JPH0363931U - - Google Patents
Info
- Publication number
- JPH0363931U JPH0363931U JP12581489U JP12581489U JPH0363931U JP H0363931 U JPH0363931 U JP H0363931U JP 12581489 U JP12581489 U JP 12581489U JP 12581489 U JP12581489 U JP 12581489U JP H0363931 U JPH0363931 U JP H0363931U
- Authority
- JP
- Japan
- Prior art keywords
- recesses
- semiconductor chip
- recess
- tip
- insertion groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
Landscapes
- Die Bonding (AREA)
Description
第１図ないし第３図は本考案の一実施例に係り
、第１図は半導体チツプをピンセツトでつかんで
チツプトレイの凹所にセツトしようとする状態を
示す斜視図、第２図は凹所に半導体チツプがセツ
トされた状態を示す平面図、第３図はチツプトレ
イの分解状態の斜視図である。第４図および第５
図は従来例に係り、第４図は従来のチツプトレイ
を示す平面図、第５図は凹所への半導体チツプの
セツト状態を示す拡大平面図である。
Ａ……チツプトレイ、４……凹所、５……ピン
セツト先端挿入溝、６……半導体チツプ、７……
ピンセツト、７ａ……ピンセツト先端、８……チ
ツプ取り出し用ニードル。
1 to 3 relate to an embodiment of the present invention, in which FIG. 1 is a perspective view showing a state in which a semiconductor chip is grasped with tweezers and is about to be set in a recess of a chip tray, and FIG. FIG. 3 is a plan view showing a state in which semiconductor chips are set, and a perspective view of the chip tray in an exploded state. Figures 4 and 5
The figures relate to a conventional example; FIG. 4 is a plan view showing a conventional chip tray, and FIG. 5 is an enlarged plan view showing a state in which a semiconductor chip is set in a recess. A... Chip tray, 4... Recess, 5... Tweezers tip insertion groove, 6... Semiconductor chip, 7...
Tweezers, 7a... Tweezers tip, 8... Needle for removing chips.
Claims (1)
い寸法をもつた複数の凹所と、 各凹所の両側にその凹所に連なる状態で形成さ
れ、半導体チツプよりも幅の小さいピンセツト先
端挿入溝 とを備えたチツプトレイ。[Claims for Utility Model Registration] A plurality of recesses with dimensions slightly larger than the semiconductor chip to be set, and a plurality of recesses formed on both sides of each recess so as to be continuous with the recesses, and with a width larger than the semiconductor chip. A tip tray with a small tweezers tip insertion groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12581489U JPH0363931U (en) | 1989-10-26 | 1989-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12581489U JPH0363931U (en) | 1989-10-26 | 1989-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363931U true JPH0363931U (en) | 1991-06-21 |
Family
ID=31673666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12581489U Pending JPH0363931U (en) | 1989-10-26 | 1989-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363931U (en) |
-
1989
- 1989-10-26 JP JP12581489U patent/JPH0363931U/ja active Pending