JPH0363993U - - Google Patents

Info

Publication number
JPH0363993U
JPH0363993U JP1989126434U JP12643489U JPH0363993U JP H0363993 U JPH0363993 U JP H0363993U JP 1989126434 U JP1989126434 U JP 1989126434U JP 12643489 U JP12643489 U JP 12643489U JP H0363993 U JPH0363993 U JP H0363993U
Authority
JP
Japan
Prior art keywords
cooling
fumarole
pump
printed board
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989126434U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989126434U priority Critical patent/JPH0363993U/ja
Publication of JPH0363993U publication Critical patent/JPH0363993U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例による浸漬冷却装置
を示す一部切欠斜視図、第２図は作用を示す断面
図、第３図は従来の浸漬冷却装置を示す一部切欠
斜視図、第４図は課題を示す断面図である。 図において、１……プリント板、１−１……基
板、１−２……ＬＳｉ、２……冷却槽、２ａ……
供給口、２ｂ……排出口、３……冷却液、１４…
…噴気部材、１４ａ……噴気口、１５……ポンプ
、１６……気泡、を示す。 FIG. 1 is a partially cutaway perspective view showing an immersion cooling device according to an embodiment of the present invention, FIG. 2 is a sectional view showing the operation, and FIG. 3 is a partially cutaway perspective view showing a conventional immersion cooling device. Figure 4 is a cross-sectional view showing the problem. In the figure, 1...Printed board, 1-1...Substrate, 1-2...LSi, 2...Cooling tank, 2a...
Supply port, 2b...Discharge port, 3...Cooling liquid, 14...
. . . Fumarole member, 14a . . . Fumarole port, 15 . . . Pump, 16 .

Claims (1)

【実用新案登録請求の範囲】 プリント板１を格納する容器の当該プリント板
１側端面と対向する一方の側壁下部に冷却液の供
給口２ａを設け、他方の側壁上部に供給された前
記冷却液の排出口２ｂを設けた冷却槽２と、 上記供給口２ａおよび該排出口２ｂと連結して
、前記冷却液の循環用ポンプ４−１と冷却する手
段４−２，４−２ａを設けた循環流路４と、 微細径の噴気口１４ａを多数個突設して上記冷
却槽２の底部に配設する噴気部材１４と、 上記冷却槽２上部のガスを吸引して上記噴気部
材１４の噴気口１４ａより噴射させて循環するポ
ンプ１５とから構成したことを特徴とする浸漬冷
却装置。[Claims for Utility Model Registration] A cooling liquid supply port 2a is provided at the lower part of one side wall of the container storing the printed board 1 facing the side end surface of the printed board 1, and the cooling liquid is supplied to the upper part of the other side wall. A cooling tank 2 provided with a discharge port 2b, and a pump 4-1 for circulating the coolant and cooling means 4-2 and 4-2a connected to the supply port 2a and the discharge port 2b. a circulation flow path 4; a fumarole member 14 having a large number of micro-diameter fumarole ports 14a protruding from the bottom of the cooling tank 2; An immersion cooling device characterized by comprising a pump 15 that injects and circulates from a blowhole 14a.
JP1989126434U 1989-10-26 1989-10-26 Pending JPH0363993U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989126434U JPH0363993U (en) 1989-10-26 1989-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989126434U JPH0363993U (en) 1989-10-26 1989-10-26

Publications (1)

Publication Number Publication Date
JPH0363993U true JPH0363993U (en) 1991-06-21

Family

ID=31674246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989126434U Pending JPH0363993U (en) 1989-10-26 1989-10-26

Country Status (1)

Country Link
JP (1) JPH0363993U (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014175627A (en) * 2013-03-13 2014-09-22 Daihen Corp Transformer
WO2016075838A1 (en) * 2014-11-14 2016-05-19 株式会社ＥｘａＳｃａｌｅｒ Cooling system and cooling method for electronic apparatus
WO2016088280A1 (en) * 2014-12-05 2016-06-09 株式会社ＥｘａＳｃａｌｅｒ Electronic apparatus cooling device
JP5956098B1 (en) * 2015-01-22 2016-07-20 株式会社ＥｘａＳｃａｌｅｒ Electronic device and cooling device for electronic device
JP2017050548A (en) * 2016-10-13 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ Electronic equipment cooling system
JP2017191431A (en) * 2016-04-13 2017-10-19 富士通株式会社 Data center and data center control method
JP2018200945A (en) * 2017-05-26 2018-12-20 富士通株式会社 Cooler and electronic system
JP2022122811A (en) * 2021-02-10 2022-08-23 聡 安斎 Cooling device of arithmetic processing device
JP2023520456A (en) * 2020-03-30 2023-05-17 シエル・インターナシヨネイル・リサーチ・マーチヤツピイ・ベー・ウイ thermal management system
EP4274394A1 (en) * 2022-05-06 2023-11-08 Wistron Corporation Fluid distribution assembly and cooling system including the same
JP2025515187A (en) * 2022-05-06 2025-05-13 シェンジェン エンビクール テクノロジー カンパニー リミテッド cooling device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014175627A (en) * 2013-03-13 2014-09-22 Daihen Corp Transformer
WO2016075838A1 (en) * 2014-11-14 2016-05-19 株式会社ＥｘａＳｃａｌｅｒ Cooling system and cooling method for electronic apparatus
WO2016088280A1 (en) * 2014-12-05 2016-06-09 株式会社ＥｘａＳｃａｌｅｒ Electronic apparatus cooling device
JP5956097B1 (en) * 2014-12-05 2016-07-20 株式会社ＥｘａＳｃａｌｅｒ Electronic equipment cooling device
JP5956098B1 (en) * 2015-01-22 2016-07-20 株式会社ＥｘａＳｃａｌｅｒ Electronic device and cooling device for electronic device
WO2016117098A1 (en) * 2015-01-22 2016-07-28 株式会社ＥｘａＳｃａｌｅｒ Electronic instrument and cooling apparatus for electronic instrument
JP2017191431A (en) * 2016-04-13 2017-10-19 富士通株式会社 Data center and data center control method
JP2017050548A (en) * 2016-10-13 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ Electronic equipment cooling system
JP2018200945A (en) * 2017-05-26 2018-12-20 富士通株式会社 Cooler and electronic system
JP2023520456A (en) * 2020-03-30 2023-05-17 シエル・インターナシヨネイル・リサーチ・マーチヤツピイ・ベー・ウイ thermal management system
JP2022122811A (en) * 2021-02-10 2022-08-23 聡 安斎 Cooling device of arithmetic processing device
EP4274394A1 (en) * 2022-05-06 2023-11-08 Wistron Corporation Fluid distribution assembly and cooling system including the same
JP2025515187A (en) * 2022-05-06 2025-05-13 シェンジェン エンビクール テクノロジー カンパニー リミテッド cooling device
US12408295B2 (en) 2022-05-06 2025-09-02 Wistron Corp. Fluid distribution assembly and cooling system including the same

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