JPH0363820B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit packaging device used for sealing an integrated circuit in a package with a metal lid.

[Conventional technology]

A conventional integrated circuit (IC) package and packaging device will be explained with reference to FIG.

In the figure, A shows the state in which the metal cover is attached to the IC package shown in B, and 1
2 is a sealing frame brazed to the top surface of the package; 3 is a metal lid formed with a flat recess leaving a desired width at the periphery to hermetically seal the IC; 4; 5 is a lead frame for mounting the package 1 on the board, 5, 5 is a pair of roller electrodes of the packaging device for joining the peripheral edge of the metal lid 3 to the seal frame 2, and its side surface shape is on the inside of the metal lid 3. The seal frame 2 is formed into a tapered shape whose diameter gradually decreases.
It rolls while pressing the outer periphery to join the two together.

Therefore, when the metal lid 3 is pressed against the seal frame 2 with the pair of roller electrodes 5, 5 and energized,
Joule heat is generated between the seal frame 2 and the metal lid 3, and the two are joined together by the rolling of the roller electrodes 5, 5, and the IC is hermetically sealed within the package 1.

[Problem that the invention seeks to solve]

When joining a metal lid to a seal frame using such a packaging device, if the packaging is circular, the roller electrode can be used under uniform conditions, so the joining between the two will be even and the quality will be improved. A good product can be obtained. However, in the case of a rectangular package, the joints are bent at right angles at the corners of the seal frame and the metal lid, so there is a problem that it is difficult to stably obtain uniform joint quality. moreover,
Since the roller electrode makes point contact with the metal lid (see Figure 4 A), heat is generated only at the point contact portion of the roller electrode, causing the problem that the roller electrode is locally heated and worn out. .

This invention was made in order to solve the above-mentioned problems, and its purpose is to provide an IC packaging device that has less wear on the electrodes and can evenly bond the metal lid to the seal frame. It is said that

[Means for solving problems]

In this invention, one of the pair of electrodes is used as a power feeding electrode that presses the outer periphery of the seal frame, and the other is used to move the outer periphery of a metal lid formed to be located on the inner periphery of the seal frame into the seal frame. As a welding electrode that presses against the periphery and welds the metal lid to the seal frame when the power supply electrode is energized.
This consists of an IC packaging device.

[Effect]

According to this invention, by simultaneously pressing the power supply electrode and the welding electrode to the outer periphery of the seal frame and the overlapping portion of the metal lid placed on the seal frame and applying electricity, the overlapping portion of the metal lid and the seal frame is Both can be welded together at once by the generated Joule heat, and a homogeneous welded joint can be obtained.

〔Example〕

Hereinafter, based on the embodiment shown in FIGS. 1 to 3, the same reference numerals will be given to parts that are the same as or corresponding to the conventional ones, and the features of the present invention will be mainly explained.

In the figure, 3 has a rectangular size similar to the rectangular seal frame 2, and the outer periphery is the same as that of the seal frame 2.
A metal lid placed overlappingly on the inner peripheral edge, 6 a power feeding electrode formed in a rectangular tube shape that presses the non-overlapping part of the metal lid 3 with the seal frame 2 and supplies power to the seal frame 2; This is a welding electrode that presses the overlapping part of the metal lid 3 with the seal frame 2 and welds it by supplying power from the power supply electrode 6.It is surrounded by the power supply electrode 6, and there is a Due to the energization, Joule heat is generated between the metal lid 3 and the seal frame 2 to weld them together. The power supply electrode 6 is made of a metal with excellent electrical conductivity and thermal conductivity, such as copper or a copper alloy, and the welding electrode 7 is made of a metal with poor conductivity, such as stainless steel. Alternatively, it is made of molybdenum steel.

Therefore, when the power supply electrode 6 and the welding electrode 7 are pressed against predetermined portions of the package and electricity is applied between them, Joule heat is generated between the seal frame 2 and the metal lid 3, and the two are welded together. At this time, the power supply electrode 7 generates less heat, and the heat generated in the seal frame 2 is transferred to the electrode 7 with excellent thermal conductivity.
The heat generated in the joint is not diffused or radiated, but is retained in the welding electrode 6, and the temperature of the joint can be easily raised to the required welding temperature. Moreover, the thermal influence on the package 1 can be suppressed.

FIG. 2 shows another embodiment of the present invention, which differs from the above embodiment in that the lower end of the welding electrode 7 is formed into a rectangular tube shape along the part to be welded. With such a configuration, the contact area with the metal lid 3 can be reduced, the current value can be lowered, and the thermal influence on the package 1 can be further reduced.

Moreover, FIG. 4 shows a discharge waveform with a peak time of 0.003 seconds obtained by capacitor discharge, for example, and if the current conduction time between the electrodes 6 and 7 is shortened in this way, the metal lid 3 Since the heat generated by the contact resistance between the seal frame 2 and the seal frame 2 can be effectively utilized, it is possible to join the package 1 with almost no thermal influence. It has been experimentally confirmed that when the wave height time exceeds 0.003 seconds, the thermal effects increase accordingly.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to make the bond between the metal lid and the seal frame homogeneous, and the consumption of the electrodes is significantly suppressed.

[Brief explanation of drawings]

FIGS. 1A and 1B show an apparatus according to an embodiment of the present invention.
Figure A and its top view B show the main parts of an IC in a packaging state, and Figure 2 is a diagram A showing a packaging state of an IC in another embodiment of the present invention.
3 is a diagram showing the current waveform during energization, and FIGS. 4A and 4B are diagrams corresponding to FIGS. 1A and 1B of the conventional device. In the figure, 1 is a package, 2 is a seal frame, 3 is a metal lid, 6 is a power supply electrode, and 7 is a welding electrode. In each figure, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1. In an integrated circuit packaging device in which an integrated circuit is mounted on a package, a metal lid is welded to a frame attached to the outer periphery of the package, and the inside is sealed, the outer periphery of the frame is pressed. a welding electrode that presses a metal lid that is surrounded by the electrode and is located on the inner circumferential side of the frame outer circumference against the inner circumferential edge of the frame and welds the two by supplying power to the power feeding electrode. An integrated circuit packaging device characterized by: 2. The integrated circuit according to claim 1, wherein a metal with high electrical and thermal conductivity is used as the power supply electrode, and a metal with low electrical and thermal conductivity is used as the welding electrode. packaging equipment. 3. The integrated circuit packaging device according to claim 2, wherein copper or copper alloy is used as the power supply electrode, and stainless steel or molybdenum steel is used as the welding electrode. 4. The integrated circuit packaging device according to any one of claims 1 to 3, wherein the power feeding electrode is cylindrical. 5. The integrated circuit packaging device according to any one of claims 1 to 3, wherein the welding electrode is formed in a cylindrical shape. 6. The integrated circuit packaging device according to any one of claims 1 to 5, wherein the feeding current has a discharge waveform with a peak time of 0.003 seconds or less.