JPH0367446U - - Google Patents
Info
- Publication number
- JPH0367446U JPH0367446U JP1989128737U JP12873789U JPH0367446U JP H0367446 U JPH0367446 U JP H0367446U JP 1989128737 U JP1989128737 U JP 1989128737U JP 12873789 U JP12873789 U JP 12873789U JP H0367446 U JPH0367446 U JP H0367446U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling chamber
- semiconductor device
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例による浸漬冷却モジ
ユールの構造を示す断面図、第２図は本実施例の
ノズルを示す拡大斜視図、第３図は作用を示す斜
視図、第４図は従来の浸漬冷却モジユールの構造
を示す断面図、第５図は課題を示す断面図である
。
図において、１……プリント基板、２……ＬＳ
ｉ、２−３……リード端子、５……シール部材、
１３……冷媒供給板、１３ａ……供給口、１３ｂ
……流路、１３ｃ……排出口、１３ｄ……冷却室
、１４……ノズル、１４ａ……噴射口、を示す。
FIG. 1 is a sectional view showing the structure of an immersion cooling module according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view showing the nozzle of this embodiment, FIG. 3 is a perspective view showing the operation, and FIG. FIG. 5 is a cross-sectional view showing the structure of a conventional immersion cooling module, and FIG. 5 is a cross-sectional view showing problems. In the figure, 1...printed circuit board, 2...LS
i, 2-3...Lead terminal, 5...Sealing member,
13... Refrigerant supply plate, 13a... Supply port, 13b
...Flow path, 13c...Discharge port, 13d...Cooling chamber, 14...Nozzle, 14a...Injection port.
Claims (1)
と、 一面側に上記半導体装置を密封して冷却する冷
却室１３ｄを形成して、他面側に冷却液を該冷却
室１３ｄに供給する手段１３ａ，１３ｄおよび排
出口１３ｃを設け、上記供給手段１３ｂと導通す
る貫通孔を、該冷却室１３ｄの上記プリント基板
１に実装した各隣接する該半導体装置２間の中央
部と対向する位置に穿設した冷媒供給板１３と、 一端側を前記貫通孔に挿入して上記冷媒供給板
１３の該供給手段１３ｂと接続させ、他端側に上
記半導体装置２の外周より前記冷却液を噴射する
噴射口１４ａを設けたＪ字形ノズル１４とから構
成したことを特徴とする浸漬冷却モジユールの構
造。[Scope of claim for utility model registration] Printed circuit board 1 with semiconductor device 2 mounted on the main surface
A cooling chamber 13d for sealing and cooling the semiconductor device is formed on one side, and means 13a, 13d and an outlet 13c for supplying cooling liquid to the cooling chamber 13d are provided on the other side, and the supplying means A coolant supply plate 13 having a through hole communicating with the cooling chamber 13b at a position facing the center between the adjacent semiconductor devices 2 mounted on the printed circuit board 1 of the cooling chamber 13d; A J-shaped nozzle 14 is inserted into the hole and connected to the supply means 13b of the refrigerant supply plate 13, and has an injection port 14a at the other end for injecting the cooling liquid from the outer periphery of the semiconductor device 2. A structure of an immersion cooling module characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128737U JPH0367446U (en) | 1989-11-01 | 1989-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128737U JPH0367446U (en) | 1989-11-01 | 1989-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367446U true JPH0367446U (en) | 1991-07-01 |
Family
ID=31676423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989128737U Pending JPH0367446U (en) | 1989-11-01 | 1989-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367446U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026066182A (en) * | 2024-10-06 | 2026-04-16 | リクアクール アイピー エルエルシー | Sealed liquid cooling system |
-
1989
- 1989-11-01 JP JP1989128737U patent/JPH0367446U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026066182A (en) * | 2024-10-06 | 2026-04-16 | リクアクール アイピー エルエルシー | Sealed liquid cooling system |
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