JPH0365867B2

JPH0365867B2 -

Info

Publication number: JPH0365867B2
Application number: JP58165161A
Authority: JP
Priority date: 1983-09-09
Filing date: 1983-09-09
Publication date: 1991-10-15
Also published as: JPS6057269A

Description

【発明の詳細な説明】［産業上の利用分野］本発明は、両面に電気回路を配したプリント基
板の検査装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an inspection device for a printed circuit board having electric circuits arranged on both sides.

［従来例の構成とその問題点］プリント配線基板を検査する場合、一般には第
１図に示すように、プリント配線基板又はプリン
ト基板３に１個又はそれ以上のガイド孔７を設
け、他方、検査装置のベース６には、当該ガイド
孔７に対向嵌合し得るガイドピン４を設け、当該
ベース６を上昇させてガイドピン４をガイド孔７
に嵌め込み、これにより、基板３を位置決めする
と共に上部ベース１に取り付けた検査用接触ピン
２に接触させ、基板３を検査する。[Composition of conventional example and its problems] When inspecting a printed wiring board, generally, as shown in FIG. 1, one or more guide holes 7 are provided in the printed wiring board or printed circuit board 3, and The base 6 of the inspection device is provided with a guide pin 4 that can be fitted oppositely into the guide hole 7, and the base 6 is raised to fit the guide pin 4 into the guide hole 7.
This positions the board 3 and brings it into contact with the testing contact pins 2 attached to the upper base 1, thereby testing the board 3.

この場合、ガイド孔７の寸法や位置のバラツ
キ、基板の反りによつて、ガイドピン４がガイド
孔７に入らずに基板３を割つたりすることがあ
る。 In this case, the guide pins 4 may not enter the guide holes 7 and may break the substrate 3 due to variations in the size and position of the guide holes 7 or warpage of the substrate.

［発明の目的］本発明は、プリント基板の寸法誤差や位置ずれ
による基板割れを防ぎ、然も両面同時に検査する
ことのできる検査装置を提供することを目的とす
る。[Object of the Invention] An object of the present invention is to provide an inspection apparatus that can prevent board cracking due to dimensional errors or positional deviations of a printed circuit board, and can simultaneously inspect both sides.

［発明の構成］本発明に係る検査装置は、検査用接触プローブ
がプリント基板に接触する方向とは直交又はほぼ
直交する面内で当該プリント基板を基準面に向け
てばね付勢し当該プリント基板を位置決めする位
置決めユニツトと、基板上面を検査する固定され
た複数の接触プローブと、基板方向に移動可能で
あり、基板下面を検査する第２の複数の接触プロ
ーブと、位置決めユニツトによつて位置決めされ
たプリント基板を上側の接触プローブに押圧し、
しかる後第２の接触プローブをプリント基板下面
に押圧する駆動部材とからなることを特徴とす
る。[Structure of the Invention] The inspection device according to the present invention biases the printed circuit board toward a reference plane with a spring in a plane perpendicular or almost perpendicular to the direction in which the inspection contact probe contacts the printed circuit board. a plurality of fixed contact probes that inspect the top surface of the substrate; a second plurality of contact probes that are movable toward the substrate and inspect the bottom surface of the substrate; Press the printed circuit board onto the upper contact probe,
It is characterized by comprising a driving member that then presses the second contact probe against the lower surface of the printed circuit board.

また本発明は、前記駆動部材が、第２の接触プ
ローブを支持する接触ピンシヤフトに連結ピンを
介して連結され、当該第２の接触プローブを支持
する接触ピンシヤフトと一体的に移動する摺動パ
イプであつて、パイプ壁面に壁厚より径の大きい
ボールを嵌め込んだ摺動パイプと、当該摺動シヤ
フト内で上方にばね付勢され、その上位位置で前
記ボールを受容すべく側面に凹部を形成したシヤ
フトと、当該摺動パイプを案内すると共に、一定
距離だけ摺動パイプを上昇させた時点で当該ボー
ルを受容して当該摺動パイプと当該シヤフトとの
連結を解かせるボール受け溝を内壁に形成してな
るガイドとからなることを特徴とする。 The present invention also provides a sliding pipe in which the driving member is connected to a contact pin shaft supporting a second contact probe via a connecting pin and moves integrally with the contact pin shaft supporting the second contact probe. A sliding pipe in which a ball having a diameter larger than the thickness of the wall is fitted into the pipe wall, and a recess is formed in the side surface of the sliding shaft to receive the ball at an upper position of the sliding shaft. A ball receiving groove is provided on the inner wall to guide the shaft and the sliding pipe, and to receive the ball and release the connection between the sliding pipe and the shaft when the sliding pipe is raised a certain distance. and a guide formed by forming a guide.

［実施例の説明］以下、一実施例を示した図面を参照して本発明
を詳述する。第２図は、本発明に係る検査装置の
中央縦断面図を示す。第２図において、装置に固
定された上プレート２６に接触ピン固定板２７を
固定し、当該固定板２７には複数の（必要により
ばね付勢した）接触ピン２８を植立してある。接
触ピンシヤフト１７は接触ピン下固定板１５を一
体的に支持し、当該固定板１５上に検査用接触ピ
ン１４′を植立してある。第２図のＶ−Ｖ線から
見た第５図に示すように、基板２９の位置決め
は、下側ベース１６の上面端部に固定した基準ガ
イド１４を位置決め基準として全体を上昇させる
ことにより、基準ガイド１４に対向する下当たり
３０が上プレート２６の下面端部に固定した上当
たり２５によつて寸法ｃだけ内方に移動し、プリ
ント基板２９を位置決めする。このとき基板寸法
のバラツキを吸収するために補助ガイド８及びス
プリング３１を設けてある。[Description of Embodiments] Hereinafter, the present invention will be described in detail with reference to the drawings showing one embodiment. FIG. 2 shows a central longitudinal sectional view of the inspection device according to the invention. In FIG. 2, a contact pin fixing plate 27 is fixed to an upper plate 26 fixed to the device, and a plurality of contact pins 28 (loaded with a spring if necessary) are planted on the fixing plate 27. The contact pin shaft 17 integrally supports a contact pin lower fixing plate 15, and a test contact pin 14' is planted on the fixing plate 15. As shown in FIG. 5 viewed from line V-V in FIG. 2, the board 29 is positioned by raising the entire board using the reference guide 14 fixed to the upper end of the lower base 16 as a positioning reference. The lower abutment 30 facing the reference guide 14 is moved inward by the distance c by the upper abutment 25 fixed to the lower end of the upper plate 26 to position the printed circuit board 29. At this time, an auxiliary guide 8 and a spring 31 are provided to absorb variations in substrate dimensions.

前記駆動部材は、摺動パイプ１１と、その内側
に上方ばね付勢して配置したシヤフト１２とを含
み、摺動パイプ１１とシヤフト１２とは、摺動パ
イプ１１の壁面に設けた貫通孔に配置した、当該
壁面の厚みより大きい直径のボール２３と、シヤ
フト１２の外面に当該ボール２３と相補的な形状
に凹ませた凹部２４との係合により連結される。
当該摺動パイプ１１は中空柱状のガイド２０に挿
嵌してあり、当該ガイド２０は装置筐体に固着さ
れた下プレート１９に固定されている。ガイド２
０の内面には、摺動パイプ１１を所定量上昇させ
た時点でボール２３を受容できるボール受け溝２
１を設けてある。ボール２３がこのボール受け溝
２１に入り込むと、摺動パイプ１１とシヤフト１
２との連結が解かれ、外力の下で摺動パイプ１１
のみが上昇する。摺動パイプ１１の上部に横方向
に配設したピン１８は、接触ピンシヤフト１７に
も嵌入しており、当該摺動シヤフト１１と接触ピ
ンシヤフト１７とを連結している。 The driving member includes a sliding pipe 11 and a shaft 12 disposed inside the sliding pipe 11 with an upward spring bias. The disposed ball 23 having a diameter larger than the thickness of the wall surface is engaged with a recess 24 recessed in the outer surface of the shaft 12 in a shape complementary to the ball 23.
The sliding pipe 11 is inserted into a hollow columnar guide 20, and the guide 20 is fixed to a lower plate 19 fixed to the device housing. Guide 2
0 is provided with a ball receiving groove 2 that can receive the ball 23 when the sliding pipe 11 is raised by a predetermined amount.
1 is provided. When the ball 23 enters this ball receiving groove 21, the sliding pipe 11 and the shaft 1
2 is released and the sliding pipe 11 under external force
only rises. A pin 18 disposed laterally in the upper part of the sliding pipe 11 also fits into the contact pin shaft 17 and connects the sliding shaft 11 and the contact pin shaft 17.

第２図は待機状態であり、シヤフト１２は、ス
プリング３２によりその頂面がピン１８と衝合
し、その最上方位置を占める。ボール２３と凹部
２４との係合によりシヤフト１２は摺動パイプ１
１と間接的にロツクされている。 In FIG. 2, the shaft 12 is in a standby state, and the top surface of the shaft 12 abuts against the pin 18 due to the spring 32, and the shaft 12 occupies the uppermost position. Due to the engagement between the ball 23 and the recess 24, the shaft 12 moves into the sliding pipe 1.
1 and is indirectly locked.

第３図に示すように、寸法ａ（＝a₁＋a₂）だけ
上方に摺動パイプ１１を持ち上げると、基板２９
は、前述の方法で位置決めされたのち、接触ピン
２８と接触する。そのときストツパーピン１３が
ガイド２０の下面に当たり、当該ストツパーピン
１３の嵌入しているシヤフト１２もストツプし、
直結された位置決めユニツトも上昇を停止する。 As shown in FIG. 3, when the sliding pipe 11 is lifted upward by the dimension a (= a ₁ + a ₂ ), the substrate 29
contacts the contact pin 28 after being positioned in the manner described above. At this time, the stopper pin 13 hits the lower surface of the guide 20, and the shaft 12 into which the stopper pin 13 is fitted also stops.
The directly connected positioning unit also stops rising.

第４図に示すように、摺動パイプ１１がなお寸
法ｂだけ上昇すると、摺動パイプ１１の壁に内蔵
されたボール２３は、ボール受け溝２１に入り込
み、下側ベース１６のみが上昇して基板２９の下
面に接触ピン２８が接触し両面検査が可能とな
る。 As shown in FIG. 4, when the sliding pipe 11 still rises by the dimension b, the ball 23 built into the wall of the sliding pipe 11 enters the ball receiving groove 21, and only the lower base 16 rises. The contact pins 28 come into contact with the lower surface of the substrate 29, allowing double-sided inspection.

［発明の効果］基板の端面により位置決めするので寸法バラツ
キが生じても基板を割ることがない。たとえばセ
ラミツク基板のように一度焼成する基板において
はガイド孔を設けても焼成のために寸法変化が生
じるので、このような位置決めを使用すると効果
がある。又セラミツク基板においては回路の高密
度化が要求され両面回路になる場合が多く、この
検査方法を採用するのは最も効果がある。[Effects of the Invention] Since positioning is performed by the end face of the substrate, the substrate will not be broken even if dimensional variations occur. For example, in substrates that are fired once, such as ceramic substrates, dimensional changes occur due to firing even if guide holes are provided, so it is effective to use this positioning method. Furthermore, since ceramic substrates require high circuit density and are often double-sided circuits, it is most effective to employ this inspection method.

[Brief explanation of drawings]

第１図は従来のプリント基板を検査する方法を
示した図、第２図乃至第４図は本発明に係る検査
装置の一部縦断面図を示し、第２図は基板待機状
態図、第３図は基板位置決めと基板上面接触状態
の図、第４図は、上面及び下面の接触状態図、第
５図は基板位置決め状態の平面図である。１１……摺動パイプ、１２……シヤフト、１４
……基準ガイド、１５……接触ピン下固定板、１
７……接触ピンシヤフト、２３……ボール、２４
……凹部、２５……上当たり、２６……上プレー
ト、２７……接触ピン固定板、２８……接触ピ
ン、２９……基板、３０……下当たり。 FIG. 1 is a diagram showing a conventional method for inspecting a printed circuit board, FIGS. 2 to 4 are partial vertical sectional views of an inspection apparatus according to the present invention, and FIG. 3 is a diagram showing the state of substrate positioning and contact with the upper surface of the substrate, FIG. 4 is a diagram of the state of contact between the upper and lower surfaces, and FIG. 5 is a plan view of the state of substrate positioning. 11...Sliding pipe, 12...Shaft, 14
...Reference guide, 15 ... Contact pin lower fixing plate, 1
7...Contact pin shaft, 23...Ball, 24
... Recessed portion, 25 ... Upper contact, 26 ... Upper plate, 27 ... Contact pin fixing plate, 28 ... Contact pin, 29 ... Board, 30 ... Lower contact.

Claims

[Claims] 1. A positioning unit for positioning the printed circuit board toward a reference plane by spring bias in a plane perpendicular or substantially perpendicular to the direction in which the inspection contact probe contacts the printed circuit board; a first plurality of fixed contact probes for inspecting the top surface; a second plurality of contact probes movable toward the printed circuit board for inspecting the bottom surface of the printed circuit board; and a plurality of fixed contact probes for inspecting the bottom surface of the printed circuit board; a driving member configured to raise a positioning unit to press the upper surface of the printed circuit board against a first contact probe located above, and then press a second contact probe from below against the lower surface of the printed circuit board; and this driving member. and a guide for guiding and controlling a second contact probe, the driving member comprising: a contact pin shaft supporting a second contact probe; and a second contact pin shaft into which the contact pin shaft is fitted at an upper end thereof so as to be slidable in the axial direction. , a shaft that supports the positioning unit; this shaft is slidably inserted in the axial direction and biased by a spring toward the printed circuit board, and is connected to the contact pin shaft by a connecting pin inserted through a side surface of the shaft; A ball having a diameter larger than the wall thickness is fitted into the wall surface of the sliding pipe, and a portion of the ball protruding inwardly from the wall thickness engages with the side surface of the shaft. A concave portion is formed to allow the shaft and the sliding pipe to move together, while a recessed portion is formed on the inner surface of the guide to allow the ball to protrude outward from a position where the sliding pipe is raised by a predetermined amount. A ball receiving groove is formed to release the engagement between the shaft and the sliding pipe, and a stopper pin is provided protruding perpendicularly to the shaft, and is inserted into an elongated hole provided in the axial direction of the sliding pipe to release the engagement between the shaft and the sliding pipe. A range of relative movement in the axial direction between the sliding pipe and the shaft is defined at the upper and lower ends of the hole, and when the sliding pipe is located at the lowest end at the starting position of the driving member, the upper edge of the stopper pin The lower edge of the guide is spaced apart from the lower edge of the guide, and the distance is set to correspond to the distance that the sliding pipe moves until the first contact probe and the top surface of the printed circuit board obtain the required pressure. After the first contact probe and the upper surface of the printed circuit board have secured the required pressure, the range of relative movement between the sliding pipe and the shaft defined by the elongated hole is controlled by the second contact probe.
The spacing corresponds to the distance that the sliding pipe moves until the contact probe obtains the required pressure with the lower surface of the printed circuit board, and the sliding pipe and the shaft are engaged by the ball from the starting position of the driving member. A ball receiver is provided on the inner surface of the guide so that the sliding pipe and the shaft are disengaged from each other from a position where the upper edge of the stopper pin and the lower edge of the guide come into contact with each other. After locating the groove, the sliding pipe leaves the shaft in that position and rises further to press the second contact probe carried by the contact pin shaft, which moves integrally through the connecting pin, against the bottom surface of the printed circuit board. A double-sided board positioning and inspection device characterized by having the following configuration.