JPH0878828A - Device and method for mounting face mount type component on printed circuit board - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a method for soldering the face mount type component 12 together with the discrete type component 11 in the solder dip bath 14. [Structure] The through hole 20 is formed in advance at the mount position of the face mount type component 12 of the printed circuit board 10,
The leads of the face mount type component 12 are temporarily fixed to some of the connection lands 19 by temporary solder 21. Then, after this, the printed circuit board 10 is turned upside down, the adhesive 24 is dropped through the portion of the through hole 20, and the face mount type component 12 is bonded to the printed circuit board 10 by the adhesive 24. In this state, the printed board 10 is placed in the solder dip bath 14
And solder it together with the discrete type component 11 and the special component 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION In the present invention, a face mount type component is attached to a predetermined position of a printed circuit board, and its leads are soldered to a connection land formed in advance on the printed circuit board for connection. The present invention relates to a device and method for mounting a face mount type component on a printed circuit board.

[0002]

2. Description of the Related Art As shown in FIG. 11, an electronic circuit used in an audio device or the like is mounted on one surface of a printed circuit board 1 and a discrete component 2 mounted on the opposite surface of the printed circuit board 1. And a face mount type component 3 such as a flat package type IC, and these components 2 and 3 are connected via a wiring pattern formed on the printed circuit board 1 to form a predetermined circuit. Has become.

Particularly, the face mount type component 3 is shown in FIG.
As shown in FIG. 2, a large number of leads 4 are provided on each of the two sides or four sides, and these leads 4 are soldered and connected to the connection lands 5 formed in advance on the surface of the printed circuit board 1. It has become. Here, the connection land 5 is formed and the surface on which the face mount type component 3 is mounted is the surface opposite to the surface on which the discrete component 2 of the printed circuit board 1 is mounted, as is apparent from FIG. ing.

When manufacturing such an electronic circuit, conventionally, the discrete component 2 is mounted on the printed circuit board 1 and the leads thereof are inserted into the surface on the opposite side of the printed circuit board 1, and the discrete component is passed through the solder dip tank. The second lead was soldered.
After that, the printed board 1 is turned over, the face mount type component 3 is placed on the printed board 1, and the leads 4 thereof are connected to the connection lands 5 by hand soldering. This is because when the face mount type component 3 having no supporting means is supplied to the solder dip bath while being mounted, the face mount type component 3 falls into the solder dip bath.

Another method is to mount the discrete component 2 on one surface of the printed circuit board 1 and fix the face mount type component 3 to the opposite surface of the printed circuit board 1 with a double-sided adhesive tape. It is supplied to the solder dip bath and the leads of the discrete component 2 and the leads 4 of the face mount type component 3 are soldered together.

Still another method is to bond the face mount type component 3 with a temporary fixing bond (a kind of adhesive, trade name), and the bond dropped on the printed circuit board 1 in advance is face mounted. The bonding is performed by pressing the mold component 3 through the package.

Still another method is to use an ultraviolet curable adhesive for temporary fixing, and the face mount type component 3 is temporarily fixed on the printed circuit board 1 by such an ultraviolet curable adhesive, and in this state solder dip It is supplied to the bath, and the face mount type component 3 is soldered together with the discrete component 2.

Yet another method is to use high temperature solder, which has a higher melting point than normal solder. That is, the discrete component 2 is mounted on one surface of the printed board 1 and the face mount type component 3 is mounted on the opposite surface, and a part of the lead 4 is connected to the connection land 5 by high-temperature solder for temporary fixing. It is to be manually connected to. After the face mount type component 3 is temporarily fixed with such high-temperature solder, the printed circuit board is supplied to the dip tank. If the lead 4 of the face mount type component 3 that is not temporarily fixed with the high temperature solder is dipped. Soldering is performed in the process.
Moreover, since the high-temperature solder for temporary fixing is not melted by the heat in the dip tank, the face mount type component 3 does not drop into the dip tank during the dipping process.

[0009]

The method of soldering the face mount type component 3 on the surface of the printed circuit board 1 opposite to the surface on which the discrete component 2 is mounted by hand soldering after dip soldering is as follows. There is a problem that so-called tempura, solder cracks, etc., which become balls, occur and reliability is low. Further, there is a drawback in that the work efficiency is poor and the cost of the electronic circuit increases due to the manual soldering work.

Before the solder dip, the face mount type component 3 is temporarily fixed to the surface of the printed circuit board 1 opposite to the mount side of the discrete component 2 with a double-sided adhesive tape. If the thickness of the double-sided adhesive tape is smaller than the gap formed between the face mount type component 3 and the printed circuit board 1 by the lead 4 formed on the substrate 2, temporary fixing by the double-sided adhesive tape becomes unstable. There are drawbacks. Since the gap between the lower surface of the face mount type component 3 and the printed board 1 varies depending on the mechanical size of the lead 4, the temporary fixing with the double-sided adhesive tape is not always stable.

In the method using the temporary fixing bond, when the bond adheres to the connection land of the printed circuit board 1, it causes solder tempura. Further, it is necessary to apply a bond to the surface of the printed board 1 and then press the bond through the face mount type component 3 so as to crush the bond. At this time, the face mount type component 3 may be displaced. There is. Further, at this time, the printed circuit board may be damaged, which is not preferable.

In the temporary fixing using the ultraviolet curable adhesive, it is necessary to irradiate the ultraviolet rays to fix the adhesive, which requires equipment for that purpose. That is, there is a problem that the cost for the equipment is required and the space for the manufacturing apparatus for the printed circuit board is required to be wide.

The method of solder dipping after connecting some of the leads 4 of the face mount type component 3 to the connection lands 5 using high temperature solder requires a high degree of skill for the operator. Then, when temporarily fixing with high temperature solder, a solder bridge may occur between adjacent connection lands 5. In such a case, the high temperature solder is manually melted after the solder dip for correction. Requires a process. Such a correction process requires a higher degree of skill.

The present invention has been made in view of the above problems, and does not require the work of a highly trained worker, and does not use special equipment, and it is a face mount type together with discrete components. (EN) Provided are a mounting device and a mounting method for a face mount type component on a printed circuit board, which mounts a component at a predetermined position on a circuit board and properly solders the lead to a corresponding connection land. The purpose is.

[0015]

The feature of the device for mounting a face mount type component according to the present invention is that a face mount type component is provided in or near a through hole formed at a position where a face mount type component of a printed circuit board is mounted. A device for attaching to a printed circuit board, in which the component is adhered to the printed circuit board via an adhesive and the leads of the face mount type component are connected to corresponding connection lands of the printed circuit board by soldering Is. That is, the solder for connecting the lead to the corresponding connection land and the printed circuit board of the face mount type component by an adhesive at or near the through hole which is preformed at the position where the face mount type component of the printed circuit board is mounted. It has a great feature in adhesion.

The mounting method for mounting the face mount type component on the printed circuit board is as follows. The face mount type component is arranged on the printed circuit board, and the leads of the face mount type component are soldered to the connection lands formed in advance on the printed circuit board. The present invention relates to a method of attaching a face mount type component that is attached. Then, in this method, a through hole is formed in advance at a position where the face mount type component of the printed circuit board is mounted. Then, the face mount type component is mounted at a position where the through hole of the printed circuit board is formed, and at least a part of the lead of the face mount type component is soldered to the connection land of the printed circuit board. Then, after this, the face mount type component is connected to the printed board by an adhesive in the through hole of the printed board or in the vicinity thereof. In such a state, the face-mount type component is mounted by supplying it to the solder dip bath and soldering the leads of the face-mount type component to the connecting lands of the printed circuit board. During the solder dipping process, the face mount type component and the discrete type component that is mounted in advance on the printed circuit board as needed are simultaneously soldered.

The adhesive for adhering the face mount type component to the printed circuit board at or near the through hole may be a paste or gel adhesive, and a heat resistant instant adhesive is particularly preferable. Such an adhesive may be injected into the through hole from the surface of the printed circuit board opposite to the surface on which the face mount type component is mounted, and the face mount type component may be bonded to the printed circuit board.

As the adhesive constituting the above-mentioned adhesive body, for example, a paste-like adhesive such as the above-mentioned heat-resistant instant adhesive, which is of a type which is dried and solidified in a short time, is used. Is preferred.

Instead of using an adhesive as the above-mentioned adhesive, an adhesive tape can be used. In this case, a protrusion is formed in advance on the face mount type component, and the protrusion is fitted into the through hole of the printed circuit board, and the protrusion is used in the vicinity of the through hole by an adhesive tape to use the face mount type component. Will be glued.

[0020]

By using a through hole formed at a position where the face mount type component is mounted on the printed circuit board, the face mount type component is bonded by the adhesive for adhering the face mount type component in or near the through hole. The component is fixed to the printed circuit board. Therefore, even if the solder dip processing is performed on the printed circuit board so that the face mount type component mounted on the printed circuit board faces the solder jet, the face mount type component may drop into the solder dip tank. Blocked by.

After mounting the face mount type component, the solder connecting at least a part of the leads of the face mount type component to the connection land of the printed circuit board is melted at the time of the solder dip and automatically corrected. Will be given.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The production of electronic circuits for audio equipment will be described with reference to FIGS. On the upper surface of the printed circuit board 10, as shown in FIG. 2, resistors, capacitors,
Various discrete components 11 such as transistors and diodes are mounted. Further, a face mount type component 12 such as a flat package IC is provided on the surface of the printed circuit board 10 opposite to the surface on which the discrete component 11 is mounted, that is, the lower surface.
Is mounted. Further connectors, switches, L
A special component 13 such as a CD is mounted on the surface of the printed circuit board 10 on which the discrete component 11 is mounted. The components 11 to 13 are the printed circuit board 1
They are connected to each other by a wiring pattern formed on the lower surface of 0 to form a predetermined electronic circuit.

Discrete component 11 mounted on printed circuit board 10, face mount component 1
2. The special component 13 is connected to the wiring pattern formed on the lower surface of the printed board 10 by soldering. That is, the printed board 10 is carried by the carrying means on the solder dip tank 14 as shown in FIG. 8 so that the printed board 10 is brought into contact with the solder jet 15 and thereby the leads of the discrete component 11, the leads of the face mount type component 12, and the special component. The leads of the component 13 are connected to the wiring pattern by soldering.

FIG. 1 is a flow chart showing a manufacturing process of such an electronic circuit, in which a printed circuit board 10 having a predetermined wiring pattern and lead insertion holes formed in advance is supplied. The printed circuit board 10 is introduced into an insertion machine, and the discrete component 11 is automatically mounted in the insertion machine. The insertion machine is designed to automatically perform the work of inserting the leads of the discrete component 11 into the lead insertion holes of the printed board 10 and then bending and cutting the leads into a predetermined length.

Thereafter, the face mount type component 12 is mounted on the surface of the printed circuit board 10 opposite to the surface on which the discrete component 11 is mounted. The face mount type component 12 is first attached to the printed circuit board 10 by adhesion (see FIGS. 5 to 7) while being held on the printed circuit board 10 by temporary soldering (see FIG. 4). Then, after this, the special component 13, for example, a switch, a connector, an LCD or the like, which cannot be attached by an insertion machine, is manually mounted.

After the various components 11 to 13 are mounted at predetermined positions in this way, soldering is performed in the solder dip bath. For this soldering, as shown in FIG. 8, the printed circuit board 10 is conveyed obliquely upward so that the surface of the printed circuit board 10 on which the face mount type component 12 is mounted contacts the solder jet 15 of the solder dip tank 14. While doing. By soldering in such a solder dip bath 14, the discrete component 11
Are soldered to the connection lands on the lower surface of the printed circuit board 10. Further, the leads of the face mount type component 12 are connected to the corresponding connection lands. Further, the leads of the special component 13 are soldered to the connecting lands of the printed board 10. As a result, a predetermined circuit is formed on the printed board 10.

Next, attachment of the face mount type component 12 to the printed circuit board 10 will be described. As shown in FIG. 3, the face mount type component 1 of the printed circuit board 10
A circular through hole 20 having a diameter of 3.5 to 4 mm, for example, is formed at the mounting position of 2. Since such a through hole 20 serves both as attachment of the face mount type component 12 by adhesion and a hole for venting gas at the time of solder dipping, by forming such a through hole 20, degassing is performed. The holes are omitted.

Then, the face mount type component 12 is placed on the pattern surface of the printed circuit board 10 in a properly positioned state as shown in FIGS. 3 and 4. At this time, the face mount type component 12 is positioned so that the leads 18 of the face mount type component 12 are correctly aligned with the connecting lands 19.

Then, as shown in FIG. 4, some of the leads 18 of the face mount type component 12 are soldered to the connection lands 19 by temporary solder 21. This soldering may be done manually, with a pistol iron using normal thread solder. In addition, the soldering at this time is usually performed by fixing two positions corresponding to each other with respect to the center of the face mount type component 12 to the printed circuit board 10 with the solder 12. By such temporary soldering, the face mount type component 12 is temporarily held on the printed circuit board 10 in a properly positioned state.

Next, the printed circuit board 10 is turned over,
The face mount type component 12 attached by the temporary solder 21 is placed on the lower side. And FIGS.
As shown in, the gel adhesive 24 is dropped from the tube 23 to the through hole 20. Here, as the adhesive, a heat-resistant instant adhesive, for example, a gel adhesive # 1739 manufactured by ThreeBond Co., Ltd. may be used. It is dripped over the surface of the face mount type component 12. The adhesive 24 is an adhesive that dries and solidifies in a short time.

In this way, the face mount type component 1
The lead 18 is connected to the connection land 19 by the temporary solder 21, and is also attached to the through hole 20 of the printed circuit board 10 by the adhesive 24.

After that, as described above, special parts that cannot be attached by the insertion machine, for example, parts 13 such as a large switch, LCD, connector, etc. are manually attached to the surface of the printed board 10 on which the discrete parts 11 are mounted. Mounted.

When the discrete component 11, the face mount type component 12, and the special component 13 are mounted in this order in this manner, they are supplied to the solder dip bath 14 as shown in FIG. The printed circuit board 10 is moved diagonally upward on the solder dip bath 14, and at this time, the lower surface of the printed circuit board 10 comes into contact with the solder jet 15. Therefore, the leads of the discrete component 11 and the leads of the face mount type component 12 are connected. , And special parts 13
Are connected to the connection lands formed on the lower surface of the printed circuit board 10 for soldering.

In particular, when the solder jet 15 in the solder dip tank 14 is used for soldering, the printed circuit board 1
Even if the temporary solder 21 is melted by the heat of the solder jet 15 in the face mount type component 12 mounted on the lower surface of 0, the face mount type component 12 is bonded by the adhesive 24 in the through hole 20 portion. The mold component 12 does not fall into the solder dip bath 14.

Further, the heat of the solder jet 15 melts the temporary solder 21 which has connected the leads 18 of the face mount type component 12 to the connecting lands 19 in advance, and the solder jet 15 causes all the leads of the face mount type component 12 to be melted. 18 is correctly soldered to the corresponding connecting land 19.

That is, even if the temporary solder 21 is soldered in a state of bridging so as to straddle a plurality of connection lands 19 as shown in FIG. 4, the bridge of the temporary solder 21 is formed by the soldering process in the solder dip tank 14. Amendments made,
The leads 18 are correctly separated and soldered to the connection lands 19, respectively, and no correction is required after the solder dip.

As described above, according to the attachment of the face mount type component 12 according to the present embodiment, the lead 18 of the face mount type component 12 is soldered by the temporary solder 21 and the adhesive 24 is adhered through the through hole 20. Although the steps are included as manual work, these steps do not require the special skill of the operator. Further, since the face mount type component 12 is adhered to the printed circuit board 10 by dropping a gel-like adhesive, facility investment becomes unnecessary.

In particular, when mounting the face mount type component 12, the printed circuit board 10 is mounted on the pattern surface and the printed circuit board 10 is turned upside down to drop the adhesive from the mounting surface side into the through hole 20. In order to secure the adhesive 2 to the connection land 19,
4 is less likely to be applied, and as a result, tempura of solder is less likely to occur during soldering in the solder dip bath. Moreover, since the through hole 20 formed in the printed circuit board 10 also serves as the gas vent hole for the solder dip due to the bonding by the adhesive agent 24, it is not necessary to separately provide the gas vent hole.

Since the adhesive 24 such as a gel-like bond contained in the tube 23 is used, the adhesive can be easily stored and handled easily. Also a gel adhesive 2
4 need only be hung from the surface of the face mount type component 12 through the through hole 20.
The work of pressing the printed circuit board 10 against the printed circuit board 10 is unnecessary, and therefore the printed circuit board 10 is not broken from the perforations.

Further, it is not necessary to use special solder, that is, high-temperature solder, and therefore impurities of solder are prevented from being mixed in the solder dip bath. That is, there is no change in the components of the solder jet 15 in the dip tank 14.

Further, by properly designing the pattern on the pattern surface of the printed circuit board 10, generation of bridges, icicles, etc. can be prevented, and no correction is required after solder dipping. That is, the temporary solder 21 for positioning the face mount type component 12 is automatically corrected by the solder dipping process in the solder dipping tank 14, and basically the solder bridge is prevented.

Further, by mounting the face mount type component 12 as described above, it is possible to reduce the production cost without requiring any special production equipment. Further, when the face mount type component 12 mounted on the printed circuit board 10 is replaced, the face mount type component 12 may be extruded through the through hole 20 after the solder of the lead 18 is removed. Replacing the mold part 12 is very easy and serviceability is greatly improved.

Next, a modification will be described with reference to FIGS. 9 and 10. In this modification, the adhesive tape 2 is used instead of the adhesive 24.
8 is used to adhere the face mount type component 12 to the printed circuit board 10. On the lower surface of the face mount type component 12, a circular protrusion 27 is formed as shown in FIG. On the other hand, the through hole 20 is formed on the circuit board 10.

Then, the face mount type component 12 is properly positioned, and the lead 18 of the face mount type component 12 is soldered to the connection land 19 by the temporary solder 21 while the protrusion 27 is fitted in the through hole 20. After this, the printed circuit board 10
Then, the projecting portion 27 facing the through hole 20 and the peripheral portion of the through hole 20 of the printed circuit board 10 are bonded and fixed with an adhesive tape 28.

After the face mount type component 12 is fixed with the adhesive tape 28 in this manner, the special component 13 is mounted after this and supplied to the solder dip bath 14 to be brought into contact with the solder jet 15. This allows printed circuit board 1
The discrete component 11, the face mount type component 12, and the special component 13 mounted on 0 are soldered. Even in the case of mounting the face mount type component 12 as described above, it is possible to obtain substantially the same operational effects as those of the above embodiment.

[0046]

EFFECT OF THE INVENTION A device for mounting a face mount type component on a printed circuit board according to the present invention prints the face mount type component at or near a through hole formed at a position for mounting the face mount type component on the printed circuit board. It is adhered to a substrate through an adhesive and the leads of the face mount type component are soldered to corresponding connection lands of a printed circuit board.

According to this structure, the face mount type component is mounted on the printed circuit board in a state of being fixed by the adhesive at the through hole portion, and in particular, the face mount type component is attached to the printed circuit board. Increases strength.

In the method of mounting a face mount type component on a printed circuit board according to the present invention, the face mount type component is arranged on the printed circuit board, and the leads of the face mount type component are preformed on the printed circuit board. In the method of soldering to the land for use, a through hole is formed at the position where the face mount type component of the printed circuit board is mounted, and at least a part of the lead of the face mount type component is soldered to the land for connection of the printed circuit board. Attach the face mount type component to the printed circuit board by an adhesive in the through hole of the printed circuit board or in the vicinity thereof, and solder the leads of the face mount type component to the connection lands of the printed circuit board by solder dip processing. It was done.

According to such a method, the face mount type component does not fall off and fall into the solder bath during the solder dipping process, and other components mounted on the printed circuit board, for example, discrete components or special components. The leads of the face mount type component together with the component are correctly soldered to the corresponding connection lands by the solder dipping process. In particular, the temporary solder for positioning the face mount type component is melted by the solder dipping process and is automatically corrected, which eliminates the need for subsequent correction. Further, since a high degree of skill is not required, a highly reliable circuit can be provided at low cost.

When a paste-like or gel-like adhesive is used as the adhesive, its management is simple and handling is easy.

Further, the time required for the work can be shortened by using a paste-like adhesive which is a type which is dried and solidified in a relatively short time as the adhesive.

The face mount type component has a protrusion, and this protrusion is fitted into the through hole of the printed board, and the face mount type component is adhered to the vicinity of the through hole by the adhesive tape forming the adhesive body. According to the method, it becomes possible to perform the solder dipping process in a state where the face mount type component is adhered to the printed board by the adhesive tape instead of the adhesive. That is, it is possible to solder the leads of the face mount type component together with the discrete component that is pre-mounted on the printed circuit board, and it is possible to achieve the same effect as the above method.

[Brief description of drawings]

FIG. 1 is a flowchart showing a manufacturing process of an electronic circuit.

FIG. 2 is a sectional view of a printed circuit board on which components are mounted.

FIG. 3 is an exploded perspective view showing attachment of a face mount type component to a printed circuit board.

FIG. 4 is an external perspective view showing positioning of a face mount type component by temporary soldering.

FIG. 5 is a perspective view showing dropping of an adhesive.

FIG. 6 is an enlarged perspective view of an essential part showing fixing with an adhesive.

FIG. 7 is a cross-sectional view of a main part of a printed circuit board mounting a face mount type component bonded with an adhesive.

FIG. 8 is a side view showing soldering using a solder dip bath.

FIG. 9 is a perspective view of a modified face mount type component in an inverted state.

FIG. 10 is a cross-sectional view of a main part of a printed circuit board on which the same face mount type component is mounted.

FIG. 11 is a cross-sectional view of essential parts showing a conventional printed circuit board.

FIG. 12 is an exploded perspective view showing a mount of a conventional face mount type component.

[Explanation of symbols]

 10 Printed Circuit Board 11 Discrete Part 12 Face Mount Type Part 13 Special Part 14 Solder Dip Tank 15 Solder Jet 18 Lead 19 Connection Land 20 Through Hole 21 Temporary Solder 23 Tube 24 Adhesive (Gel Bond) 27 Projection 28 Adhesive Tape

Claims (5)

[Claims] 1. A face mount type component having leads, a printed board on which connection lands to be connected to the leads of the face mount type component are formed in advance, and the face mount type component of the printed board is mounted. A through hole formed at a position, an adhesive body for adhering the face mount type component to the printed circuit board at or near the through hole, and a face mount type component arranged at a predetermined position on the printed circuit board. A mounting device for mounting a face mount type component on a printed circuit board, the solder including each of the leads connecting to a corresponding connection land of the printed circuit board; 2. A face mount type component is arranged at a predetermined position on a printed circuit board, and leads of the face mount type component are soldered to connection lands formed in advance on the printed circuit board. In a method for mounting a face mount type component, a through hole is formed at a position where the face mount type component of the printed circuit board is mounted, and the face mount type component is provided at a position where the through hole of the printed circuit board is formed. Mounting, at least a part of the leads of the face mount type component is soldered to the connection land of the printed circuit board, and the face mount type component is bonded to the printed circuit board in the through hole of the printed circuit board or in the vicinity thereof The face mount type by solder dip processing A method of mounting a face mount type component on a printed circuit board, wherein a lead of the component is soldered to a land for connection of the printed circuit board. 3. The adhesive body is a paste-like or gel-like adhesive, and the adhesive is applied from the surface of the printed circuit board opposite to the surface on which the face mount type component is mounted into the through hole. 3. The method for mounting a face mount type component on a printed circuit board according to claim 2, wherein the face mount type component is adhered to the printed circuit board by being injected into the substrate. 4. The face-mounted component according to claim 3, wherein the adhesive is a paste adhesive and is a type that is dried and solidified in a relatively short time. How to install. 5. The face mount component has a protrusion, the protrusion is fitted into a through hole of the printed circuit board, and is adhered to the vicinity of the through hole by an adhesive tape forming an adhesive body. The method for mounting the face mount type component according to claim 2 on a printed circuit board.