JPH036474A - IC insertion device for burn-in board and IC extraction device for burn-in board - Google Patents

Abstract

PURPOSE:To certainly insert an IC in a socket even with respect to a large and heavy burn-in board having warpage by pressing the surface not loaded with the socket of the burn-in board toward the opposite side surface thereof to correct the warpage of said board. CONSTITUTION:A burn-in board 18 is loaded with a socket 16 for mounting a burn-in IC and supported on the XY moving means of an IC inserting and extracting apparatus through the positioning means 8 and warpage correcting means 9 thereof. The means 9 is raised by a raising and lowering drive source 802 and, after the positioning of the board 18, the end part loaded with the socket 16 of the board 18 is clamped by the follower pad plates 806 of the board 18 on press rolls 805 and the under surfaces of the leading end parts of press pawls 811a, 811b. By the continuous rising of the means 9, the pawls 811a, 811b are pushed down in a state pressing the board 18 by repulsive force and, at the same time, the board 18 is pressed upwardly by the means 9 to correct the warpage of the board 18.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an IC insertion device for a burn-in board and a burn-in board for inserting an IC into a socket of a burn-in board and removing the IC from the socket for IC burn-in testing. The present invention relates to an IC extraction device for burn-in boards, and particularly to an IC insertion device for burn-in boards and an IC extraction device for burn-in boards, which are suitable for reliably inserting and extracting ICs into sockets even on warped burn-in boards.

[Conventional technology]

Conventional IC insertion/extraction devices for burn-in boards have a right-angled notch so as to completely fit into the socket mounted on the burn-in board, as described in Japanese Patent Laid-Open No. 62-56875, for example. It has been proposed that a stopper is pressed and fixed to a socket at the front end mounted on a burn-in board, and the IC is inserted based on this position.

For example, as described in Japanese Patent Application Laid-Open No. 62-96870, a burn-in board with a socket attached thereto is fixed horizontally on a movable table, the claw part of the extraction claw is extended horizontally, and the socket is moved forward. The claw part of the extraction claw is inserted into the groove, the semiconductor device is extracted from below and the receiver is held down by a presser from above, and the semiconductor device is pulled out from the socket by the extraction claw and the presser rising, and horizontally placed above. An extraction device has been proposed in which the extraction device is pushed out onto a built-in storage rail using an extrusion device.

For example, as described in Japanese Patent Application Laid-Open No. 62-184371, a burn-in board is fixed on a movable table that is driven in the X and Y force directions, and a movable base that is supported above the table and reciprocated in the X direction. An apparatus has been proposed in which an IC insertion head and an IC extraction head are attached to a burn-in board, and the insertion head and the IC extraction head are reciprocated in the X direction to insert and remove an IC from the burn-in board.

Furthermore, as described in Japanese Patent Laid-open No. 63-33672, for example, the operation of inserting an untested IC involves the simultaneous lifting and lowering of the insertion chuck, the reciprocating movement of the unit supporting the chuck, and the control of the moving plate. An apparatus has been proposed that extracts and inserts a test IC by sequentially performing the steps.

[Problem to be solved by the invention] The process of performing a burn-in test on an IC can be roughly divided into:
As shown in FIG. 15, the process is divided into a process of inserting the IC into the socket of the burn-in board, a process of performing a burn-in test on the IC, and a process of removing the IC from the socket after the burn-in test is completed.

Therefore, burn-in boards are becoming larger and heavier as burn-in tests become more efficient and ICs become larger. Further, during a burn-in test, the burn-in board may warp due to temperature load applied to the burn-in board.

In contrast, the above-mentioned conventional technology does not take into consideration large, heavy, and warped burn-in boards.
If the burn-in board is warped, the IC extraction head may destroy the socket mounted on the burn-in board, or the IC insertion head or extraction head may not be able to reach the socket mounted on the burn-in board, making it impossible to insert or remove the IC. There was a problem.

Also, no consideration was given to accurately positioning thick (, heavy, and warped burn-in boards) at the insertion/extraction positions.
There was a problem in that it was not possible to accurately position the burn-in board.

The first object of the present invention is to provide an RC cable to the socket of the burn-in board even when the burn-in board is large, heavy, and warped.
An object of the present invention is to provide an IC insertion device for a burn-in board that can reliably insert a burn-in board.

A second object of the present invention is to provide an IC insertion device for a burn-in board that can accurately position a burn-in board 1 even if the burn-in board is large, heavy, and warped.

A third object of the present invention is to insert an IC for a burn-in board, which makes it possible to detect in advance an unused socket such as a defective socket, even if the burn-in board is large, heavy, and warped. The goal is to provide equipment.

A fourth object of the present invention is to provide an IC for a burn-in board that can reliably extract an IC from a burn-in board socket of 1~'' even if the burn-in board is large, heavy, and warped.
An object of the present invention is to provide a C extraction device.

A fifth object of the present invention is to provide an IC extraction device for a burn-in board that can accurately position a burn-in board even if the burn-in board is large, heavy, and warped.

A sixth object of the present invention is to provide an IC extraction device for a burn-in board that is capable of detecting unused sockets such as defective sockets in advance even when the burn-in board is large, heavy, and warped, with the warpage of the burn-in board corrected. Our goal is to provide the following.

[Means for Solving the Problems] In order to achieve the above first object, in the burn-in board IC insertion device of the present invention, the burn-in IC
A unit that supports a burn-in board mounting a socket for inserting the burn-in board, a support member supporting a surface on the periphery of the burn-in board where the socket is not mounted, and a holding member holding down the socket mounting surface of the periphery of the burn-in board. The present invention includes a base, and a warpage correcting means supported by the unit base for pressing the surface of the burn-in board on which the socket is not mounted toward the opposite side to correct the warpage of the burn-in board.

In order to achieve the second object, in the burn-in board IC insertion device of the present invention, the unit base is provided with a positioning pin to be inserted into a positioning hole provided in the burn-in board.

In addition, since the positioning pin is inserted following the positioning hole, the support member is slidably supported by the unit base via a spring, and the surface of the support member that contacts the burn-in board has low friction. It is equipped with a force tracing member.

In addition, instead of the low-friction copying member, an air hole is provided for blowing out compressed air toward the burn-in board.

In addition, a rotatable spherical bearing for tracing is provided in place of the low-frictional tracing member.

In order to achieve the third object, the burn-in IC insertion device of the present invention includes a burn-in board on which a socket for inserting an IC to be burn-in is mounted, and a surface on the periphery of the burn-in board where the socket is not mounted. a unit base that supports a support member that supports the burn-in board and a pressing member that presses the socket mounting surface of the peripheral portion of the burn-in board; The present invention is equipped with a warpage correction means for correcting the warpage of the burn-in board by pressing the burn-in board, and an unused socket detection means for optically detecting unused sockets including defective sockets.

In order to achieve the fourth object, the burn-in board IC extraction device of the present invention includes the burn-in board, the unit base, and the warpage correction means.

In order to achieve the fifth object, the burn-in board IC extraction device of the present invention includes the positioning hole and the positioning pin.

0 In order to achieve the above sixth object, the burn-in IC extraction device of the present invention includes the burn-in board, the unit base, the warpage correction means, and the unused socket detection means. be.

[Effect]

Burn-in board I of the present invention configured as described above
In the C insertion device and the burn-in board IC extraction device, even if the burn-in board is large, heavy, and warped, the warp can be corrected by the warp correction means with both sides of the periphery supported by the support member and the presser member. ,
The IC can be reliably inserted into and removed from the socket.

In addition, even if the socket of the burn-in board is shifted from the IC insertion or extraction position, the positioning pin will be aligned with the positioning hole by the copying plate provided on the support member, compressed air from the air hole, or the copying spherical support. The burn-in board socket can be accurately positioned at the IC insertion or extraction position.

Furthermore, since unused sockets can be detected in advance, it is possible to prevent malfunctions when inserting or removing an IC from an unused socket.

〔Example〕

Hereinafter, a burn-in board IC that is an embodiment of the present invention will be described.
1 to 12 showing the insertion/extraction device will be explained.

As shown in FIGS. 1 to 3, an IC inserting means 3 and an IC extracting means 4 having the same configuration are installed on a pedestal 1.2, respectively, and burn-in board supply means having the same configuration are installed on both sides of these means. 5 and burn-in board storage means 6
is installed.

The IC insertion means 3 includes an XY moving means 7 installed on the pedestal 1, a burn-in board positioning means 8 (see Fig. ψ) and a warping correction means 9, which are installed on the XY moving means 7 (not shown). (see FIG. 4), socket opening/closing means 10 and I installed above the XY moving means 7.
C insertion means 11a and drive means 12, IC supply means 13a installed at the back of the pedestal 1 with respect to FIG. 1, and defective socket detection means 14 installed on the socket opening/closing means 10 (see FIG. 12). ).

Further, the IC extracting means 4 includes a χY moving means 7, a burn-in board positioning means 8 (not shown) installed on the XY moving means 7 (see Fig. D), and a warping correction means 9 (see Fig. 4). , a socket opening/closing means 10 and an IC extracting means 11b installed above the XY moving means 7.
, a drive means 12, an IC storage means 13b installed at the back of the pedestal 1 with respect to FIG. 1, and a defective socket detection means 14 installed in the socket opening/closing means 10.

Note that the illustrated reference numeral 15 is an IC, which is configured as shown in an enlarged perspective view in FIG. 2(b). Also, the above IC
The socket 1-118 for inserting or extracting the socket 45 is made of a burn-in board and its lower surface periphery is reinforced with an outer edge member 1802.

Next, the configuration of each of the above means will be explained.

In the χY moving means 7, an X motor 702 and a Y motor 03 are driven by an output signal from an NC controller (see FIG. 12), and the XY table 701 moves in the front, back, left and right directions with respect to FIG. a plurality of sockets 16 on the burn-in board 18 supported via the burn-in board positioning means 8 and the warp correction means 9;
socket opening/closing means 10 and IC insertion means 11a, respectively.
and positioned below the IC extraction means 11b.

As shown in FIG. 4, the burn-in board positioning means 8 has a unit base 801 having a concave cross section fixed on the XY child table 01. The unit base 801 has an elevating drive source 8 fixed to its lower surface.
At 02, an elevating base 803 for elevating the interior was installed,
Four presser pieces 805, which constitute a support member, are supported on the four corners of the upper surface of the elevating base 803 so as to be movable in the vertical direction via springs 804. A burn-in board copying backing plate 806 with a small coefficient of friction is fixed. In addition, the unit base 80
Two positioning pins 8073 4 are fixed to both upper ends of the burn-in board 18 for positioning the burn-in board 18 by fitting into two positioning holes 1801 formed in the burn-in board 18. Furthermore, two converters 808 are installed on the inner side of the unit base 801, each driven by a motor 813, for transporting the burn-in board 18, and two burn-in boards for detecting the burn-in board 18 are installed at both ends of one side. Detection sensor 809a, 80
9b is fixed, and two presser pawl drive sources 810a810b constituting a presser member are fixed on both ends of the bottom surface. The two presser claw drive sources 810a, 810b are connected to the rear ends of the two presser claws 811a, 8], 1b. The two presser claws 811a and 811b are swingably supported on the bottom surface of the unit base 801 via pins 812a and 812b below the connection position with the presser claw drives #810a and 810b, respectively. Claw drive 111X810a, 810b
When the rear end is pushed, the leading end swings inward from the position shown in FIG. 5(a) to the position shown in FIG. Diagram (a)
Fixed horizontal movement against.

The warpage correction means 9 is formed into a flat plate shape as shown in FIG. 4, and is fixed on the elevating base 803 of the burn-in board positioning means 8.

Next, the operations of the burn-in board positioning means 8 and the warp correction means 9 will be explained.

First, the burn-in board 18 is conveyed by the conhair 808 in the direction of the arrow shown in FIG. 5(a), and when the burn-in board detection sensor 809a on the right side in FIG. Drive source 8
10b is driven, and the tip of the presser claw 811b swings upward.

Continuing, burn-in board 1 is transferred by conveyor 80111.
8 is conveyed, and when its tip touches the tip of the presser pawl 811b and its rear end is detected by the burn-in board detection sensor 809a on the left side, conveyance of the burn-in board 18 by the conveyor 808 is stopped and the presser pawl The drive source 810a is driven, and the tip of the presser pawl 811a swings upward to come into contact with the rear end of the burn-in board 18, as shown in FIG. 6(a).

Further, the elevating drive source 802 is driven, and the warp correcting means 9 moves upward via the elevating base 803 to place the burn-in board 18 on the conditioned hair 808 on the warp correcting means 9.

Subsequently, the warpage correction means 9 is raised by the lifting drive source 802, and when the tip of the positioning pin 807 comes into contact with the edge of the positioning hole 180I as shown in FIG. The positioning pin 807 is inserted into the positioning hole 1701 as shown in FIG. 8(b) while sliding on the upper surface of the burn-in board copying plate 806 on the upper surface of the four presser pieces 805 that are in contact with it.

At this time, when the copying plate 806 is made of polytetrafluoroethylene, the burn-in board 18, which weighs about 30 Newtons, is displaced by a force of about 2 Newtons in an experiment.

Furthermore, the warp correction means 9 is raised by the lifting drive source 802, and when the positioning pin 807 is completely inserted into the positioning hole 1801 as shown in FIG. 8(C), the burn-in board 1
The day is positioned.

At this time, as shown in FIG. 9(a), the burn-in board 1
8, its ends are clamped by the lower surfaces of the tips of two presser claws 811a and 811b and the presser claw 811a.

When the warpage correction means 8 is further raised by the elevating drive source 802, as shown in FIG. 9(b), the presser claw 811a
, 811b are pushed down by the reaction force while pressing the burn-in board 18, and at the same time, the warp correction means 9 presses the burn-in board 18 upward and corrects the warp.

Therefore, the burn-in board 18 can be positioned with the warpage corrected. In addition, the warpage correction means 9
Since the burn-in board 18 always stops at the position shown in FIG. 10(b), it is possible to prevent the burn-in board 18 from warping upward.

As shown in FIG. 10, the socket opening/closing means 10 has a spring 1002 (
The socket opening/closing head 1003, whose upper end always faces each other, moves up and down due to the elastic force of the socket (not shown) (see FIG. 2). The socket opening/closing head 1003 moves downward and its lower end pushes the upper surface of the socket 16 shown in FIG. 12, thereby pushing the upper edge of the socket 16 outward.
When moved upwards, the upper 78 edge of the socket 16 returns to its original state.

As shown in FIG. 10, the IC insertion means 11a is always attached to the outer peripheral surface of the cylindrical cam 1101a by the rotation of the cylindrical cam 1101a fixed to the same rotating shaft 1203 as the cylindrical cam 1001 of the socket opening/closing means 10. The contacting insertion head 1102a moves up and down. The inserted hair [1
102a attracts ICl to its lower end when it moves downward.
3 is inserted into the socket 16 opened by the socket opening/closing means 10, and when the insertion is completed, the ICl 3 is released from the suction and moved upward.

As shown in FIG.
The operation is opposite to that of the C insertion means 12a. That is, the extraction head 1102b is rotated by the rotation of the cylindrical cam 1101b.
moves downward and its lower end contacts the ICl3 inserted into the socket 16, the extraction head 1102b attracts the ICl3 to its lower end, and then the extraction head 1102b moves upward and inserts the ICl3 into the socket. Extract from 16.

The driving means 12 includes a motor 120 as shown in FIG.
1 is driven, a rotating shaft 1203 rotates via a pair of gears 1202 at its tip, and the socket opens and closes via two cylindrical cams 1001 and 1101a or 1101b fixed to the rotating shaft 12o3. It drives the means 10 and the IC insertion means 11a or the IC extraction means 11b.

As shown in FIG. 12, the defective socket detection means 14 includes a light emitting element 1401 that emits light from an oblique direction toward the socket 16 on the horn-in board 18;
The socket 16 is installed in the opposite oblique direction to the socket 401.
a light receiving element 1402 that receives reflected light from the
NC that drives and controls the motor 602 and Y motor 603
A sequence controller 1403 connected to the controller 604 is provided. The socket 16 is covered with a reflecting plate 1404 on its upper surface that reflects the light from the light receiving element 1402 when the socket 16 is found to be defective as a result of inspection. When the light receiving element 1402 receives the reflected light from the socket 16, OV is output to the sequence controller 1403, and when the reflected light from the socket 16 is not received,
12V is output to the sequence controller 1403. Further, when the sequence controller 1403 completes movement to the position detected by the socket 16 detected by the XY moving means 7, the NC controller 703
The output signal is input from socket 1 located at the detection position.
6 is detected by the output signal from the light receiving element 1402.

The burn-in board supply means 5 and the burn-in board storage means 6 are driven by motors 501 and 601, respectively, and screw shafts 502 and 602 rotate. One screw shaft 5
02 rotates, and the pedestal 503 screwed and supported thereon moves upward to remove the burn-in board 1 from the XY moving means 6 which has already reached the vicinity of the burn-in board supply means 5.
7 is placed, it moves downward and returns to the original position shown in FIG. Further, when the other screw shaft 602 rotates and the pedestal 503 screwed and supported thereon moves upward, the burn-in board 18 placed on the pedestal 503 is shaken, causing the vicinity of the burn-in board storage means 6 X has reached
It is placed on the Y moving means 7. When the burn-in board 18 is placed on the XY moving means 7, the pedestal 503 moves downward and returns to the original position shown in FIG.

The IC supply means 13a and the IC storage means 13b are
The IC insertion means 11a and the IC insertion means 11a and the IC
Conhair 1301 extends to a position below extraction means 11b
a and 1301b are installed, and one IC supply means 13a inserts the IC 14 from the right side to the left side IC insertion means 11a.
The other IC storage means 13b is supplied to the lower position of the IC storage means 13b.
IC extracted from the socket 16 by the C extraction means 11b
Transport l3 from the left side to the right side.

Next, the overall operation of the burn-in board IC insertion/extraction apparatus will be explained.

First, the burn-in board 18 supplied by the burn-in board storage means 6 is placed between two of the burn-in board positioning means 8 installed on the XY moving means 7 on the side of the IC extracting means 4.
When placed on the conveyor 808, it is positioned by the burn-in board positioning means 8 and the warp 1 2 is corrected by the warp correction means 9.

Then, the burn-in board 18 is moved by the XY moving means 7.
The socket 16 for extracting the second ICl3 is the IC extracting means 11
It is moved to the lower position and positioned.

Thereafter, the defective socket detection means 14 detects whether the socket 16 is defective or not, and if the socket 16 is good as a result of the detection, the cylindrical cam 100 of the socket opening/closing means 10 is activated.
1 rotation, the socket opening/closing head 1003 moves downward and opens the socket 16 at its lower end. Also, a cylindrical cam 11 fixed on the same axis as the cylindrical cam 1001
01b, the extraction head 110 of the IC extraction means 11b
2 b moves downward and adsorbs ICl3 at its lower end, and then the IC extraction means 1 is removed together with the socket I and the opening/closing means 10.
1b moves upward and extracts the ICl3 from within the socket 16.

Then, the extraction head 1102 moves downward to remove the IC.
15 is placed on the container 1301b of the IC storage means 13b and conveyed toward the back of the pedestal 1 in FIG.
The extraction of one ICl3 is completed.

When the ICs 1 and 5 are extracted from all the sockets 16 on the burn-in board 18 in this way, the warp correction of the burn-in board 18 by the warp correction means 9 installed on the XY moving means 7 is released, and the burn-in board positioning means Release the positioning of the burn-in board 18 by 8 and move the burn-in board 18 to the two
8.

Next, the two presser claws 810a installed on the burn-in board positioning means 8 are swung downward, and the χY moving means 7
The burn-in board 18 is moved in the direction of the IC insertion means 3, and the burn-in board 18 is moved toward the IC extraction means 4 side in advance.
The reharn inboard 18 is transferred to the converter 808 installed on the xy moving means 7 on the side of the C insertion means 3.

Thereafter, the burn-in board 18 is positioned by the burn-in board positioning means 8 and the warp is corrected by the warp correction means 9.

Next, the socket 16 into which the IC 15 is inserted is moved and positioned by the XY moving means 7 to a position below the IC insertion means 11a.

Thereafter, the defective socket detection means 14 detects whether the socket 16 is defective or not, and if the socket 16 is found to be good as a result of the detection, the cylindrical cam 10 of the socket opening/closing means 1o
01, the socket opening/closing head 1003 moves downward and opens the socket eye 6 at its lower end. Further, the insertion head 1102a of the IC insertion means 11a moves downward by the cylindrical cam 1101a, and inserts into the socket 16 the ICl3 that has been sucked in advance from the IC supply means 13a at its lower end.

When the ICl3 is completely inserted into the socket 16, the socket opening/closing head 1003 of the socket opening/closing means 10 and the IC
The insertion head 1102a of the insertion means 11a moves upward and the insertion of the ICl3 into one socket 16 is completed.

When the insertion of the ICl 3 into all the sockets 16 on the burn-in board 18 is completed in this way, the correction of the burn-in board 18 by the warp correction means 9 on the XY moving means 7 is released, and the burn-in board positioning means 8 The positioning of the board 18 is released and the burn-in board 18 is placed on the two conveyors 8.

Next, the two presser claws 810a of the burn-in board positioning means 8 are swung downward, and the burn-in board 18 is moved to the burn-in board supply means 5 by the XY moving means 7, and then the burn-in board 18 is moved by the burn-in board supply means 5. Lower it to the lower position shown in FIG.

Next, FIG. 13, which shows a presser foot piece 805' which is another embodiment of the present invention, will be described.

The presser foot piece 805' shown in FIG. 13 is different from the presser foot piece 805 shown in FIG.
Multiple air holes 8 connected to a compressed air supply source instead of 06
The difference is that 14' is provided, and the rest are the same, so
Components other than the above are designated by the same reference numerals as the presser foot piece 805 shown in FIG.

In this embodiment, as shown in FIG. 13(a), the burn-in board 18 is heated by blowing compressed air 815' toward the lower surface of the outer edge member 1802 of the lower surface of the burn-in board 18 from the air hole 814'. The presser foot 80
The positioning pin 807 is inserted into the positioning hole 18015 6 by swinging from side to side as shown in FIG.

Afterwards, when the positioning pin 807 is inserted into the positioning hole 1801 as shown in FIG. 13(C), the blowing of compressed air is stopped and the presser piece 805' moves upward to straighten the warp of the burn-in board 18. The process moves on to the warpage correction operation by means 9.

Next, a presser piece 805 which is still another embodiment of the present invention
14 which shows ``.'' will be explained.

The presser foot 805'' shown in FIG. 14 differs from the presser foot 805' shown in FIG. 13 in that a burn-in board copying ball bearing 816'' is provided on the top surface instead of the air hole 814'. Since the other parts are the same, they are indicated by the same reference numerals as in FIG. 13.

In this embodiment, the presser foot 805'' moves upward as shown in FIG. 141D(a), and as shown in FIG.
As shown in b), a burn-in board copying ball bearing 816
'' comes into contact with the lower surface of the lower outer edge member 1802 of the burn-in board 18, the burn-in board 18 inserts the positioning pin 807 into the positioning hole 1801 while moving left and right on the burn-in board copying ball bearing 816''.

Thereafter, as shown in FIG. 14(C), when the positioning pin 807 is inserted into the positioning hole 1801, the presser piece 805'' moves upward, causing the burn-in board 18 to undergo a warp correction operation by the warp correction means 9. and transition.

〔Effect of the invention〕

According to the present invention, even if the initial positioning accuracy of a heavy burn-in board is poor and the burn-in board itself is warped, the burn-in board can be positioned at a predetermined position and the warp can be corrected.

Furthermore, if there is an unused socket such as a defective socket, it can be detected in advance to prevent malfunctions in inserting or removing an IC from the unused socket, and to prevent damage to the IC.

[Brief explanation of the drawing]

Figure 1 shows an I for burn-in board which is an embodiment of the present invention.
C: A front view showing the insertion/extraction device; Fig. 2(a) is a side view;
Figure (b) is an enlarged perspective view of the IC, Figure 3 is a top view, Figure 4 is a perspective view showing burn-in board positioning means and warpage correction means, and Figures 5 to 7 are burn-in board positioning means and warpage correction means. Operation process diagram. Fig. 8 is an enlarged view of the process of inserting the burn-in board positioning pin into the positioning direction, Fig. 9 is an enlarged view of the warping process of the warp correction means,
Fig. 10 is an operation process diagram of the socket opening/closing means and IC insertion means, Fig. 11 is an operation process diagram of the socket opening/closing means and IC extraction means, Fig. 12 is an explanatory diagram showing the defective socket detection means, and Fig. 13 is a presser foot. FIG. 14 is an operation process diagram showing still another embodiment of the presser piece, FIG. 15 is an IC burn-in test process diagram. 3... IC insertion means, 4... rc extraction means, 5...
- Burn-in board supply means, 6... Burn-in board storage means, 7... XY moving means, 8... Burn-in board positioning means, 9... Warp correction means, 10.
...Socket opening/closing means, Ila...IC insertion means, l
lb... IC extraction means, 12... Drive means, 13a
...IC supply means, 13b...IC storage means, 14
...Defective socket detection means, 15...IC116.
...Socket, 18...Burn-in board.

Claims (1)

[Scope of Claims] 1. A burn-in board on which a socket for inserting an IC to be burned-in is mounted, a support member supporting a surface on the periphery of the burn-in board on which the socket is not mounted, and a support member on the periphery of the burn-in board. a unit base that supports a pressing member that presses a socket mounting surface; and a curvature that is supported by the unit base and that presses the surface of the burn-in board on which the socket is not mounted toward the opposite side to correct the warp of the burn-in board. An IC insertion device for a burn-in board, comprising a correction means. 2. An IC insertion device for a burn-in board, wherein the unit base according to claim 1 is provided with a positioning pin that is inserted into a positioning hole provided in the burn-in board to position the burn-in board. 3. An IC insertion device for a burn-in board, wherein the support member according to claim 1 is slidably supported by the unit base via a spring, and includes a low-friction copying member on a surface that faces the burn-in board. . 4. The support member according to claim 3 is an IC for a burn-in board, which is provided with an air hole for blowing out compressed air toward the burn-in board instead of the low-friction force copying member.
Insertion device. 5. An IC insertion device for a burn-in board, wherein the support member according to claim 3 is provided with a rotatable spherical support for copying instead of the low friction copying member. 6. A burn-in board on which a socket for inserting an IC to be burned-in is mounted, a support member for supporting a surface on the periphery of the burn-in board where the socket is not mounted, and a presser for holding down the socket mounting surface on the periphery of the burn-in board. a unit base that supports the member; and a warpage correction means supported by the unit base that presses the side of the burn-in board on which the socket is not mounted toward the opposite side of the burn-in board to correct the warpage of the burn-in board;
An IC insertion device for a burn-in board, comprising an unused socket detecting means installed above the warpage correcting means and optically detecting unused sockets including defective sockets. 7. An IC extraction device for a burn-in board, comprising the burn-in board according to claim 1, a unit base, and warpage correction means. 8. A burn-in board extraction device comprising the positioning hole and positioning pin according to claim 2. 9. An IC extraction device for burn-in board, comprising the support member according to claim 3. 10. An IC extraction device for burn-in board, comprising the support member according to claim 4. 11. An IC extraction device for burn-in board, comprising the support member according to claim 5. 12. An IC extraction device for burn-in board, comprising the unused socket detection means according to claim 6.