JPH0365920B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] When mounting a component on a board, the component is temporarily fixed to the board using an adhesive to regulate its position, and then fixed by soldering or the like. However, according to the method of the present invention, it becomes possible to easily check the adhesion status of the adhesive or the adhesion status of parts at this time.

[Industrial application field]

The present invention relates to a method for checking the adhesion status of an adhesive for temporarily bonding components and the mounting status of components, and particularly relates to an adhesive used when temporarily bonding surface mount components such as chip components and flat pack ICs to a board. The present invention relates to a component attachment confirmation method that allows easy confirmation of the adhering position and amount of a chemical agent, the attachment position of a component, and the like.

Surface mount components such as chip components and flat pack ICs (FICs) are generally mounted on boards using automatic mounting machines. At this time, before soldering these parts, they are temporarily fixed to the board using an adhesive in order to regulate their mounting positions.

In this case, the adhesive used for temporary fixing is applied using an automatic machine before mounting the parts, but the amount and position of application in this case may vary depending on environmental (especially temperature) conditions and the hole diameter of the application nozzle. It changes depending on etc.

Furthermore, when installing parts, each time the claws that center the parts and determine the mounting position in an automatic mounting machine are replaced or adjusted, the mounting situation changes, such as the mounting position of the part changing or bending. .

Therefore, it is desired to be able to easily check the adhesion status of adhesive for temporarily fixing components and the mounting status of components.

[Conventional technology]

Conventionally, there was no way to easily check the adhesion status of adhesive for temporarily fixing parts or the mounting status of parts, and the only way to do so was to check the appearance of the board after parts were attached or soldered.

[Problem that the invention seeks to solve]

FIG. 2 shows an example of parts on a board, in which a chip part 3 is adhered to a board 1 using adhesive 2, and a terminal 4A and a pattern land 5 are attached.
When attempting to solder between A and between terminal 4B and pattern land 5B, if the amount of adhesive is appropriate, solder 6 will adhere across terminal 4A and pattern land 5A as shown in 6. If there is too much adhesive, remove terminal 4B as shown in 7.
Adhesive overflows between the pattern land 5B and the terminal portion 8A, so that the solder separates into the terminal portion 8A and the pattern land portion 8B, resulting in a non-adhesive portion 9 as shown by the broken line.

Also, if the amount of adhesive is too small, parts may fall off after being attached.

The present invention aims to solve the problems of the prior art, and by using the method of the present invention, it is possible to check the adhesion state of adhesive for temporarily fixing components on a board and the mounting state of components. , it is intended to be easy to confirm.

[Means for solving problems]

The component attachment confirmation method of the present invention uses a confirmation substrate made of a transparent material with the same shape as the substrate in the process of temporarily fixing the components to the substrate using adhesive and then mounting the components on the surface of the confirmation substrate. Temporarily attach the components using adhesive using the same process as when mounting the components after temporarily attaching them to the board, and after the temporary attaching process is completed, apply adhesive from the back side of the confirmation board. It is characterized by including a process of checking the situation.

[Effect]

In the method of the present invention, the confirmation board on which the components are temporarily attached is transparent, so by observing the board from the back side, it is possible to see the state of the adhesive spread out between the board and the component. When temporarily fixing components to a board using the adhesive, it is possible to easily check the application status of the adhesive, which is hidden by the board and components and cannot be seen directly. At this time, if you use the marking lines on the board surface, it will be easier to confirm the position.

〔Example〕

FIG. 1 illustrates an embodiment of the present invention, in which reference numeral 11 is a confirmation board made of a transparent material such as an acrylic plate, and is made in the same shape as the board on which components etc. are to be mounted. .

When using the confirmation board 11, set it in the automatic mounting machine using the positioning holes 12A and 12B provided on it, apply adhesive and attach the parts using the same process as in the actual case. Attach temporarily.
In FIG. 1, 13 indicates the applied adhesive;
Reference numeral 14 indicates a chip component temporarily fixed with adhesive 13.

After the process of temporarily attaching components 14 and the like to the board 11 is completed, the board 11 is removed from the automatic mounting machine and the mounting status of each component is observed. At this time, since the substrate 11 is transparent, by observing it from the back side, it is possible to observe the amount and position of the adhesive adhered to the lower side of the component that cannot be seen from the front side, and to judge whether the adhesive is good or bad.

Furthermore, marking lines 15 are provided vertically and horizontally on the board 11 at arbitrary intervals, and these lines can be used to observe the relationship between the mounting position of parts and the corresponding position of adhesion of temporary adhesive. You can judge whether it is good or bad.

Therefore, by making trial adjustments based on these observation results, we will be able to optimize the amount and position of the temporary adhesive when using the actual board, as well as the mounting position of the parts. It becomes possible to regulate.

〔Effect of the invention〕

As explained above, the component attachment confirmation method of the present invention, when temporarily fixing components to a board using an adhesive, checks the application status of the adhesive that is hidden by the board and the component and cannot be seen directly. However, since this method allows you to see through the back of the confirmation board and check the condition of the adhesive between the parts and the confirmation board made of a transparent material with the same shape as the board, it is easy to use when mounting components on the board. Since the amount and position of the adhesive for temporarily fixing components can be confirmed, it becomes possible to apply the appropriate amount of adhesive and apply it at a fixed position, and it is also possible to optimize the position for attaching the components.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of an embodiment of the present invention, and FIG. 2 is a diagram showing an example of mounting components on a board. 11... Board for confirmation, 12A, 12B... Holes for positioning, 13... Adhesive, 14... Chip parts, 15... Marking line.

Claims (1)

[Claims] 1. In the process of temporarily fixing components to a board using an adhesive and then mounting them, a confirmation board made of a transparent material having the same shape as the board is used, and the actual Temporarily attach the components using adhesive using the same process as when mounting the components after temporarily attaching them to the board. After the temporary attaching process is completed, apply adhesive from the back side of the confirmation board. A method for confirming component attachment, comprising the step of confirming the application status of the component.