JPH0363997U - - Google Patents
Info
- Publication number
- JPH0363997U JPH0363997U JP12471489U JP12471489U JPH0363997U JP H0363997 U JPH0363997 U JP H0363997U JP 12471489 U JP12471489 U JP 12471489U JP 12471489 U JP12471489 U JP 12471489U JP H0363997 U JPH0363997 U JP H0363997U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- type integrated
- dip type
- adhesive
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図はこの考案の一実施例を示す正面図、第
２図は側面図、第３図は従来のＤＩＰ形集積回路
の放射線シールド装置を示す正面図、第４図は側
面図である。
図において、１……基板、２……パツト、３…
…ＤＩＰ形集積回路、４……リード線、５……リ
ボン線、６……第１の接着層、７……鉛板、８…
…第２の接着層、９……Ｕ字形絶縁体、１０……
切欠きである。なお、図中、同一あるいは相当部
分には同一符号を付して示してある。
FIG. 1 is a front view showing an embodiment of this invention, FIG. 2 is a side view, FIG. 3 is a front view showing a conventional radiation shielding device for a DIP type integrated circuit, and FIG. 4 is a side view. In the figure, 1...board, 2...pat, 3...
...DIP type integrated circuit, 4... Lead wire, 5... Ribbon wire, 6... First adhesive layer, 7... Lead plate, 8...
... second adhesive layer, 9 ... U-shaped insulator, 10 ...
It is a notch. In the drawings, the same or corresponding parts are denoted by the same reference numerals.
Claims (1)
付けられたＤＩＰ形集積回路に、上記ＤＩＰ形集
積回路からのリード線部を貫通する切欠きを備え
、上記ＤＩＰ形集積回路を完全に覆うＵ字形絶縁
体を接着剤を介して固定し、上記ＤＩＰ形集積回
路のリード線とパツトをリボン線で接続構成した
ことを特徴とするＤＩＰ形集積回路の放射線シー
ルド装置。 A DIP type integrated circuit attached to a substrate in an electronic device chassis via an adhesive is provided with a notch that passes through a lead wire portion from the DIP type integrated circuit, and a U-shape that completely covers the DIP type integrated circuit. A radiation shielding device for a DIP type integrated circuit, characterized in that an insulator is fixed via an adhesive, and the lead wire and the pad of the DIP type integrated circuit are connected by a ribbon wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12471489U JPH0363997U (en) | 1989-10-25 | 1989-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12471489U JPH0363997U (en) | 1989-10-25 | 1989-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363997U true JPH0363997U (en) | 1991-06-21 |
Family
ID=31672619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12471489U Pending JPH0363997U (en) | 1989-10-25 | 1989-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363997U (en) |
-
1989
- 1989-10-25 JP JP12471489U patent/JPH0363997U/ja active Pending
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