surface. This relates to an anti-adhesion plate to be provided.
［従来の技術及びその問題点］
真空槽壁面に蒸発源を設けているスパッタリング装置に
おいては、蒸発物が基板面上だけに付着し、それ以外の
真空槽内壁には付着しないようにする防着板を、蒸発源
と基板面との間に設けることは公知である。[Prior art and its problems] In a sputtering apparatus in which an evaporation source is provided on the wall of a vacuum chamber, adhesion prevention is required to prevent evaporated matter from adhering only to the substrate surface and not to the other inner walls of the vacuum chamber. It is known to provide a plate between an evaporation source and a substrate surface.
従来例を第３図及び第４図に示したが、これは搬送キャ
リア（８）によって基板（７）を立てた状態で移動させ
ながら、真空槽（１）の両壁面に設けた蒸発源（２）か
ら基板（７）の両面にスパッタリングによって膜（１７
）を形成させる縦型スパッタリング装置である。図では
省略されているが真空槽には排気用の真空ポンプが接続
されている。A conventional example is shown in FIGS. 3 and 4, in which the substrate (7) is moved in an upright state by a transport carrier (8) while the evaporation sources ( 2) to both sides of the substrate (7) by sputtering.
) is a vertical sputtering device that forms Although not shown in the figure, a vacuum pump for evacuation is connected to the vacuum chamber.
従来例をさらに詳しく説明すると、第３図はスパッタリ
ング蒸発源を真空槽の内面から見た斜視図、第４図はそ
の断面図である。構成は左右対称に２組設けられている
ので、以下の説明はその一方だけについてするが、他方
についても同様である。To explain the conventional example in more detail, FIG. 3 is a perspective view of a sputtering evaporation source viewed from the inner surface of a vacuum chamber, and FIG. 4 is a sectional view thereof. Since two sets of configurations are provided symmetrically, the following explanation will be made only for one of them, but the same applies to the other.
両図において、真空槽（１）の壁面に横開き式の気密性
メンテナンス扉（６）が取り付けられており、その内側
に蒸発源（２）が取り付けられている。蒸発源（２）の
上下に位置して、８本の支柱（４）が真空槽内壁面に設
けられており、それに、４枚のスパッタリング蒸発物の
防着板（３ａ）（３ｂ）（３ｃ） （３ｄ）が各々ボル
ト（５）によって固定されて、蒸発源（２）の前面の上
下左右に配置される。（７）は蒸発物を付着させる基板
、（８）は基板（７）を立てた状態で搬送する搬送用キ
ャリアである。４枚の防着板（３ａ） （３ｂ） （３
ｃ） （３ｄ）によって形成される開口部（１６）の形
によって、蒸発源（２）からのスパッタリング蒸発物を
基板（７）上に所定のパターンの膜（１７）として形成
させるのである。In both figures, a side-opening airtight maintenance door (6) is attached to the wall of the vacuum chamber (1), and an evaporation source (2) is attached inside the door. Eight pillars (4) are provided on the inner wall surface of the vacuum chamber above and below the evaporation source (2), and four sputtering evaporation prevention plates (3a) (3b) (3c) are installed on the inner wall surface of the vacuum chamber. ) (3d) are respectively fixed by bolts (5) and arranged on the top, bottom, left and right of the front of the evaporation source (2). (7) is a substrate to which evaporated matter is attached, and (8) is a carrier for transporting the substrate (7) in an upright state. 4 anti-adhesion plates (3a) (3b) (3
c) The shape of the opening (16) formed by (3d) causes the sputtered evaporates from the evaporation source (2) to form a predetermined pattern of film (17) on the substrate (7).
以上のような構成の従来装置において、防着板を洗浄、
交換等のメンテナンスのために取りはずす場合は、その
取りはずそうとする防着板（３ａ）［３ｂ） ｆ３ｃｌ
（３ｄ）の反対側のメンテナンス扉（６°）を開け、
そこから防着板（３ａ’） （３ｂ’ｌ （３ｃ’）
（３ｄ’）の開口部を通って向う側の８ケの固定用ボル
ト（５）をはずし、４枚の防着板（３ａ） ｆ３ｂ）
（３ｃ） （３ｄ）を１枚ずつ取りはずしてゆく。In conventional equipment with the above configuration, cleaning the anti-adhesion plate,
When removing for maintenance such as replacement, remove the adhesion prevention plate (3a) [3b) f3cl
Open the maintenance door (6°) on the opposite side of (3d),
From there, attach the anti-adhesion plate (3a') (3b'l (3c')
Pass through the opening (3d'), remove the 8 fixing bolts (5) on the opposite side, and attach the 4 anti-adhesion plates (3a) f3b).
(3c) Remove (3d) one by one.
又、その取り付けを行う場合も同様に、取り付ける側と
反対のメンテナンス扉（６″）を開けて、４枚の防着板
（３ａ） （３ｂ） （３ｃ） （３ｄ）を、蒸発源（
２）の上下左右に位置するように１枚ずつボルト（５）
で支柱（４）に固定してゆく。Also, when installing it, open the maintenance door (6'') opposite to the installation side and attach the four anti-deposition plates (3a) (3b) (3c) (3d) to the evaporation source (
Insert one bolt (5) so that it is located on the top, bottom, left and right of 2).
Fix it to the support post (4).
以上のように、防着板（３ａ） ［３ｂ） （３ｃ）
（３ｄｌの取りはずし、取り付けを行う場合には、その
目的とする防着板の反対側のメンテナンス扉（６゛）を
開けた場所から作業をするため、手前側の防着板（３ａ
’） （３ｂ’） （３ｃ’） （３ｄ’）が邪魔にな
り、ボルト（５）のネジ回し、防着板（３ａ） （３ｂ
） （３ｃ） （３ｄｌの出し入れ等の作業が困難であ
る。As described above, the anti-adhesion plates (3a) [3b] (3c)
(When removing and installing 3dl, work from the place where the maintenance door (6゛) on the opposite side of the target adhesion prevention plate is opened, so it is necessary to remove and install the adhesion prevention plate (3a)
') (3b') (3c') (3d') get in the way, and the screwdriver for the bolt (5) and the anti-adhesive plate (3a) (3b
) (3c) (Works such as putting in and taking out the 3dl are difficult.
また、防着板が（３ａ） ｆ３ｂ） （３ｃ） （３ｄ
）と４枚あり、ボルト（５）も８本と数量が多いので、
その取りはずし、取り付は作業には時間を要する。In addition, the anti-adhesion plate is (3a) f3b) (3c) (3d
) and 4 bolts (5), and there are 8 bolts (5), so there are a lot of them.
It takes time to remove and install it.
防着板が４枚である上に、その１枚１枚に開けられたボ
ルト穴の径はボルト（５）の径に対して余裕を持ってい
るので、防着板（３ａ） （３ｂ） （３ｃ） （３ｄ
）を毎回、正確に同じ位置に取り付けることは困難であ
る。There are four anti-fouling plates, and the diameter of the bolt hole drilled in each plate is larger than the diameter of the bolt (5), so the anti-fouling plates (3a) (3b) (3c) (3d
) is difficult to install in the exact same position every time.
さらに、防着板（３ａ） （３ｂ） （３ｃ） （３ｄ
ｌは蒸発源（２）の前面側だけに配置されていて、所定
パターンの開口部以外の全面について蒸発源（２）を覆
っている訳ではないので、例えば側面や、防着板間の隙
間から蒸発物が洩れ、基板（７）と防着板（３ａ） （
３ｂ）（３ｃ） （３ｄ）以外の真空槽（１）の内壁や
支柱（４）等の真空槽内部品にも付着してしまう。この
ように、その防着機能が十分でないため、真空槽（１）
内をも洗浄する必要が生じるなど、メンテナンスの手間
が増える等の問題点があった。Furthermore, anti-adhesion plates (3a) (3b) (3c) (3d
l is placed only on the front side of the evaporation source (2), and does not cover the entire surface of the evaporation source (2) other than the openings in the predetermined pattern, so for example, the side surface or the gap between the adhesion prevention plates Evaporated matter leaks from the substrate (7) and anti-adhesion plate (3a) (
3b) (3c) It also adheres to parts inside the vacuum chamber such as the inner wall of the vacuum chamber (1) and the pillar (4) other than (3d). In this way, since its anti-fouling function is not sufficient, the vacuum chamber (1)
There were problems such as increased maintenance efforts, such as the need to clean the inside as well.
本発明は以上のような問題に鑑みてなされ、取りはずし
及び取り付けが容易に短時間で行え、かつ、取付位置を
正確に再現することが可能で、その上、その防着機能を
十分に果すようなスパッタリング装置用のスパッタリン
グ蒸発物の防着板を提供することを目的としている。The present invention has been made in view of the above-mentioned problems, and it is possible to easily remove and install in a short time, to accurately reproduce the installation position, and to sufficiently perform the anti-fouling function. It is an object of the present invention to provide a sputtering evaporation prevention plate for a sputtering device.
［問題点を解決するための手段］
上記目的は、真空槽壁面に蒸発源を設け、これに対向し
て基板を配設し、前記蒸発源と前記基板との間に着脱可
能な防着部材を設け、前記防着部材により、前記蒸発源
からの蒸発物を前記基板上に所定の膜として形成させる
ようにしたスパッタリング装置において、前記防着部材
は前記蒸発部を囲むような筒状、体であって、所定の膜
を形成する開口部を有し、前記基板に対向する面部と周
壁部とから成り、前記対向する面部及び／又は前記周壁
部において前記真空槽壁面に取り付けられることを特徴
とするスパッタリング装置によって達成される。[Means for solving the problem] The above object is to provide an evaporation source on the wall surface of a vacuum chamber, arrange a substrate opposite to the evaporation source, and provide a detachable adhesion prevention member between the evaporation source and the substrate. In the sputtering apparatus, the adhesion prevention member is configured to form a predetermined film on the substrate by the evaporated matter from the evaporation source, the adhesion prevention member having a cylindrical or body shape surrounding the evaporation section. It has an opening for forming a predetermined film, is composed of a surface facing the substrate and a peripheral wall, and is attached to the wall surface of the vacuum chamber at the facing surface and/or the peripheral wall. This is achieved using a sputtering device.
［作 用〕
以上のように構成されるスパッタリング装置においては
、防着板の取りはずし及び取り付けが短時間で再現性良
く行うことができ、又、防着機能をも十分に果すことが
できる。[Function] In the sputtering apparatus configured as described above, the removal and attachment of the adhesion prevention plate can be performed in a short time with good reproducibility, and the adhesion prevention function can also be sufficiently performed.
［実 施 例］ 次に実施例について図面を参照して説明する。[Example] Next, embodiments will be described with reference to the drawings.
第１図は本発明にかかる実施例の真空槽のメンテナンス
扉を開けた状態を外側から見た斜視図、第２図はそのメ
ンテナンス扉を閉じた状態の断面図である。その構成は
左右対称に２組設けられており、従来例の項と同様に、
その一方についてのみ、以下に説明する。なお従来例と
共通の部分については同じ符号を用いる。FIG. 1 is a perspective view of a vacuum chamber according to an embodiment of the present invention, viewed from the outside with the maintenance door open, and FIG. 2 is a sectional view of the vacuum chamber with the maintenance door closed. There are two symmetrical configurations, and as in the conventional example section,
Only one of them will be explained below. Note that the same reference numerals are used for parts common to the conventional example.
第１図及び第２図において（１）は真空槽で、図示され
ていない排気用真空ポンプに接続している。（６）は真
空槽（１）の壁面に取り付けられた横開き式の気密性メ
ンテナンス扉であり、その内側に蒸発源（２）が取り付
けられている。（７）は蒸発物を付着させる基板、（８
）は基板（７）の搬送用キャリアである。In FIGS. 1 and 2, (1) is a vacuum chamber, which is connected to an exhaust vacuum pump (not shown). (6) is a side-opening airtight maintenance door attached to the wall of the vacuum chamber (1), and an evaporation source (2) is attached inside the door. (7) is the substrate to which the evaporated matter is attached, (8
) is a carrier for transporting the substrate (7).
（９）は本発明にかかる一体構造の筒型防着板である。(9) is a cylindrical adhesion prevention plate having an integral structure according to the present invention.
本実施例ではアルミニウム製の箱型で対向面部（１８）
と周壁部（１９）とから成り、メンテナンス扉（６）を
閉じると蒸発源（２）の周囲を囲むように形成されてい
る。筒型防着板（９）の基板（７）に対向する対向面部
（１８）には、蒸発源（２）からのスパッタリング蒸発
物を基板（７）上に所定のパタンの膜（１７）として形
成させるような開口部（１５）が設けられている。又、
筒型防着板（９）の底部（２０）には下部の位置決めの
ためのキャップ（１３）が２箇所に設けられており、真
空槽（１）内壁に固定された２本のビン（ｌＯ）にピッ
タリ嵌合するようになっている。筒型防着板（９）の上
部には遊合穴（２１）が設けられ、筒型防着板（９）が
当接する真空槽（１）内部に設置された２枚の当て板（
１１）にはネジ穴（１４）が設けられており、２本のち
ょうボルト（１２）でネジ止めして両者を固定し、上部
の位置決めをする。In this example, the facing surface part (18) is made of aluminum and has a box shape.
and a surrounding wall portion (19), and is formed so as to surround the evaporation source (2) when the maintenance door (6) is closed. On the opposing surface (18) of the cylindrical adhesion prevention plate (9) facing the substrate (7), sputtered evaporates from the evaporation source (2) are applied as a film (17) in a predetermined pattern on the substrate (7). An opening (15) is provided for forming the opening. or,
The bottom (20) of the cylindrical adhesion prevention plate (9) is provided with two caps (13) for positioning the lower part, and two bottles (lO ) so that it fits perfectly. A play hole (21) is provided in the upper part of the cylindrical anti-adhesion plate (9), and two backing plates (
11) is provided with a screw hole (14), and screwed in with two wing bolts (12) to fix both and position the upper part.
以上のように構成された実施例のスパッタリング装置に
おいて、筒型防着板（９）を洗浄、交換等のメンテナン
スのために取りはずす場合には、その取りはずそうとす
る筒型防着板（９）と同じ側のメンテナンス扉（６）を
開け、固定用の２本のちょうボルト（１２）をはずして
当て板（１１）との固定を解いた後、筒型防着板（９）
全体を少し上方に持ち上げて２本のピン（１０）からは
ずすことにより、筒型防着板（９）全体を取りはずす。In the sputtering apparatus of the embodiment configured as described above, when the cylindrical adhesion prevention plate (9) is removed for maintenance such as cleaning or replacement, the cylindrical adhesion prevention plate (9) to be removed is removed. ), open the maintenance door (6) on the same side, remove the two fixing wing bolts (12) and release the fixation from the cover plate (11), then remove the cylindrical anti-stick plate (9).
The entire cylindrical adhesion prevention plate (9) is removed by lifting it slightly upward and removing it from the two pins (10).
逆に、その取り付けを行う場合は、メンテナンス扉（６
）を開け、筒型防着板（９）の底部のキャップ（１３）
を２本のビン（ｌＯ）に差し込み、その状態で上部を２
枚の当て板（１１）に押し当てることによって位置決め
をし、２本のちょうボルト（１２）で当て板（１１）に
固定することにより、筒型防着板（９）が真空槽（１）
の内部に取り付け、位置決めして固定される。On the other hand, when installing it, use the maintenance door (6
) and remove the cap (13) at the bottom of the cylindrical adhesion prevention plate (9).
into two bottles (lO), and in that state,
The cylindrical adhesion prevention plate (9) is positioned in the vacuum chamber (1) by pressing it against the two backing plates (11) and fixing it to the backing plate (11) with two wing bolts (12).
It is installed inside, positioned and fixed.
このように、筒型防着板（９）の固定には、締付工具不
要のちょうボルト（１２）を２本使用するだけなので、
作業を短時間で行うことができる。In this way, only two butterfly bolts (12), which do not require any tightening tools, are used to fix the cylindrical deposition-prevention plate (9).
Work can be done in a short time.
以上、本発明の実施例について説明したが、勿論１、本
発明はこれに限定されることなく、本発明の技術的思想
に基づき種々の変形が可能である。Although the embodiments of the present invention have been described above, it goes without saying that the present invention is not limited thereto, and various modifications can be made based on the technical idea of the present invention.
例えば、実施例では筒型防着板をアルミニウム製とした
が、他の酸化しない軽量金属としてもよい。For example, in the embodiment, the cylindrical deposition-prevention plate is made of aluminum, but it may be made of other lightweight metals that do not oxidize.
又、筒型防着板の固定にもょうポル１〜を用いたが、代
りに筒型防着板に磁石片を埋め込み、当て板の材質に酸
化しない磁性体（ＳｕＳ ４３０等）を用いることによ
り、磁石の吸着力によって上部を固定してもよい。In addition, the cylindrical anti-adhesive plate was fixed with the cylindrical anti-adhesive plate 1 ~, but instead, a magnet piece was embedded in the cylindrical anti-adhesive plate, and a non-oxidizing magnetic material (SuS 430, etc.) was used as the material of the backing plate. In this way, the upper part may be fixed by the attraction force of the magnet.
又、実施例では下部の位置決めのために、筒型防着板の
底部にキャップを設け、対向する真空槽内壁にピンを設
けたが、キャップとビンはこの逆の位置に設けられても
よいし、あるいは、キャップを設ける代りに、ピンに嵌
合する凹所を設けるようにしてもよい。Further, in the embodiment, a cap was provided at the bottom of the cylindrical deposition-prevention plate and a pin was provided on the opposing inner wall of the vacuum chamber in order to position the lower part, but the cap and the bottle may be provided in the opposite position. Alternatively, instead of providing a cap, a recess into which the pin fits may be provided.
［発明の効果］
本発明は以上のような構成であるので、筒を防着板（９
）を取りはずし及び取り付ける場合、その対象とする筒
型防着板（９）と同じ側のメンテナンス扉（６）を開け
、手前側で作業するため、従来例のような手前や周囲に
作業の邪魔となる障害物がなく、作業が非常に容易にな
る。[Effects of the Invention] Since the present invention has the above-described configuration, the tube is attached to the adhesion prevention plate (9).
), open the maintenance door (6) on the same side as the cylindrical adhesion prevention plate (9) and work from the front side, so there are no obstacles in front or around the work as in the conventional case. There are no obstacles and the work becomes much easier.
又、筒型防着板（９）は従来例のように分割式ではなく
、一体構造であり、その取り付は時にはその下部及び上
部を、真空槽内に設置した２本のビン（１０）と２枚の
当て板（１１）にそれぞれ「差し込み」 「押し当て」
「ボルト締め」するという簡単な操作で位置決めする
ので、毎回同じ位置に再現性良（取り付けることができ
る。In addition, the cylindrical adhesion prevention plate (9) is not a split type as in the conventional example, but is an integral structure, and its lower and upper parts are sometimes attached to two bottles (10) placed in a vacuum chamber. ``Insert'' and ``Push'' into the two backing plates (11) respectively.
Positioning is done with a simple ``bolt tightening'' operation, so it can be installed in the same position every time with good reproducibility.
又、筒型防着板（９）は蒸発源（２）を囲むような形に
構成されているので、基板（７）に対向する面に形成さ
れた開口部（１５）以外に飛んだ余分な蒸発物は全て筒
型防着板（９）の内壁だけに付着し、その防着機能を十
分に果すことができる。従って、真空槽（１）の内壁及
び真空槽内の部品を汚染することがなく、それらを洗浄
する手間も不要となる。In addition, since the cylindrical adhesion prevention plate (9) is configured to surround the evaporation source (2), any excess that has flown outside the opening (15) formed on the surface facing the substrate (7) All of the evaporated matter adheres only to the inner wall of the cylindrical adhesion-preventing plate (9), and its adhesion-preventing function can be fully achieved. Therefore, the inner wall of the vacuum chamber (1) and the parts inside the vacuum chamber are not contaminated, and there is no need for cleaning them.
第１図は本発明にかかる実施例を示す部分破断斜視図、
第２図は同実施例の断面図、第３図は従来例の部分破断
斜視図、及び第４図は従来例の断１
面図である。
なお、図において、
■・・・・・・・・・・・・
２・・・・・・・・・・・・
７・・・・・・・・・・・・
９・・・・・・・・・・・・
１０・・・・・・・・・・・
１２・・・・・・・・・・・
１５・・・・・・・・・・・
１８・・・・・・・・・・・
１９・・・・・・・・・・・
■FIG. 1 is a partially cutaway perspective view showing an embodiment according to the present invention;
FIG. 2 is a sectional view of the same embodiment, FIG. 3 is a partially cutaway perspective view of the conventional example, and FIG. 4 is a sectional view of the conventional example. In addition, in the figure: ■・・・・・・・・・・・・ 2・・・・・・・・・・・・ 7・・・・・・・・・・・・ 9・・・・・・・・・・・・・・・ 10・・・・・・・・・・・・ 12・・・・・・・・・・・・ 15・・・・・・・・・・・・ 18・・・・・・・・・・・・ 19・・・・・・・・・・・・ ■
Claims (2)
を配設し、前記蒸発源と前記基板との間に着脱可能な防
着部材を設け、前記防着部材により、前記蒸発源からの
蒸発物を前記基板上に所定の膜として形成させるように
したスパッタリング装置において、前記防着部材は前記
蒸発部を囲むような筒状体であって、所定の膜を形成す
る開口部を有し、前記基板に対向する面部と周壁部とか
ら成り、前記対向する面部及び／又は前記周壁部におい
て前記真空槽壁面に取り付けられることを特徴とするス
パッタリング装置。(1) An evaporation source is provided on the wall surface of the vacuum chamber, a substrate is disposed opposite to the evaporation source, a removable adhesion prevention member is provided between the evaporation source and the substrate, and the adhesion prevention member prevents the evaporation from occurring. In the sputtering apparatus, the adhesion prevention member is a cylindrical body surrounding the evaporation section, and has an opening for forming the predetermined film on the substrate. A sputtering apparatus comprising a surface portion facing the substrate and a peripheral wall portion, the sputtering device being attached to the wall surface of the vacuum chamber at the facing surface portion and/or the peripheral wall portion.
し、これら凹部又は凸部に対向して前記真空槽壁面の一
部に凸部又は凹部を形成して、これら凹部と凸部の係合
によって前記防着部材を前記真空槽内に位置決めするよ
うにした請求項（１）に記載のスパッタリング装置。(2) A plurality of concave portions or convex portions are formed on the bottom surface portion of the peripheral wall portion, and convex portions or concave portions are formed on a part of the wall surface of the vacuum chamber opposite to these concave portions or convex portions, and these concave portions and convex portions The sputtering apparatus according to claim 1, wherein the adhesion prevention member is positioned within the vacuum chamber by engagement of the parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14194389A JP2783421B2 (en) | 1989-06-02 | 1989-06-02 | Sputtering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14194389A JP2783421B2 (en) | 1989-06-02 | 1989-06-02 | Sputtering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH036365A true JPH036365A (en) | 1991-01-11 |
| JP2783421B2 JP2783421B2 (en) | 1998-08-06 |
Family
ID=15303747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14194389A Expired - Fee Related JP2783421B2 (en) | 1989-06-02 | 1989-06-02 | Sputtering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2783421B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013088623A1 (en) * | 2011-12-15 | 2013-06-20 | キヤノンアネルバ株式会社 | Processing device and shield |
| WO2013088624A1 (en) * | 2011-12-15 | 2013-06-20 | キヤノンアネルバ株式会社 | Processing device and shield |
-
1989
- 1989-06-02 JP JP14194389A patent/JP2783421B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013088623A1 (en) * | 2011-12-15 | 2013-06-20 | キヤノンアネルバ株式会社 | Processing device and shield |
| WO2013088624A1 (en) * | 2011-12-15 | 2013-06-20 | キヤノンアネルバ株式会社 | Processing device and shield |
| US9422619B2 (en) | 2011-12-15 | 2016-08-23 | Canon Anelva Corporation | Processing apparatus and shield |
| US9583304B2 (en) | 2011-12-15 | 2017-02-28 | Canon Anelva Corporation | Processing apparatus and shield |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2783421B2 (en) | 1998-08-06 |
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