JPH0363933U - - Google Patents
Info
- Publication number
- JPH0363933U JPH0363933U JP12472489U JP12472489U JPH0363933U JP H0363933 U JPH0363933 U JP H0363933U JP 12472489 U JP12472489 U JP 12472489U JP 12472489 U JP12472489 U JP 12472489U JP H0363933 U JPH0363933 U JP H0363933U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- relay ring
- test head
- chip
- microscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例を示す半導体ウエハ
ー検査装置の構成図で、Ａは要部側面図ＢはＢ−
Ｂ′部から見た要部平面図、第２図は本考案の半
導体ウエハー検査装置の信号の流れを示す説明図
である。
１２……プローブピン、１５……プローブカー
ドソケツト、１６……パフオーマンスボード、１
６１……ランド、１７……テストヘツド、１７１
……固定ホルダー、１８……中継リング、１８２
……コンタクトピン、１９……顕微鏡の覗き穴。
FIG. 1 is a block diagram of a semiconductor wafer inspection apparatus showing an embodiment of the present invention, in which A is a side view of the main part and B is a side view of the main part.
FIG. 2 is a plan view of the main part seen from section B', and is an explanatory diagram showing the signal flow of the semiconductor wafer inspection apparatus of the present invention. 12...Probe pin, 15...Probe card socket, 16...Performance board, 1
61...land, 17...test head, 171
... Fixed holder, 18 ... Relay ring, 182
...Contact pin, 19...Microscope peephole.
Claims (1)
を単位チツプ毎に検査するプローバーと、このプ
ローバーに設けられたパフオーマンスボードに着
脱可能な中継リングと、この中継リングを介して
電気的接続がされるテストヘツドを備え、中継リ
ングとテストヘツドとに顕微鏡覗き穴が設けられ
た半導体ウエハー検査装置において、 前記中継リングに、 前記パフオーマンスボードのパターン上に設け
られたランドからＩＣチツプの入出力信号を直接
授受することができるコンタクトピンを設け、 前記テストヘツド及び中継リングの顕微鏡覗き
穴外周にコンタクトピンからの電気信号を導くた
めの接続手段と、 を設けたことを特徴とした半導体ウエハー検査装
置。[Claims for Utility Model Registration] A prober that inspects each semiconductor chip formed in a semiconductor wafer unit by chip, a relay ring that is detachable from a performance board provided on the prober, and a relay ring that inspects each semiconductor chip formed in a semiconductor wafer. In a semiconductor wafer inspection apparatus equipped with a test head to which electrical connection is made and a microscope peephole provided in the relay ring and the test head, an IC chip is inserted into the relay ring from a land provided on the pattern of the performance board. A semiconductor wafer inspection characterized in that contact pins capable of directly transmitting and receiving output signals are provided, and connecting means for guiding electrical signals from the contact pins is provided on the outer periphery of the microscope peephole of the test head and the relay ring. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12472489U JPH0363933U (en) | 1989-10-25 | 1989-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12472489U JPH0363933U (en) | 1989-10-25 | 1989-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363933U true JPH0363933U (en) | 1991-06-21 |
Family
ID=31672629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12472489U Pending JPH0363933U (en) | 1989-10-25 | 1989-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363933U (en) |
-
1989
- 1989-10-25 JP JP12472489U patent/JPH0363933U/ja active Pending
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