JPH0366144A - Totalization apparatus of water test categories - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a category aggregation device for various data in a wafer test process.

[Conventional technology]

FIG. 2 is an explanatory diagram showing the positioning of the category aggregation device in the conventional wafer test process.Similar to FIG. It collects data, processes it, and outputs it to a CRT (181) or printer (19).

Next, the operation will be explained. The quefer test category aggregation device αυ performs a wafer test on the wafer (131) on the wafer roving device 141 with a tester (L),
The test results (hereinafter referred to as categories) and the chip positions on the wafer (8) are
It receives data from the data aggregation block (151) in 41 and outputs the category contents or the defective chip position on wafer (13I (hereinafter referred to as wafer map) to 0RT (181 or printer).

FIG. 3 shows the data output results of the conventional wafer test category aggregation device.

After the 1st process quefer test, mark (2) the defective areas with ink, etc. on the wafer (1) 1. This data is compiled by the wafer test category aggregation device to create a wafer map (8) and a category sheet (4). is displayed on the printer (9) or CRT (8). The wafer map (8) displays defective categories numerically so that you can recognize which chips on the wafer have what kind of defects.
The category sheet (4) displays the number of defects in each category among the target wafers.

[Problem to be solved by the invention]

Conventional wafer test category aggregation devices were configured as described above, so when there are two or more wafer test processes, it is necessary to compare the wafer map output by each code with the category sheet tracker for the aggregation. Ueno\-Yield 9 requires counting the defective marks on actual wafers and confirming the number of defective products and the number of non-defective products, which has the problem of making it difficult to grasp the total number of defective products.

This invention was made to solve the above problems, and it is possible to output the aggregated results of individual wafer test codes, as well as output the wafer map and category sheet by summarizing the total results after testing all codes. The purpose is to obtain a wafer test category aggregation device.

[Means to solve the problem]

The wafer test category aggregation device according to the present invention includes:
It is designed to hold the results of individual wafer test processes, superimpose the data to create final test data, and output the final wafer map and category using the data.

[Effect]

The wafer test category aggregation device according to the present invention makes it easy to grasp the final number of non-defective products using the output final wafer map and category sheet, and facilitates failure analysis based on the location of defects on the uniform bar and the contents of the defects.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, (1) is the wafer in the first process,
The results are compiled into a wafer map (5) and a category sheet (7). Also the same wafer (1)
The wafer tested in the second process is the second process completed wafer (2). The wafer map (6) and category sheet (8) are the results of only the second step. The results of the final wafer test process (hereinafter explained up to 2 steps 1) are summarized in Kueno\-map (9) and category sheet α.
0).

Next, the operation will be explained.

A defective mark (8) is placed on the defective part of the queno\-(1) that has completed the first quefer test process. The results are transmitted and accumulated to the wafer test category aggregation device in a configuration as shown in FIG. In addition, this wafer test category aggregation device uses the results as the ``wafer map (5) and category sheet (γ)'' for the first quefer process.
It is output as .

Next, the same wafer is put into the second wafer test process, and after the completion of the process, the uni/X-(2) has defective marks in the defective areas of the first wafer/X-test process and the second wafer test process. ing. (In FIG. 1, it is distinguished as a defective mark (4) for the second process.) The results are output as a wafer map (6) and a category sheet (8) for only the second wafer process.

However, since not all the defects in the first process are included in the defects in the second process, the test results of these multiple test processes are temporarily held in the wafer test category aggregation device, and each test The wafer test category aggregation device of the present invention has a function of overlapping process results.

This wafer test category device outputs a wafer map (9) and a category sheet αO) after the final wafer test.

In the above embodiment, the wafer test category aggregation device is equipped with a function to output the final results of multiple wafer test processes to a wafer map and category sheet. However, if there are 1 to 10 wafer test processes, the final A function may be provided to output not only the results but also the output of each individual wafer test process or a combination of the second and fifth processes.

〔Effect of the invention〕

As described above, according to the present invention, the number of non-defective products and the number of defective products after the final sea urchin/X-test process can be determined by visually counting the wafers, but this is no longer necessary, and defect analysis data can also be used as defective analysis data. It also has the effect that it can be easily output and utilized.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing the aggregation results of the Uni/X-test category aggregation device which is an embodiment of the present invention, Fig. 2 is an explanatory diagram showing the positioning of the category aggregation device used in the wafer test process, and Fig. 3 The figure is an explanatory diagram showing conventional wafer test category aggregation results. In the figure, (1) is the wafer completed in the 1st process /) - 1 (2) is the wafer completed in the 2nd process, (8) is the defective mark in the 1st process, (
4) is the defect mark of the second process, (5) is the wafer map of the first process, (6) is the wafer map of the second process, (a)
indicates the first process category sheet, (8) the second process category sheet, (9) the final wafer map, and the final category sheet. In addition, the same symbols in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] A wafer test characterized in that, in a wafer test process having two or more processes, the data of the wafer test can be aggregated, the data for each process can be held, and finally the aggregated results of all processes can be outputted. Category aggregation device.