JPH0364092A - Structure of footprint frame for chip component - Google Patents

Abstract

PURPOSE:To obtain a footprint frame formed by punching a thin metal plate for mounting a chip component on an existing printed board by forming guide grooves for bending a lead in a boundary to a mount of one end side of the lead, and grooves for separation from a frame at the other end side. CONSTITUTION:A foot printed frame 1 is composed of a pair of frames 2 opposed at the outermost side, a mount 3 for securing one electrode of a chip component having two electrodes between the frames 2, and a pair of footprints 5 made of leads 4 for supporting at both ends the mount 3. When the prints 5 are individually separated from the frames 2, grooves 6 for easily separating are provided at the ends of the leads 4, and a guide groove 7 for easily bending the lead 4 is formed at a boundary between the mount 3 and the lead 4.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention is used for assembling an electronic circuit package, and is a foot for mounting a chip component having two electrodes on a printed board on which a circuit pattern is formed. It is interposed in the structure of the print frame.

[Conventional technology]

Conventionally, electronic circuit packages are assembled by forming a circuit pattern based on a detailed design using conductive materials on a thin plate made of an insulating material to form a printed board. Each predetermined mounting position has a corresponding number of electronic components, such as an IC with multiple lead terminals, or an IC with two electrodes.
An electronic circuit package constituting a desired electronic circuit was assembled by placing various chip components such as resistors, capacitors, and diodes, and attaching them using fixing means such as soldering.

[Problem to be solved by the invention]

However, with the above-mentioned conventional technology, if a change occurs during the assembly of an electronic circuit package or after the assembly has been completed and a new chip component is to be added, the circuit is already based on the design. A printed circuit board with a pattern formed on it does not have a position for attaching a new component, so additional components cannot be attached. Therefore, in such cases, the circuit pattern corresponding to the change is There was a problem in that the entire printed board had to be remade.

Re-creating such a printed board not only delays the manufacturing process and reduces productivity, but even if a single change is made, the entire printed board must be remade, resulting in an extremely large amount of work. The problem was that it led to an increase in costs.

Therefore, the present invention has been made to solve the above-mentioned problems, and when changes are made such as adding or replacing chi/knob parts having two electrodes, it is possible to do so without having to recreate the entire printed board. The purpose of the present invention is to provide a footprint frame for chip components that allows an electronic circuit package to be assembled by adding new chip components to an existing printed board.

[Means to solve the problem]

In order to achieve the above-mentioned object, the present invention includes a mount part which is partially punched out of a thin metal plate to which one electrode part of the chip component having the two electrodes is attached, and a lead part which supports this mount part. A plurality of footprint parts are connected to each other inside the opposing frames, and a groove part is provided at one end of the lead part to separate the footprint part from the frame;
Further, a guide groove for bending the lead portion is provided at the boundary with the mount portion on the other end side.

[For production]

With the above-described configuration, when mounting a new chip component on an existing printed circuit board using a footprint frame, the footprint parts are separated from each other by bending the grooves at the ends from between the frame frames. Bend the lead part downward at the guide groove.

Then, at a predetermined position on the printed board to be additionally mounted, make multiple mounting holes at intervals corresponding to the intervals between the bent lead parts, insert the lead parts of the footprint part into these holes, and bend them. When fixed using the method described above, a pedestal for attaching the chip component having two electrodes to be added is formed, so the newly added chip component can be attached to the mount section of each footprint section. After placing and fixing it, it is connected to a predetermined circuit pattern by wire bonding or the like. This allows new parts to be added to existing printed circuit boards.

〔Example] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing the structure of a footprint frame according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG.

In Figures 1 and 2, 1 is made by etching or stamping a thin metal plate.
This is a footprint frame that is formed by partially removing it so that it has a desired shape.

This footprint frame 1 includes a pair of frame frames 2 located at the outermost side and facing each other, and a mount for fixing one electrode part of a chip component (not shown) having two electrodes between the frame frames 2. part 3 and this mount part 3
It is composed of a pair of footprint parts 5 consisting of a lead part 4 supporting at both ends, and the pair of footprint parts 5 are patterned as one unit, and a plurality of footprint parts are formed between the frame frame 2. Individually connected.

Note that the dimensions aXb of the mount portion 3 are slightly larger than one electrode of a chip component (not shown), and the length C of the lead portion 4 is required for fixing the mount portion 3 on a printed board. Any length (for example, longer than the thickness of the printed board) is sufficient.

A groove 6 is provided at the end of each lead part 4 to facilitate separation when the footprint parts 5 are individually separated from the frame frame 2. A guide groove 7 is formed at the boundary to facilitate bending of the lead portion 4.

The footprint frame 1 is manufactured using a method that is almost the same as that used in manufacturing dual in-line resin molded semiconductor devices, that is, by etching or punching (stamping) a thin metal plate (for example, copper-based metal). ) can be partially punched out and patterned into a desired shape. Thereby, it is possible to easily manufacture the footprint frame 1 which is patterned by connecting a plurality of the pair of footprint parts 5 as one unit. In addition, the footprint part 5
Grooves 6 for individually separating the leads from the frame 2 and guide grooves 7 for bending the lead portions 4 can also be formed by the same method after punching.

After this, the mount part 3 of the footprint frame I
The lead portion 4 is surface treated with nickel-tin, for example, in order to facilitate soldering during mounting on a printed board and to provide rust prevention. Note that this surface treatment may be uniformly applied to the frame frame 2 from the viewpoint of manufacturability and the like.

And the footprint frame 1 formed in this way
The mount part 3 is required to have flatness in order to fix the chip components during actual use, so it can be held in a hoop-shaped packaging form or in a stacked packaging form cut to a certain length. It becomes necessary.

When mounting a new chip component on an existing printed board using the footprint frame 1 having such a structure,
The footprint portions 5 supported between the pair of frame frames 2 are bent at grooves 6 and separated into individual pieces, and then the lead portions 4 at both ends of each separated footprint portion 5 are inserted into guide grooves 7. Bend downward.

Next, place the
For attaching the pair of footprint parts 5, a plurality of holes are drilled at intervals corresponding to the intervals between the lead parts 4 of the footprint parts 5 using a drill or the like.

In this installation, the lead parts 4 of each footprint part 5 are inserted into the holes and fixed by bending or the like.

This means that a pedestal for attaching a chip component having two electrodes to be added is formed.

After this, each newly added chip component is placed and fixed so as to straddle each mount section 3 of the pair of footprint sections 5, and finally the chip component is connected to a predetermined circuit pattern by wire bonding. . This results in the addition of another new component to the existing printed circuit board.

Further, FIG. 3 is a plan view showing another embodiment of the footprint frame structure, in which a pair of footprint parts 5 are provided in parallel by frame support parts 8 connected at both ends to the opposing frames 2. An example is shown in which a pair of footprint parts 5 consisting of a mount part 3 for fixing the electrodes of a chip component and a lead part 4 that supports this mount part 3 from both ends is patterned as a unit. It is something that

Note that the present invention is not limited to the embodiments described above, and various modifications are possible. For example, lead parts for attaching the footprint part to the printed board are provided at two locations at both ends, but the present invention is not limited to this. Instead, they may be provided on three or four sides to ensure secure attachment, and in such a case, holes should be formed for attachment depending on the number of leads.

Moreover, the shape of the mount part 3 is not limited to a rectangle,
It only needs to be larger than the electrode of the chip component, and it can be circular, oval, or polygonal if necessary.

[Effects of the Invention] As explained above, according to the present invention, there is provided a mount portion which is partially punched out of a thin metal plate to attach one electrode portion of the chip component having the two electrodes, and the mount portion. A plurality of footprint portions are connected to each other inside the opposing frames, and a groove portion is provided at one end of the lead portion to separate the foot print portion from the frame; In addition, a guide groove for bending the lead portion is provided at the boundary with the mount portion on the other end side.

Therefore, even if a change occurs to an existing printed circuit board and a completely different component needs to be mounted, the pair of footprint sections can be separated from the footprint frame and each footprint By forming a hole in the vacant space of the printed board, the lead part of the part can be additionally mounted by easy fixing means such as bending the lead part.

Therefore, unlike in the past, even if there is a change in only one place, there is no need to reshape the entire printed board, and the existing printed board can be used as is. In addition, it has become possible to prevent the occurrence of huge costs.

[Brief explanation of drawings]

Fig. 1 is a plan view showing the structure of a footprint frame showing one embodiment of the present invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1, and Fig. 3 shows another embodiment of the invention. FIG. ■...Footprint frame 2...Frame frame 3...Mount part 4...
Lead part 5...Footprint part 6...Groove 7...Guide groove 8...Frame support part

Claims (1)

[Claims] 1. Structure of a footprint frame for a chip component for mounting a chip component having two electrodes on an existing printed board, the chip having the two electrodes being partially punched out of a thin metal plate by punching. A pair of footprint parts each consisting of a mount part to which one electrode part of the component is attached and a lead part that supports each of the mount parts are connected to each other inside opposing frames to form a plurality of them, and one end of the lead part A structure of a footprint frame for a chip component, characterized in that a guide groove for bending the lead part is provided at the boundary with the mount part on the side, and a groove part for separating the lead part from the frame frame on the other end side.