JPH0363840B2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention is a chip-type mounting head in which a rotor that rotates intermittently around a support shaft is equipped with a plurality of nozzles for sucking electronic components with their tips facing downward. This invention relates to an automatic chip component mounting machine used to mount electronic components (hereinafter referred to as ``chip components'') onto a board on an XY table.

BACKGROUND TECHNOLOGY In general, automatic mounting machines for electronic components are equipped with a plurality of mounting heads for electronic components at equal intervals in the circumferential direction of a rotary plate that rotates intermittently like the rotor mentioned above. An electronic component supply device is installed at a predetermined position around the circuit, and as the rotary disk rotates intermittently, the component suction nozzle of the mounting head is moved up and down to receive electronic components from the electronic component supply device. Some devices are configured so that the electronic components are carried onto an XY table at a position away from the receiving position in the direction of rotation of the rotary plate and mounted on the board.

Conventionally, this type of automatic electronic component mounting machine has been equipped with an electronic component feeding device in which a plurality of parallel receiving grooves for accommodating electronic components in alignment is provided, and this feeding device is used to feed the electronic components sent out from each receiving groove. By controlling the movement horizontally to the left and right, which is orthogonal to the feeding direction, according to the order in which electronic components are mounted, one mounting head and the component feeding position on the supply device side can be moved in one place as the rotary disk rotates intermittently. A device is known in which electronic components are aligned and sequentially moved in circulation to take out electronic components in the order in which they are to be mounted on the board and to mount them on the board (Japanese Patent Publication No. 57-60793).

However, in this automatic electronic component mounting machine, in addition to the space needed to move the receiving groove from one end of the feeding device that feeds the electronic components to the other, space is also needed to isolate the feeding device from the work environment. A large space within the factory is required for installation.

In addition, in this automatic electronic component mounting machine, any one of the mounting heads and any one of the component receiving grooves are aligned with each other by the intermittent rotation of the rotary table and the horizontal movement of the component supply device. Since the delivery position of electronic components is limited, if the placement pitch of the mounting head is that the electronic components are accommodated in the receiving groove in a different order than the order in which they are mounted on the board, they may be placed next to each other or in rows several pitches apart. By controlling the rotation of the rotary disk during one pitch rotation of the mounting head, electronic components can be arranged and taken out in the order in which they are mounted on the board. However, assuming that the next electronic component to be taken out is housed in a receiving groove that is widely spaced apart in the horizontal direction, the component supply device must be moved at high speed in accordance with one pitch rotation of the mounting head. Furthermore, due to the high-speed movement, a situation arises that cannot be accommodated by the normally desired mounting speed of electronic components.

In addition, in the electronic component supply device described above, if the electronic components are accommodated in each row from one end of the receiving groove to the other in accordance with the order in which they are mounted on the board, the component supply device By sequentially moving horizontally one pitch at a time, electronic components can be arranged in the mounting order of the electronic components at each mounting head and taken out from the component supply device. However, accommodating a large number of electronic components in the order in which they are mounted on the board and in the order of the receiving grooves is extremely complicated work, and furthermore, if this has to be done every time the assembly circuit lot is changed, work efficiency will be significantly reduced. Therefore, it is actually required that the electronic components be accommodated in the receiving grooves in the order in which they are to be mounted on the board, either next to each other or in rows that are several pitches apart at the arrangement pitch of the mounting head.

In addition to the above-mentioned electronic component supply device, a plurality of magazines containing electronic components are held on a magazine index table, and the magazine index table is rotated intermittently. The equipped index table also rotates intermittently, and like the automatic electronic component mounting machine described above, it positions one vacuum chuck and the component delivery position of the magazine equipped on the magazine index table in one place. By combining
A device is known in which electronic components are attached to a board while being sucked by a vacuum chuck (Japanese Patent Application Laid-Open No. 1983-1999).
No. 24997).

This automatic electronic component mounting machine is configured to change the delivery position of electronic components relative to the vacuum chuck by intermittently rotating the magazine index table about the central axis. The space required to install the entire device including the storage table is not as large as the one on the left.

However, since the electronic component delivery position relative to the vacuum chuck is limited to only one location where any one of the vacuum chucks and any one of the magazines are aligned by intermittent rotation of each index table, Similar to the above-mentioned automatic electronic component mounting machine, the problem of taking out electronic components using a vacuum chuck in accordance with the mounting order of the electronic components cannot be avoided. In addition, since each magazine is installed radially around the center of rotation of the magazine index table with the electronic component delivery part located outside, the magazine must be replaced within the space between adjacent magazines. There is also the problem that it is difficult to carry out replacement work because it has to be done.

Problems to be Solved by the Invention In view of the above-mentioned problems, the present invention provides a method for mounting electronic components onto a board by simply moving up and down the component suction nozzle of the mounting head that circulates with a rotor, without controlling the operation of the electronic component supply device. The objective is to improve an automatic chip component mounting machine so that electronic components can be taken out in sequence.

Means for Solving the Problems The automatic electronic component mounting machine according to the present invention includes a rotor that rotates intermittently around a support shaft, and a component suction nozzle that moves up and down from the rotor, with the tip of the rotor facing downward. A plurality of electronic component mounting heads are installed at regular intervals along the entire circumference on a concentric circle, and the component suction nozzles of each of these mounting heads are positioned below the locus of movement by the intermittent rotation of the rotor. The mounting table for the component mounting board installed at a fixed rotating position and the component suction nozzle of each mounting head are aligned below the locus of movement by the intermittent rotation of the rotor, and each delivery part of the electronic component is moved to the rotor. Each mounting head is fixedly positioned toward the center of rotation, and is provided with a plurality of electronic component supply devices arranged radially in a predetermined area around the rotor away from the mounting position of the board mounting table. receives the electronic components from any predetermined delivery section of the supply device while moving within the supply area of the supply device for the plurality of electronic components arranged side by side, and
It is constructed by assembling it as a mechanism for sequentially mounting electronic components on a board by carrying it on a board mounting table installed at a position away from the supply area of electronic parts.

Function: In this automatic chip component placement machine, the component suction nozzle of each placement head is aligned below the locus of movement by the intermittent rotation of the rotor, and each delivery part of the electronic component is directed toward the center of rotation of the rotor. At the same time, a plurality of electronic component supply devices are installed radially in a predetermined area around the rotor away from the placement position of the board mounting table, so they can be rotated intermittently around the support shaft. A plurality of mounting heads are installed at regular intervals along the entire circumference on the concentric circle of the moving rotor, and as they move within the supply area of the supply device where a plurality of electronic components are lined up, one of the mounting heads is placed at a predetermined delivery point in the supply device. electronic components can be received from each department.

Therefore, without having to rotate the electronic component supply device side intermittently, electronic components can not only be taken out from the supply device by simply moving the component suction nozzle of each mounting head up and down, but also each component suction nozzle can be moved up and down. By controlling the vertical movement of the electronic components according to a specified program corresponding to the mounting order of the electronic components, each electronic component can be aligned in the mounting order on the board and taken out from the supply device.Also, even when changing the assembly circuit lot, each suction nozzle This can be done simply by changing the specified program that controls the order in which the

Embodiments The following description will be made with reference to the accompanying drawings.

In this automatic mounting machine for electronic components, the first,
As shown in Figure 2, there are multiple mounting heads 1.
0, 10..., a rotor 20 equipped with the mounting heads 10, 10..., a plurality of electronic component supply devices 30, 30... installed in a predetermined area around the rotor 20, and electronic component mounting positions. An XY table 40, which is a substrate mounting table, is provided on which a substrate pre-glued is placed. The mounting heads 10, 10... are arranged at regular intervals along the entire circumference on the concentric circle of the rotor 20 with the tips of the component suction nozzles that move up and down from the rotor 20 facing downward, and a vacuum is placed on the axis of each suction nozzle. Tubes 11, 11, . . . that apply pressure are connected to each other, and by operating a vacuum valve 12, electronic components can be sucked at the tip of the nozzle. The rotor 20 is attached to a gate-shaped upper frame 21, and is installed so as to be able to rotate intermittently about a support shaft (not shown) rotatably supported by the upper frame 21. The spindle of the rotor 20 is connected to a drive motor 23 via a gear housed in a gear box 22, and the rotor 20 is basically rotated intermittently in a predetermined cycle using the drive motor 23 as a drive source. has been done. A tape feeder is provided as the electronic component supply device 30, 30, and each of these tape feeders 30, 3...
0... is equipped with an electronic component chain tape in which leadless, almost rectangular standard type or irregularly shaped chip components, such as a crab-leg type, are individually taped and held in multiple series so as to be pitch-feedable. The supply devices 30, 30... for each electronic component include a rotor 20
Each electronic component delivery section is positioned below the locus of movement of the component suction nozzle of each mounting head 10, 10, etc. as the mounting head 10 rotates. Further, the delivery portion of each electronic component is fixedly positioned toward the center of rotation by the support shaft of the rotor 20, and
A plurality of them are arranged radially in a predetermined area around the rotor 20. The XY table 40 for placing a board is installed around the rotor 20 away from the component supply area where a plurality of electronic component supply devices 30, 30... are installed in the rotational direction of the rotor 20, as shown in FIG. In a, an electronic component supply device 30,
30... are placed on the substantially opposite side.
This XY table 40 is used for the mounting heads 10, 10.
The component suction nozzle is equipped to move the board horizontally in the X and Y directions relative to the coordinate center that moves up and down. In addition, in the automatic mounting machine of the illustrated embodiment,
The rotor 20 is equipped with 60 mounting heads, and a plurality of tape feeders 30, 30, .

In the electronic component automatic mounting machine configured as described above, as the rotor 20 rotates, a plurality of electronic component supply devices 30, 30... move each mounting head 10, 10 within the electronic component supply area arranged radially. ... moves circularly along a predetermined trajectory. Since the component delivery parts of each supply device 30, 30... are aligned and fixed below the movement trajectory, each mounting head 10, 10... can move the nozzle tip up and down to move the component delivery device 30, 30, etc. , 30 . . . electronic components can be successively picked up and taken out to be carried to the installation position of the XY table 40. In addition, when taking out the electronic components, each mounting head 10, 10... passes through each component removal section of the supply device 30, 30... in which a plurality of electronic components are installed. By moving the suction nozzle up and down in accordance with a predetermined designated program, the electronic component can be taken out from any predetermined delivery section of the supply devices 30, 30, . . . . For this reason,
As shown in FIG. 3b, each mounting head 10, 10...
The component suction nozzles can be operated sequentially according to the order in which the electronic components are mounted on the board, and their vertical movement can be easily controlled by a specified program according to the order in which the electronic components are mounted on the board. 10... allows electronic components to be taken out in accordance with the order in which they are mounted on the board. Furthermore, even if it is necessary to change the operating order of the mounting heads due to a change in the lot of the assembly circuit, etc., this can be easily handled because it is only necessary to change the specified program for operating the mounting heads.

In this automatic chip component mounting machine, before the electronic components are mounted by the mounting head, the mounting head 1
It is advisable to check whether the suction of the electronic component is suitable or not at 0, 10, . . . . In order to perform the inspection and discrimination, each of the above-mentioned components 10, 10..., 20, 30, 30 is installed in this automatic chip component mounting machine.
..., 40, as well as electronic component supply devices 30, 30
A detection device 50 is disposed between the XY table 40 and the XY table 40 in the direction of rotation of the rotor 20 from a predetermined component supply area where the rotor 20 is provided. The detection device 50 can be configured using a phototube or the like. In addition, depending on the standard type or irregular type specified by the specified program when the mounting heads 10, 10... take out the component, the mounting head 10, 10... It is possible to determine whether the electronic component is properly or inappropriately suctioned based on whether the electronic component is oriented vertically and is not suctioned or has a poor suctioning posture. In addition to the detection device 50 that determines whether the electronic component is properly or improperly picked up, there is also an XY table 40 located between the locations of the detection device 50 and the direction of rotation of the rotor 20 for holding standard components in a suction position. a redirection device 60 for correcting the
Direction changing device 7 for correcting the suction posture of irregularly shaped parts
0. The re-appropriate inspection devices 80 can be sequentially installed. Among them, the direction changing devices 60 and 70 perform shape thermal correction for each type according to a program specifying whether the chip part is a standard type or a special type. Further, the re-appropriateness inspection device 80 determines whether any electronic components have fallen off due to corrections made by the direction changing devices 60, 70, or whether there are any electronic components that are in inappropriate suction postures even after corrections. Like the proper detection device 50, it can be constructed using a phototube or the like.

In addition to this, the rotor 2 from the XY table 40
A mounting head 10, 10, .
A suction release device 90 using a push pin to remove the chip, a direction changing device 100 for re-correcting a chip component whose suction posture can be corrected, a device 110 for ejecting a chip component that has not been corrected even after the re-correction, and a chip component that has been incorrectly corrected. Adsorption release device 12 using a push pin
0 can be set.

When equipped with an inspection device 50 that determines whether the electronic component is properly or improperly suctioned, each mounting head 10, 10...
It is possible to determine whether electronic components are improperly suctioned by
The mounting head 10 moves to the XY table 40,
It can be determined whether or not to cause the electronic component mounting operation to be performed on the electronic components. If there is a mounting head 10, 10... that is determined to be inappropriate by the suction proper/improper detection device 50, the mounting head 10, 10... is
without lowering the table 40 to the parts mounting position.
The operation is controlled so that the XY table 40 passes. For this reason, by providing the detection device 50, it is possible to reduce as much as possible the mounting defects of electronic components on the board, and by providing the direction changing devices 60, 70, and furthermore, the inappropriateness inspection device 80, the frequency of passing the XY table 40 can be reduced as much as possible. It is possible to minimize the number of defects in mounting onto the board.

In the process described above, the mounting heads 10, 10, etc. that have a missing part or an unrepairable electronic component suction state are XY
When it is determined that the electronic component is to be passed from the table 40, for example, as shown in FIG. If it is determined to be a component, place the No. 5 mounting head on the XY table 40.
Pass from At the same time, the number of suctions for electronic parts.
The electronic component can be taken out from the No. 4 supply device by selecting a mounting head that has not yet been specified and will not interfere with the mounting order of the electronic components even if it picks up the electronic component from the No. 4 supply device. Let's rotor 20
Due to the normal intermittent rotation of the electronic component, the electronic component can be mounted on one board near the end of mounting on the board. For example, assuming that the electronic component suction numbers have already been specified for up to the Nth mounting head, the next N+1 or subsequent neighboring mounting heads move within the electronic component supply area. During the process, an interrupt operation can be performed to pick up the same type of electronic component picked up by the No. 5 mounting head from the No. 4 feeding device. Also, mounting head 1
If the electronic component suction number is specified at the same time that 0, 10... enters the electronic component supply area, the electronic component is transferred from the above-mentioned No. 4 supply device to the previous mounting head before entering the electronic component supply area. It can be selected as a mounting head to take out. If the mounting head corresponds to the mounting order according to a predetermined program for electronic components, all the electronic components can be mounted on one board by rotating the rotor 20 intermittently according to the predetermined sequence. You can do it as you like.

However, considering the case where it is not preferable to mount electronic components according to the above-described predetermined sequence, this automatic mounter for electronic components uses rotor 20.
In addition to the normal intermittent rotation, the rotor 20 can be rotated quickly by controlling the drive motor 23 that rotates the support shaft of the rotor 20. In order to improve the efficiency of mounting electronic components, the mounting head that has taken out all the electronic components necessary to mount a single board detects an incorrectly mounted component near the end of the mounting order. In addition, the present invention can be applied to a case where a mounting head that has taken out electronic components necessary for mounting on the next board is already in progress. In that case, the electronic components corresponding to the improperly mounted electronic components are taken out from the mounting heads located after the next group, and the rotor 20
The next group is allowed to pass from the XY table 40 by quickly rotating, and the mounting head that took out the electronic components corresponding to the improperly mounted electronic components is used to mount the electronic components on the board currently being worked on. Can be done. This rotation control can be performed by controlling the drive motor 23 of the rotor 20 with a rotary encoder, and the drive motor 23 is rotated by slowing up and slowing down so as not to affect component mounting by the mounting head due to inertia caused by speed change. It can also be controlled to

In this chip component placement machine, the placement head 1
It is preferable to use a hammer solenoid to perform the downward movement during suction and installation of chip parts of 0, 10, . A drive motor 130 is used as a drive source for each mechanical part (the connection relationship is shown by a dashed line in FIGS. 4 to 6), and driving force is transmitted through rotation shafts 131, 132, and 133 that are connected to this drive motor 130. It is becoming more and more common. Each rotating shaft 131, 132, 133 has a cam disk 134, 135, 136, 13 corresponding to each mechanical part.
7 is mounted on a bearing, and operating rods 142, 143, 144 are connected to these cam disks via cam followers 138, 139, 140, 141, and hammer solenoids 145, 146, 1 are connected to the lower ends of each operating rod.
Install 47. In these hammer solenoids, when an operation command is electrically transmitted, each pin protrudes, and when the pin engages with a piece or a lever, each mechanical part performs a predetermined operation. When picking up a chip component, the pin of the hammer solenoid 145 engages with the piece 148, and the solenoid 145 descends along the cam groove of the cam disk 134, thereby lowering the entire mounting head 10 downward from the rotor 20. With this downward movement, the mounting head 10 absorbs the chip part at the tip of the nozzle, and then moves upward along the cam groove of the cam disc 134 to return to its original position, and the pin of the hammer solenoid 145 retreats. It will stop at a predetermined position. The operating mechanism using this hammer solenoid is the direction changing device 6.
The present invention can also be applied to the downward movement performed via the cam disk 135 and cam follower 139 for the cam disk 135 and the cam follower 139, and also to the downward movement conducted via the cam disk 137 and cam follower 141 for the ejection device for missing chip parts. I can do it. When installing a chip component, it can be moved downward by removing the latching lever 149 using the hammer solenoid 147. Further, by using this hammer solenoid, the tape feeder 30 can be configured to perform an intermittent tape feeding operation. The hammer solenoid 150
is attached to the upper end of the operating rod 151, and this operating rod 15
1 is connected to a cam disk 152 mounted on the axis of a rotating shaft 132 via a cam follower 153, so that it can move up and down. A piece 154 is arranged so as to be engageable with the hammer solenoid 150, and this piece is arranged so as to come into contact with a cam lever 202 mounted on the same axis of the chip feed drum 201. When the piece 154 moves up and down, the feed drum 201 can be rotated one pitch at a time via the cam lever 202. Further, in this hammer solenoid 150, the vacuum valve 12 for supplying vacuum pressure to the mounting head 10 can also be configured to be switched by the push plate 155. When a hammer solenoid is used in this manner, the structure is simpler than that of an operating mechanism that is a combination of a solenoid valve and an air cylinder, and the response speed is faster and problems such as air leakage do not occur.

In this chip component mounting machine, each mounting head 10,
A sliding plate 13 is installed near the rotor attachment of 10...
13... and align the air passages 14, 14... provided on the plate surface with the communication hole 15 with the vacuum valve 12, the mounting heads 10, 1
Vacuum pressure is supplied or cut off to 0... Each sliding plate 13, 13... can be slid by pressing with a ball 16 installed on the machine body side, and after the pressing is released, it is supported by a bolt 19 through an elongated hole 18 so that it returns to its original position with a tension spring 17. ing.

Further, as mentioned above, it is preferable to equip the feed drums 32 of the tape feeders 30, 30, . This tape feeder 30, 30
...If the upper side including the reel 34 for winding the cover tape _t1 of the tip tape T, the construction reel 35 of the tip tape T, and the tape running guide 36 are configured to be detachable using the knob 37, it becomes easy to change the tip tape individually. can. Also, cover tape T ₁
In the winding mechanism, the cam lever 31 is extended to engage the roll 38, and the cover tape take-up reel 34 is placed in contact with the roll surface, whereby the roll 38 is rotated by the swing of the cam lever 31, and the reel 34 is rotated. They can be configured to work together. In this mechanism, it is preferable that the support arm 39 of the cover tape take-up reel 34 is bolted to the travel guide 36 through the long holes 301 and 302, and a tension spring 303 is stretched between the arm 39 and the knob 37. Since the take-up reel 34 can be deflected downward with the driven rotation by the roll 38 and can be moved upward when the cam lever 31 returns to its original position, the reaction force due to the swinging of the cam lever 31 is not applied to the cover tape. I can do it. In addition, in order to ensure that the chip component E accommodated in the recess of the chip tape T is adsorbed by the mounting head 10, the tape feeder 30 has a through-hole formed in the base tape that penetrates the base tape from below the chip tape T. A push-up pin 304 is provided to push up the chip part E via the push-up pin 304. That pin 3
As 04, it is possible to use one in which the tip end side is formed into a truncated pyramid shape or two or three protruding teeth 305, 305... are formed at the tip of the shaft, which reduces the contact area between the tip of the shaft and the tip part E and is stable. It is preferable that the chip part E can be supported. In addition, all of the tape feeders 30, 30, . The main body of the cart 306 is formed of a box 307 that can accommodate waste tape after chip parts are taken out, and each tape feeder 30, 30, . . .
A socket 308 that receives waste tape _t2 discharged from the
is provided. Since this trolley 306 can collect all the waste tape, it is possible to keep the undercarriage of the work place tidy. In addition, this trolley 306 has the waste collection box 307 on the front side of the caster stand 3.
09 and a horizontal shaft 310, and connects the waste collection box 307 and the caster stand 309 near the rotor 20.
1,312, each link bar 311,
An operation bar 314 can be connected to a location where 312 is pivotally supported by a shaft 313. This trolley 3
In 06, the link bars 311 and 312 are extended by the operator pushing down the operation bar 314, and can accordingly be tilted and rotated toward the front using the horizontal shaft 310 as a fulcrum. If the chip tapes of the tape feeders 30, 30, etc. are changed in this state, the chip tapes can be changed easily and quickly.

The missing chip component detection device 50 can be composed of a phototube as described above, and one is arranged below the nozzle axis of the mounting head 10 so as to detect whether or not a chip component is attracted. In order to detect the attitude, it is preferable to arrange a plurality of them perpendicularly to the nozzle tip. Each phototube 51, 52, 53 and light receiving tube 54, 55 arranged in the orthogonal direction,
56 are arranged with a step difference between them, so that it is possible to detect the presence or absence of a chip component as well as the suction caused by the standing posture of the chip component.

Direction changing device 60, 70 and direction restoring device 10
0, it is preferable to incorporate a chuck mechanism having four opposing clamping claws 401 that clamp and release the chip component from at least four sides. Each of the clamping claws 401 is arranged around the distal end of the central shaft 402, and is supported by placing the lower end side within the socket 404 of the inner tube 403 on a plate 405 that is integrated with the central shaft 402. Furthermore, each pawl 401 is fitted into a recess 406 formed by notching the axial line on the distal end side of the central shaft 402, and a protrusion 408 is provided on the lower side of the flange 407 that is formed to protrude along the axial line of the central shaft 402. Pivotally engaged. In addition to being pivotally engaged with the flange 407, a lever portion 409 formed to protrude outward from the main body of the claw 401 is engaged with the upper edge of the socket of the inner tube 403. Furthermore, each claw 401 has an arc-shaped notch 410 on the outer edge near the lower end.
and a coil spring ring 4 in the notch 410.
11 so that they are bound to the central shaft 402. An inner tube 403 supporting these claws 401 is fitted and supported by an outer tube 412, and is pressed upward by a compression spring 413 disposed therebetween. In addition, the outer tube 41
2 is supported by a compression spring 414, and the spring 414 is disposed between the collar 415 attached to the lower end of the central shaft 402, so that the central shaft 402 is always deflected downward. In this chuck mechanism, a plate portion 416 attached integrally with a collar 415
For example, when the center shaft 402 is pushed upward by a drive cam or the like, the center shaft 402 rises and the state in which it has been engaged with the flange 407 of the center shaft 402 is released, so that the spring ring 411 is pulled and the expansion operation is performed. I come to do it. The chip component sucked into the nozzle tip of the mounting head 10 is received by the expansion operation, and when the chip component is positioned inside each clamping claw 401, the plate portion 406 is lowered, and the center shaft 402 is moved by the compression spring 414. As it descends, the flange 407 engages with the protrusion 408 of the claw 401, and the lever 409 engages with the upper edge of the socket 404, making it possible to clamp the chip component. When each of the claws 401 clamps a chip component, the stepping motor connected to the lower part is activated and the entire assembly is rotated at an appropriate angle to determine the direction of the chip component. In this chuck mechanism, each pawl 401
Since they open and close at the same time by the action of the spring ring 411, it is possible not only to change the direction but also to center the chip parts, and furthermore, the construction can be made mechanically extremely simple. In addition, in the direction changing device 60 for standard chip parts, each of the four claws 401 is connected to the central axis 4.
However, in the device 70 for changing the direction of irregularly shaped chip components, since irregularly shaped chip components are heavy, a pair of left and right chips are provided in the mounting head 10 to assist in suctioning the nozzle tip. A pair of chips may be provided on the chuck mechanism side, and the direction may be changed by holding the chip parts therebetween. The device 70 for changing the direction of irregularly shaped chip parts can be assembled by dividing a mounting head of 60 pieces into three equal parts and arranging 10 pieces each in the order of the index determined along the rotating direction of the rotor 20. In addition, when a chip component is clamped by a mounting head equipped with this chuck mechanism, it is only necessary to return the suction direction of the chip component to the state at the time of suction before moving the mounting head for the missing chip component to the ejection device 110. A direction change device 100 is arranged.

Each mechanism configured in this manner efficiently automatically mounts chip parts using a random access method using rapid rotation of the rotor 20 in addition to the above-described sequence access method using the normal intermittent rotation of the rotor 20. It is extremely useful for accurate implementation.

Effects of the Invention As described above, according to the automatic chip component mounting machine according to the present invention, the component suction nozzle of each mounting head is aligned below the locus of movement by the intermittent rotation of the rotor, and each of the electronic components is The delivery unit is fixedly positioned facing the center of rotation of the rotor, and a plurality of electronic component supply devices are installed radially in a predetermined area around the rotor away from the location of the substrate mounting table. A plurality of mounting heads are installed at regular intervals along the entire circumference on a concentric circle of a rotor that rotates intermittently around a support shaft, while the mounting heads move within the supply area of a supply device where a plurality of electronic components are arranged side by side. Since electronic components can be received from any predetermined delivery section of the supply device at the same time, the electronic component supply device side does not have to be rotated intermittently.
Electronic components can be taken out from the supply device by simply moving the component suction nozzle of each mounting head up and down. In addition, if the vertical movement of each component suction nozzle is controlled according to a specified program corresponding to the order in which the electronic components are mounted, the electronic components can be aligned in the order in which they are mounted on the board and taken out from the supply device, and when changing the assembly circuit lot. However, this can be done simply by changing the specified program that controls the order in which each suction nozzle moves up and down.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an automatic chip component placement machine according to the present invention, FIG. 2 is a front view thereof, FIG. 3a is a schematic plan view showing the layout of the same placement machine, and FIG. 3b
Figure 4 is an explanatory diagram showing the operation mechanism of the mounting head and tape feeder, and Figure 5 is an explanatory diagram showing the operation of the mounting head of the mounting machine to take out electronic parts and re-take out improperly mounted parts. FIG. 6 is an explanatory diagram showing the operating mechanism of the direction change device, FIG. 6 is an explanatory diagram showing the operating mechanism of the mounting head when chip components are mounted, FIG. 7 is a plan view showing the vacuum pressure feeding mechanism of the mounting head, and FIG. is a side view of the tape feeder,
Fig. 9 is an explanatory diagram showing a push-up pin for chip parts to be assembled into a tape feeder, Fig. 10 is a perspective view showing the shape of the tip of the push-up pin, Fig. 11 is a side view of the tape feeder installed on a cart, and Fig. 12 is a plan view of the same, FIG. 13 is a plan view showing the missing chip component detection device, FIG. 14 is a partially cutaway side view of the direction changing device, and FIG. 15 is a side view showing a clamping claw to be incorporated into the direction changing device. Fig. 16 is a plan view showing the tip shape of the central shaft to be incorporated into the device, Fig. 17 is a perspective view of a spring ring to be incorporated into the device, and Fig. 18 is a partially cutaway view showing the direction changing device of the standard chip component. Side view, No. 19
The figure is a front view showing a direction changing device for irregularly shaped chip parts. 10, 10...: Mounting head, 20: Rotor,
30, 30...: Electronic component supply device, 40: Mounting table for component mounting board.

Claims (1)

[Claims] 1. A rotor that rotates intermittently around a support shaft, and a plurality of electronic components installed at regular intervals along the entire circumference on the concentric circle of the rotor, with the tip of the component suction nozzle that moves up and down from the rotor facing downward. A mounting head, a mounting table for a component mounting board that is placed at a predetermined position around the rotor so as to be positioned below the locus that the component suction nozzles of each of these mounting heads move with the intermittent rotation of the rotor, and a mounting table for each mounting board. The component suction nozzle of the head is aligned below the locus of movement by the intermittent rotation of the rotor, and each delivery part of the electronic component is fixedly positioned toward the center of rotation of the rotor, and the board mounting table is placed in a fixed position. A plurality of electronic component supply devices are arranged in a radial manner in a predetermined area around a rotor separated from the mounting head, and each mounting head is moved through the supply area of the plurality of arranged electronic components of the supply device. Receives the electronic components from any predetermined sending section of the supply device, and
An automatic chip component mounting machine characterized in that it is assembled into a mechanism that sequentially mounts electronic components onto a board by carrying them on a board mounting table installed at a position away from an electronic component supply area.