JPH0366136B2 - - Google Patents
Info
- Publication number
- JPH0366136B2 JPH0366136B2 JP28624386A JP28624386A JPH0366136B2 JP H0366136 B2 JPH0366136 B2 JP H0366136B2 JP 28624386 A JP28624386 A JP 28624386A JP 28624386 A JP28624386 A JP 28624386A JP H0366136 B2 JPH0366136 B2 JP H0366136B2
- Authority
- JP
- Japan
- Prior art keywords
- core layer
- molded product
- molding
- skin
- movable pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 52
- 239000012792 core layer Substances 0.000 claims description 43
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 239000010410 layer Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 25
- 239000007787 solid Substances 0.000 claims description 3
- 239000011162 core material Substances 0.000 description 37
- 238000002347 injection Methods 0.000 description 22
- 239000007924 injection Substances 0.000 description 22
- 238000010586 diagram Methods 0.000 description 7
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1642—Making multilayered or multicoloured articles having a "sandwich" structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は樹脂成形品およびその成形方法、特に
表面を覆うスキン層と、導電性の芯を形成するコ
ア層とからなる樹脂成形品および該樹脂成形品の
成形方法に関するものである。Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to a resin molded article and a method for molding the same, and particularly to a resin molded article consisting of a skin layer covering the surface and a core layer forming a conductive core, and the resin molded article. This invention relates to a method for molding a molded article.
従来、スキン層とコア層とから成る樹脂成形品
を形成するサンドイツチ成形方法については、例
えば特公昭50−28464号公報に記載されている方
法が知られている。これは所望する例えばカメラ
の鏡筒部材を成形する金型の空隙（キヤビテイ）
内に、先ず該鏡筒の表面層を形成するスキン材を
注入し、次に芯層を形成するコア材を注入するこ
とによつて、スキン層とコア層とから成るサンド
イツチ成形品を得る方法である。
Conventionally, a method described in Japanese Patent Publication No. 50-28464, for example, has been known as a sand-deutsch molding method for forming a resin molded article consisting of a skin layer and a core layer. This is the cavity of a mold that molds the desired lens barrel member of a camera, for example.
A method of obtaining a sandwich molded product consisting of a skin layer and a core layer by first injecting a skin material forming the surface layer of the lens barrel and then injecting a core material forming the core layer. It is.
前記方法において、例えば、スキン層のために
絶縁性の樹脂材料を用い、他方コア層のために導
電性フイラーあるいは箔を混入した導電性樹脂材
料を用いることで、コア層により電極波の発性及
び吸収による障害をなくすと共に、スキン層によ
り表面の絶縁性は保たれるという効果がある成品
が得られる。 In the above method, for example, by using an insulating resin material for the skin layer and using a conductive resin material mixed with conductive filler or foil for the core layer, the core layer can generate electrode waves. A product can be obtained that has the effect of eliminating problems caused by absorption and maintaining surface insulation with the skin layer.
しかしながら前記方法によつて成形された成形
品は、表面層全てがスキン材で覆われることにな
る為、例えばコア層への部分的な電気的導通をと
りたい場合において、成形後、切削加工等により
成形品に穴をあけるか、あるいはスキン材を除去
加工し、コア層を露出させることが必要となる。
このために成形品の外観をそこない、また後加工
によりコストが高くなるという問題を招ていた。
そこで成形時において所望の部分にコア層が露出
出来るようにした後加工不要の成形法が望まれて
いた。 However, since the entire surface layer of the molded product molded by the above method is covered with the skin material, for example, when it is desired to establish partial electrical conduction to the core layer, cutting processing may be required after molding. Therefore, it is necessary to make a hole in the molded product or remove the skin material to expose the core layer.
This has caused problems such as deterioration of the appearance of the molded product and increased costs due to post-processing.
Therefore, there has been a desire for a molding method that allows the core layer to be exposed in desired areas during molding and does not require post-processing.
本発明は前記従来例の欠点を除去した新規な樹
脂成形品およびその成形方法を提供するものであ
り、具体的には、サンドイツチ成形方法において
その成形時に、成形品の所望の部分でコア層を露
出させた樹脂成形品を提供すること、そしてその
ような樹脂成形品の成形方法を提供することを目
的とする。
The present invention provides a novel resin molded article and a method for molding the same, which eliminates the drawbacks of the conventional examples. Specifically, during molding, a core layer is removed at a desired portion of the molded article in the Sanderuch molding method. It is an object of the present invention to provide an exposed resin molded product and to provide a method for molding such a resin molded product.
上記目的を達成するため本発明による物の発明
としての樹脂成形品は、成形品成形用の金型に、
初めに非導電性スキン層材を注入し、その後に導
電性コア層材を注入し成形して表面を非導電性ス
キン層材とし内部を導電性コア層とした樹脂成形
品において、前記樹脂成形品内部の前記導電性コ
ア層材の一部を前記スキン層材の表面に露出する
ように成形して前記露出した導電性コア層材に導
電性部材を接続して電気的導通を得るようにした
ことを特徴とするものである。
In order to achieve the above object, a resin molded product as an invention according to the present invention is provided in a mold for molding the molded product.
In a resin molded product in which a non-conductive skin layer material is first injected and then a conductive core layer material is injected and molded to form a non-conductive skin layer material on the surface and a conductive core layer inside, the resin molding A part of the conductive core layer material inside the product is formed so as to be exposed on the surface of the skin layer material, and a conductive member is connected to the exposed conductive core layer material to obtain electrical continuity. It is characterized by the fact that
上記方法発明において、金型内部のキヤビテイ
に対し突出、後退される可動ピンは中実棒状のも
のであつてもよいし、あるいはキヤビテイ内に突
出固定された固定ピンに滑合された筒状のもので
あつてもよく、後者では固定ピンの部分が孔開き
とされた成形品を得ることができる。 In the above method invention, the movable pin that projects and retreats from the cavity inside the mold may be a solid rod, or a cylindrical pin that is slidably fitted to a fixed pin that projects and is fixed inside the cavity. In the latter case, it is possible to obtain a molded product with a hole in the fixing pin portion.
本方法発明において、スキン材の注入、コア材
の注入これに次ぐ可動ピンのキヤビテイからの後
退タイミングは、該可動ピンの後退により形成さ
れる空所に対し、コア材は十分に流入するがスキ
ン材は流入しないという関係を満足するように設
定されるが、具体的には例えば、スキン材として
ポリカーボネート、コア材として、カーボンフア
イバーとアルミフアイドを４対１の割合で計40％
混入したポリカーボネート材を用い、ゲートから
可動ピン迄の流動長が10〜50mmの範囲にある場
合、スキン材注入速度を１〜10ｍ／ｓとする（ス
キン材樹脂温度300〜330℃、金型温度80〜130℃
とする。）スキン材注入可動ピンの形成する空隙
は、0.4〜0.8mmに維持し、スキン材注入完了後、
0.6〜1.5sec以内にコア材を注入する。この時可動
ピンは、コア材注入開始から、0.1〜0.3秒以内
に、後退を開始する。コア材注入完了とほぼ同時
に、可動ピンの後退が完了する。 In this method invention, the timing of retraction of the movable pin from the cavity after the injection of the skin material and the injection of the core material is such that the core material sufficiently flows into the cavity formed by the retraction of the movable pin, but the core material The material is set so as to satisfy the relationship that no material flows in. Specifically, for example, the skin material is polycarbonate, and the core material is carbon fiber and aluminum oxide at a ratio of 4:1 for a total of 40%.
When using mixed polycarbonate material and the flow length from the gate to the movable pin is in the range of 10 to 50 mm, the skin material injection speed should be 1 to 10 m/s (skin material resin temperature 300 to 330 °C, mold temperature 80~130℃
shall be. ) The gap formed by the skin material injection movable pin is maintained at 0.4 to 0.8 mm, and after the skin material injection is completed,
Inject core material within 0.6~1.5sec. At this time, the movable pin starts retracting within 0.1 to 0.3 seconds from the start of core material injection. Almost simultaneously with the completion of core material injection, the movable pin completes retraction.
以下本発明の実施例を図面に基づいて説明す
る。
Embodiments of the present invention will be described below based on the drawings.
第１図は、本発明の方法により成形されて、肉
厚内芯部に導電性のコア層を形成させた場合の鏡
筒等を含むカメラ鏡筒部の構造概要を示したもの
であり、第８図はサンドイツチ法によらない従来
法に従つて一材質により鏡筒等を成形した場合の
カメラ鏡筒部の構造を示している。 FIG. 1 shows an outline of the structure of a camera lens barrel including a lens barrel formed by the method of the present invention to form a conductive core layer in the thick inner core. FIG. 8 shows the structure of a camera lens barrel when the lens barrel and the like are molded from a single material according to a conventional method that does not use the Sanderuch method.
これら第１図及び第８図により本発明方法によ
り成形されて肉厚部内に導電性のコア層を有する
成形品の作用につき、まず概略説明する。 Referring to FIGS. 1 and 8, the function of a molded product formed by the method of the present invention and having a conductive core layer in its thick portion will first be briefly explained.
第２図は本発明を適用するに好適なレンズ鏡筒
の構造を示し、この第８図に示すように合焦レン
ズL1、変倍レンズL2、補正レンズL3及び結像レ
ンズL4を有する構成において、合焦レンズL1は
合焦レンズホルダ１に保持され、この合焦レンズ
ホルダ１はレンズ固定鏡筒２とヘリコイド結合に
よつて連結され、合焦レンズホルダ１を回転する
ことにより合焦レンズL1を光軸方向に繰り出す
ようになされている。 FIG. 2 shows the structure of a lens barrel suitable for applying the present invention, and as shown in FIG. 8, a focusing lens L 1 , a variable power lens L 2 , a correction lens L 3 and an imaging lens L 4 In the configuration, the focusing lens L 1 is held by a focusing lens holder 1, and this focusing lens holder 1 is connected to a lens fixed lens barrel 2 by a helicoid coupling, and the focusing lens holder 1 can be rotated. The focusing lens L1 is extended in the optical axis direction.
また、変倍レンズL2と補正レンズL3は、それ
ぞれレンズホルダ３、レンズホルダ４に保持さ
れ、これらのレンズホルダ３、レンズホルダ４は
周知の３本バー方式によりガイドバー５等に案内
されて光軸方向に移動できるようになつている。
変倍レンズL2と補正レンズL3の光軸方向の可動
量は、レンズ固定鏡筒２に回転自在に保持されて
いるカム環６に設けられたカムリフト６ａ，６ｂ
によつて制御される。カム環６はレンズ固定鏡筒
２の外周に嵌合されたズーム操作環７の回転動作
に応じて、カム環６に植設された運動軸８と運動
して回動するようになつている。また、結像レン
ズL4は絞り１２を介して結像レンズホルダ１３
により後部のリレーホルダー１４内に保持され、
ビス１５によつて固定されている。 Further, the variable power lens L 2 and the correction lens L 3 are held by a lens holder 3 and a lens holder 4, respectively, and these lens holders 3 and 4 are guided by a guide bar 5 etc. using a well-known three-bar system. It is designed so that it can be moved in the direction of the optical axis.
The amount of movement of the variable magnification lens L 2 and correction lens L 3 in the optical axis direction is determined by cam lifts 6a and 6b provided on a cam ring 6 rotatably held in the fixed lens barrel 2.
controlled by. The cam ring 6 is adapted to rotate in response to the rotation of a zoom operation ring 7 fitted to the outer periphery of the lens fixed barrel 2, moving with a movement shaft 8 implanted in the cam ring 6. . Further, the imaging lens L 4 is connected to the imaging lens holder 13 via the aperture 12.
is held in the rear relay holder 14 by
It is fixed with screws 15.
カム環６はレンズ固定鏡筒２の内部で３本のガ
イドバー５を保持する前側マスク板８、後側マス
ク板９とによつて挟まれている。 The cam ring 6 is sandwiched between a front mask plate 8 and a rear mask plate 9 that hold the three guide bars 5 inside the lens fixed barrel 2.
第１図は、本発明のサンドイツチ成形品を前記
第８図のレンズ鏡筒にそのまま適用した場合の断
面図であり、この例では固定鏡筒２、中継筒１
８、リレーホルダー１４が各々サンドイツチ成形
されている。なお、本実施例において、スキン層
には例えばPC（ポリカーボネート）樹脂を、また
コア層にはPC樹脂中にカーボンフアイバーを40
％混入させた樹脂を用いることができるが、スキ
ン層材料としてはこの他に、POM（ポリアセター
ル）樹脂、変性PPO（ポリフエニレンオキサイ
ト）樹脂、ABS樹脂、PBT（ポリブチレンテレフ
タレート）樹脂等を例示でき、又コア層材料の導
電性充填物質としてAlのフアイバー又はフレー
ク、真ちゆうフアイバー、ガラス繊維に表面導電
コートしたもの等を例示することができる。 FIG. 1 is a sectional view when the Sanderch molded product of the present invention is applied as is to the lens barrel shown in FIG.
8. Each of the relay holders 14 is formed by sandwich molding. In this example, the skin layer is made of PC (polycarbonate) resin, and the core layer is made of 40% carbon fiber in the PC resin.
% resin can be used, but other skin layer materials include POM (polyacetal) resin, modified PPO (polyphenylene oxide) resin, ABS resin, PBT (polybutylene terephthalate) resin, etc. Examples of the conductive filling material of the core layer material include Al fibers or flakes, brass fibers, and glass fibers coated with a conductive surface.
第１図の例においては、各部材の導電性のコア
層の導通をとる為に、固定鏡筒２と、中継筒１８
とは１７ビスにより固定導通され、また中継筒１
８とリレーホルダー１４とは１９ビスにより固
定・導通されている。 In the example shown in FIG. 1, the fixed lens barrel 2 and the relay barrel 18 are connected to each other in order to establish continuity between the conductive core layers of each member.
and are fixedly connected by 17 screws, and the relay tube 1
8 and the relay holder 14 are fixed and electrically connected by 19 screws.
これにより、鏡筒内部及び１６マウントホルダ
近傍の電子部品及び回路（いずれも図示せず）
は、電磁波障害から守られることとなる。 As a result, electronic components and circuits inside the lens barrel and near the 16 mount holder (none of which are shown)
will be protected from electromagnetic interference.
第２図ａ、第２図ｂは、本例における固定鏡筒
２と中継筒１８及びビス１７の結合部分の断面拡
大図であり、これらの図から分かるように、固定
鏡筒２のビス止め用下穴３３において、ビス１７
のねじ山がかん合する部分３２のスキン膜厚h1
は、ビス１７のネジ山高さh2よりも小さく設定し
ておくことで、ビス１７の嵌合螺着時に該ビスに
よりセルフタツプされ、螺着結合した時にビスの
ネジ山部には導電性のコア材２ａが接するように
しておくことができる。また本例の中継筒１８
は、ビス１７が貫通嵌合する孔部周辺の面３１
ａ，３１ｂで、導電性のコア層を露出させ、ビス
止めにより接合する面３１ａ及び３１ｂを介して
ビスと中継筒との導通がとれるようにしている。
中継筒１８とリレーホルダー１４の間も前記と同
様にして導通がとられるようになつている。 2a and 2b are enlarged cross-sectional views of the joint portion of the fixed lens barrel 2, the relay barrel 18, and the screw 17 in this example, and as can be seen from these figures, the fixed lens barrel 2 is fastened with the screw. In the prepared hole 33, screw 17
The skin thickness h 1 of the part 32 where the threads of
is set to be smaller than the thread height h2 of the screw 17, so that when the screw 17 is fitted and screwed, the screw will self-tap, and when the screw is screwed together, there will be a conductive core on the thread part of the screw. It is possible to keep the material 2a in contact with each other. In addition, the relay tube 18 of this example
is the surface 31 around the hole where the screw 17 fits through.
The conductive core layer is exposed at a and 31b, so that electrical continuity between the screw and the relay tube can be established through the surfaces 31a and 31b that are joined by the screw.
Conductivity is established between the relay tube 18 and the relay holder 14 in the same manner as described above.
次ぎに上記部材の成形についても詳しく述べ
る。 Next, the molding of the above member will be described in detail.
第４図ａは本発明方法に用いる成形装置を示し
た図であり、４１はスキン材射出シリンダー、４
２はコア材射出シリンダー、４３は固定側取付
板、４４は固定板、４５はランナープレート、４
６は型板、４７は可動側固定板、４８は型板中に
設けられた成形品を成形する空隙（キヤビテイ）、
４１ａはスキンスプール、４２ａはコアスプル
ー、４１ｂはスキンスプルーとコアスプルーを継
ぐバイパスランナー、４２ｂはランナー、４９は
可動ピンユニツトである。 FIG. 4a is a diagram showing a molding apparatus used in the method of the present invention, in which 41 is a skin material injection cylinder;
2 is a core material injection cylinder, 43 is a fixed side mounting plate, 44 is a fixed plate, 45 is a runner plate, 4
6 is a template, 47 is a movable side fixed plate, 48 is a cavity provided in the template for molding the molded product,
41a is a skin spool, 42a is a core sprue, 41b is a bypass runner connecting the skin sprue and core sprue, 42b is a runner, and 49 is a movable pin unit.
第４図ｂは可動ピンユニツト断面図であり、４
ｋは可動ピン制御用バネ、４９ｅは、可動ピンに
より作られる空隙Ｔを制御するスペーサーであ
る。第４図ｂに示す可動ピンは、スキン材注入時
は、バネ４ｋとスペーサ４９ｃにより決まる空隙
ｔを維持しており（スキン材注入時は、内部圧力
はほぼ０）ひき続いてコア材を注入し、キヤビテ
イが満たされ始めると、樹脂に圧力が発生する
為、コア材の樹脂圧力によりスライドピン４９ａ
がバネ４ｋを押し上げ始め、完全に充填する。 FIG. 4b is a sectional view of the movable pin unit;
k is a spring for controlling the movable pin, and 49e is a spacer for controlling the gap T created by the movable pin. The movable pin shown in Fig. 4b maintains the gap t determined by the spring 4k and spacer 49c when the skin material is injected (the internal pressure is almost 0 when the skin material is injected), and then the core material is injected. However, when the cavity begins to be filled, pressure is generated in the resin, so the slide pin 49a is pressed by the resin pressure of the core material.
starts pushing up on spring 4k, filling it completely.
また、第４図ｅは、スライドピン４９ａを、エ
アシリンダ４１ａにより強制的に稼動させるタイ
プのものの構造を示している。 Further, FIG. 4e shows a structure of a type in which the slide pin 49a is forcibly moved by an air cylinder 41a.
このような装置において、まずはじめにスキン
材射出シリンダ４１よりスキン材がスキンスプル
ー４１ａ、バイパスランナー４１ｂ、コアスプル
ー４２ａ、ランナー４２ｂを通じ、上記キヤビテ
イ４８内へ適量注入される。次にコア材射出シリ
ンダ４２より、コアスプルー４２ａ、ランナー４
２ｂを通じて、前記先に注入されたスキン材を押
し広げつつコア材をキヤビテイ内４８へ注入させ
てキヤビテイ内を完全に満たし、サンドイツチ成
形品が成形される。 In such an apparatus, first, an appropriate amount of skin material is injected from a skin material injection cylinder 41 into the cavity 48 through the skin sprue 41a, bypass runner 41b, core sprue 42a, and runner 42b. Next, from the core material injection cylinder 42, the core sprue 42a, the runner 4
2b, the core material is injected into the cavity 48 while spreading the previously injected skin material to completely fill the cavity, thereby forming a Sanderchich molded product.
次いでコア材注入後、該スキン材の流動性が失
なわれる前に、可動ピン４９ａをキヤビテイ４８
内から後退させ、この後退により形成される空所
にスキン材の層を破つてコア材を流入させて、所
望のコア露出部を形成させることができる。 After the core material is injected, the movable pin 49a is inserted into the cavity 48 before the skin material loses its fluidity.
It is possible to form a desired core exposed portion by retreating from the inside and breaking the skin material layer and allowing the core material to flow into the cavity formed by this retreat.
第５図ａ，第５図ｂはこのような可動ピン部分
及びその動きを説明するための拡大断面図であ
る。 FIGS. 5a and 5b are enlarged sectional views for explaining such a movable pin portion and its movement.
第５図ａにおいて、コア材の注入後適当時間の
経過迄は、可動ピン４９ａは固定ピン４９ｂと摺
動面５ａで接して空隙T1の間隔をあけたまま静
止されている。そして上記スキン材注入後、コア
材注入と同時又は、0.6〜1.5sec経過後、第５図ｂ
に示すように、可動ピン４９ａを固定ピン４９ｂ
にガイドされつつ適当な空隙量T2になる迄移動
させ、静止させる。この可動ピンの動きにより、
第５図ａの状態では、可動ピンの近傍に流れて来
たスキン材は、空隙が狭く流動抵抗が大きいため
に空隙を満たせずに他の流動抵抗の小さい部分
（略）へ流れていくが、第５図ｂのように、可動
ピンを移動し、空隙を広げた後は該部分のコア材
の流動抵抗が減つてコア材が注入され、先に可動
ピンの近傍に小量注入されたスキン材を押し破
り、コア材が露出される部分を形成する。 In FIG. 5a, until a suitable period of time has elapsed after the injection of the core material, the movable pin 49a is in contact with the fixed pin 49b at the sliding surface 5a, and remains stationary with a gap T1 between them. Then, after injecting the skin material, at the same time as injecting the core material, or after 0.6 to 1.5 seconds, Fig. 5b
As shown in FIG.
While being guided by the spacer, move it until an appropriate gap amount T 2 is reached, and then let it stand still. Due to the movement of this movable pin,
In the state shown in Figure 5a, the skin material that has flowed near the movable pin is unable to fill the gap because the gap is narrow and the flow resistance is large, and instead flows to other areas with low flow resistance (omitted). , As shown in Figure 5b, after moving the movable pin and widening the gap, the flow resistance of the core material in that area is reduced and the core material is injected, and a small amount is first injected near the movable pin. Push through the skin material to form a portion where the core material is exposed.
実施例
スキン材 ポリカーボネート
コア材 ポリカーボネート（カーボンフアイバ
ー30％、アルミフアイバー10％含有）
スキン材樹脂温 320℃
コア材樹脂温 330℃
金型温度 110℃
スキン材射出速度 10ｍ／sec
注入時間 0.6sec
コア材射出速度 ３ｍ／sec 注入時間 1.8sec
可動ピン可動開始時間コア材注入開始後0.4sec
可動ピン可動完了 〃 1.0sec
可動ピン可動源 エアシリンダー
スキン材注入時樹脂圧力 ３Kgｆ／cm2
コア材 〃 950Kgｆ／cm2
以上によつてサンドイツチ構造の成形品が成形
された。Example Skin material Polycarbonate Core material Polycarbonate (Contains 30% carbon fiber, 10% aluminum fiber) Skin material resin temperature 320℃ Core material resin temperature 330℃ Mold temperature 110℃ Skin material injection speed 10m/sec
Injection time 0.6sec Core material injection speed 3m/sec Injection time 1.8sec Moving pin movement start time 0.4sec after core material injection starts Moving pin movement complete 〃 1.0sec Moving pin movable source Air cylinder Resin pressure when injecting skin material 3Kgf/cm 2 A molded product with a sanderch structure was formed using a core material of 950 kgf/cm 2 or more.
第６図は、前記より成形された成形品の可動ピ
ン近傍の断面図を示し、６ａはスキン層、６ｂは
コア層、６１，６２，６３はコア材露出部を示し
ている。 FIG. 6 shows a sectional view of the vicinity of the movable pin of the molded article formed above, in which 6a represents the skin layer, 6b represents the core layer, and 61, 62, and 63 represent exposed portions of the core material.
本実施例では鏡筒部材を用いたが、複写機、ワ
ープロ、電卓、コンピユータ等のハウジングに適
用する事も同様の方法により形成できる。 In this embodiment, a lens barrel member is used, but the same method can be applied to housings of copying machines, word processors, calculators, computers, etc.
第７図ａ〜ｃは、他の実施例を示し、この例で
は成形品の表裏面でコア層を露出させるようにし
ている。 FIGS. 7a to 7c show another embodiment, in which the core layer is exposed on the front and back surfaces of the molded product.
すなわち、この例では、中実棒状の可動ピン７
１が、スキン材注入に続いてコア材注入後適当時
間経過後上記実施例と同様にして第７図ｂ、第７
図ｃの状態へと移動され、前記第５図と同様の充
填態様により、第７図ｃのように、７２，７３表
裏面でコア層が露出された形成品となる。第７図
により形成された成形品は、アースを取つたり、
あるいは、ビスを用いず、面同志の接合により導
通を計るのに非常に有効的である。 That is, in this example, the solid rod-shaped movable pin 7
1 is made in the same manner as in the above embodiment after an appropriate time has elapsed after the injection of the skin material and the injection of the core material.
The molded article is moved to the state shown in FIG. c, and the same filling method as shown in FIG. 5 is used to form a formed product in which the core layer is exposed on the front and back surfaces of 72 and 73, as shown in FIG. 7c. The molded product formed according to FIG.
Alternatively, it is very effective to measure continuity by joining surfaces together without using screws.
以上説明したように、サンドイツチ成形する際
に用いる金型において、導通あるいはアースを取
りたい成形品の所望の部分に、可動ピンを設け、
樹脂注入中の適当な時間経過後、上記可動ピンを
移動させる事により、スキン層とコア層とからな
るサンドイツチ成形品の所定の部分でコア層を露
出させることが出来、その結果従来行なわれてい
たようなコア層を部分的に露出する為に穴あけ、
切削除去等する後加工が不要となり、外観が美し
く、成形後の加工が不要なサンドイツチ成形品を
提供する事が可能となつた。
As explained above, in the mold used for sanderch molding, movable pins are provided at desired parts of the molded product where continuity or grounding is desired.
By moving the movable pin after an appropriate amount of time has elapsed during resin injection, it is possible to expose the core layer at a predetermined portion of the Sanderuch molded product, which consists of a skin layer and a core layer, which has not been done in the past. Drill a hole to partially expose the core layer,
This eliminates the need for post-processing such as cutting and removing, making it possible to provide a sander beach molded product that has a beautiful appearance and does not require post-molding processing.
図面第１図は本発明方法により形成されたスキ
ン層及びコア層の２層を有する成形品を用いて構
成されたカメラのレンズ鏡筒の一例構造を示す断
面図、第２図は上記２層を有する部材同士の導電
性を保つた結合部の構造を説明するための結合前
の状態を示した図、第３図は同第２図の結合後の
状態を示した図、第４図ａは本発明方法に使用さ
れる金型装置の一例の構造概要を示した断面図、
第４図ｂ，ｃは夫々可動ピンユニツトの構造を示
した図、第５図ａ，ｂは第４図ａに示した金型装
置の可動ピンの動きを説明するための図、第６図
は第５図装置により成形された成形品のコア層露
出部の状態を示した図、第７図ａ，ｂ，ｃは第４
図ａに示した金型装置の他の例の可動ピンの動き
を説明するための図、第８図はコア層を有しない
成形品を用いて構成されたカメラのレンズ鏡筒の
一例構造を示す断面図である。
１……合焦レンズホルダ、２……固定鏡筒、２
ａ……コア層、２ｂ……スキン層、３，４……レ
ンズホルダ、５……ガイドバー、６……カム環、
６ａ，６ｂ……カムリフト、７……ズーム操作
環、８……前側マスク板、９……後側マスク板、
１２……絞り、１３……レンズホルダ、１４……
リレーホルダー、１５……ビス、１６……マウン
トホルダ、１７……ビス、１８……中継筒、１８
ａ……コア層、１８ｂ……スキン層、１９……ビ
ス、３１ａ……穴内面、３１ｂ……穴開口周縁の
面、３２……嵌合部、３３……ビス止め用下穴、
４１……スキン材射出シリンダ、４１ａ……スキ
ンスプルー、４１ｂ……バイパスランナー、４２
……コア材射出シリンダ、４２ａ……コアスプル
ー、４２ｂ……ランナー、４３……固定側取付
板、４４……固定板、４５……ランナープレー
ト、４６……型板、４７……可動側固定板、４８
……キヤビテイ（空隙）、４９……可動ピンユニ
ツト、６１，６２，６３……コア層露出面、７１
……可動ピン、７２，７３……コア層の表裏露出
面。
Figure 1 is a cross-sectional view showing an example of the structure of a camera lens barrel constructed using a molded product having two layers, a skin layer and a core layer, formed by the method of the present invention, and Figure 2 is a cross-sectional view showing an example of the structure of a camera lens barrel constructed using a molded product having two layers, a skin layer and a core layer, formed by the method of the present invention. Figure 3 is a diagram showing the state before joining to explain the structure of a joining part that maintains electrical conductivity between members having . is a sectional view showing a structural outline of an example of a mold device used in the method of the present invention,
Figures 4b and 4c are diagrams showing the structure of the movable pin unit, Figures 5a and 5b are diagrams for explaining the movement of the movable pin of the mold device shown in Figure 4a, and Figure 6 is a diagram showing the structure of the movable pin unit. Fig. 5 is a diagram showing the state of the core layer exposed portion of the molded product molded by the device; Fig. 7 a, b, and c are the fourth
A diagram for explaining the movement of the movable pin in another example of the mold device shown in Figure a, and Figure 8 shows an example structure of a camera lens barrel constructed using a molded product without a core layer. FIG. 1... Focusing lens holder, 2... Fixed lens barrel, 2
a... Core layer, 2b... Skin layer, 3, 4... Lens holder, 5... Guide bar, 6... Cam ring,
6a, 6b...cam lift, 7...zoom operation ring, 8...front mask plate, 9...rear mask plate,
12...Aperture, 13...Lens holder, 14...
Relay holder, 15...screw, 16...mount holder, 17...screw, 18...relay tube, 18
a... Core layer, 18b... Skin layer, 19... Screw, 31a... Hole inner surface, 31b... Hole opening peripheral surface, 32... Fitting portion, 33... Prepared hole for screw fixing,
41...Skin material injection cylinder, 41a...Skin sprue, 41b...Bypass runner, 42
... Core material injection cylinder, 42a ... Core sprue, 42b ... Runner, 43 ... Fixed side mounting plate, 44 ... Fixed plate, 45 ... Runner plate, 46 ... Template plate, 47 ... Movable side fixed plate , 48
... Cavity (gap), 49 ... Movable pin unit, 61, 62, 63 ... Core layer exposed surface, 71
...Movable pin, 72, 73... Front and back exposed surfaces of the core layer.
Claims (1)
ン層材を注入し、その後に導電性コア層材を注入
し成形して表面を非導電性スキン層とし内部を導
電性コア層とした樹脂成形品において、 前記樹脂成形品内部の前記導電性コア層材の一
部を前記スキン層材の表面に露出するように成形
して前記露出した導電性コア層材に導電性部材を
接続して電気的導通を得るようにしたことを特徴
とした樹脂成形品。 ２ スキン層と導電性コア層を有する樹脂成形品
の成形方法において、 成形用キヤビテイを画する金型内面に該キヤビ
テイに対し突出・後退可能の可動ピンを設け、 形成のスキン層材およびこれに続くコア層材注
入に際し、前記キヤビテイ内に突出した前記可動
ピンを前記キヤビテイ内から後退させると共に前
記コア層材を注入し、該コア層材の一部を前記ス
キン層材の表面に露出させることを特徴とするス
キン層と導電性コア層とを有する樹脂成形品の成
形方法。 ３ 上記可動ピンとして、キヤビテイ内に突出し
た固定ピンの外周を囲む筒状体を用いることを特
徴とする特許請求の範囲第２項記載の樹脂成形品
の成形方法。 ４ 上記可動ピンとして、中実棒状体を用いるこ
とを特徴とする特許請求の範囲第２項記載の樹脂
成形品の成形方法。[Claims] 1. First, a non-conductive skin layer material is injected into a mold for molding a molded product, and then a conductive core layer material is injected and molded to form a non-conductive skin layer on the surface and the inside. In a resin molded product having a conductive core layer, a part of the conductive core layer material inside the resin molded product is molded to be exposed on the surface of the skin layer material, and the exposed conductive core layer material is A resin molded product characterized by having a conductive member connected to it to obtain electrical continuity. 2. In a method of molding a resin molded product having a skin layer and a conductive core layer, a movable pin that can protrude and retract from the molding cavity is provided on the inner surface of the mold that defines a molding cavity, and the forming skin layer material and this When subsequently injecting the core layer material, the movable pin protruding into the cavity is retreated from the cavity, and the core layer material is injected, so that a part of the core layer material is exposed on the surface of the skin layer material. A method for molding a resin molded product having a skin layer and a conductive core layer, characterized by: 3. The method for molding a resin molded product according to claim 2, wherein the movable pin is a cylindrical body surrounding the outer periphery of a fixed pin protruding into the cavity. 4. The method for molding a resin molded product according to claim 2, wherein a solid rod-shaped body is used as the movable pin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28624386A JPS63139718A (en) | 1986-12-01 | 1986-12-01 | Sandwich molding method for resin molded form |
| US07/022,210 US4805991A (en) | 1986-03-13 | 1987-03-05 | Multi-layer resin molded article and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28624386A JPS63139718A (en) | 1986-12-01 | 1986-12-01 | Sandwich molding method for resin molded form |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63139718A JPS63139718A (en) | 1988-06-11 |
| JPH0366136B2 true JPH0366136B2 (en) | 1991-10-16 |
Family
ID=17701836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28624386A Granted JPS63139718A (en) | 1986-03-13 | 1986-12-01 | Sandwich molding method for resin molded form |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63139718A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9450081B2 (en) | 2006-11-21 | 2016-09-20 | Cree, Inc. | High voltage GaN transistor |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2219472C (en) | 1996-10-29 | 2002-01-22 | Kabushiki Kaisha Kobe Seiko Sho | Multilayer injection molding machine, injection unit connecting device therefor, and injection molding method thereby |
| DE19932383A1 (en) * | 1999-07-14 | 2001-01-18 | Ticona Gmbh | Electrically conductive molded plastic parts |
| JP5276397B2 (en) * | 2008-09-25 | 2013-08-28 | パナソニック株式会社 | Manufacturing method for sandwich moldings |
| KR102486881B1 (en) * | 2020-09-01 | 2023-01-10 | 엘지전자 주식회사 | Co-injection molding apparatus, controlling method thereof and co-injection product |
-
1986
- 1986-12-01 JP JP28624386A patent/JPS63139718A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9450081B2 (en) | 2006-11-21 | 2016-09-20 | Cree, Inc. | High voltage GaN transistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63139718A (en) | 1988-06-11 |
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