JPH0366825B2 - - Google Patents
Info
- Publication number
- JPH0366825B2 JPH0366825B2 JP17383187A JP17383187A JPH0366825B2 JP H0366825 B2 JPH0366825 B2 JP H0366825B2 JP 17383187 A JP17383187 A JP 17383187A JP 17383187 A JP17383187 A JP 17383187A JP H0366825 B2 JPH0366825 B2 JP H0366825B2
- Authority
- JP
- Japan
- Prior art keywords
- mol
- polyimide
- adhesive
- acid
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 25
- 239000004642 Polyimide Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 11
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 9
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 8
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 8
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 6
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 6
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 5
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 5
- -1 aziridine compound Chemical class 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical group 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 6
- 229920005575 poly(amic acid) Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- XBFUGGOVPHCNEG-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CCC(CO)(CO)CO XBFUGGOVPHCNEG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、特殊なポリアミツク酸溶液を銅箔上
に流延塗布し、加熱硬化せしめた銅／ポリイミド
積層物のポリイミド面どうしを特殊なポリエステ
ル系接着剤により接着せしめた、耐熱性、耐寒
性、電気特性、機械特性、耐薬品性等に優れた
銅／ポリイミド／接着剤／ポリイミド／銅なる構
成のフレキシブルプリント回路用基板に係るもの
である。Detailed Description of the Invention [Industrial Field of Application] The present invention is a copper/polyimide laminate in which a special polyamic acid solution is cast onto a copper foil and cured by heating. This relates to a flexible printed circuit board made of copper/polyimide/adhesive/polyimide/copper that is bonded with a base adhesive and has excellent heat resistance, cold resistance, electrical properties, mechanical properties, chemical resistance, etc. .
従来、両面に金属箔を有するフレキシブル回路
用基板はポリイミド、ポリエステル等の絶縁フイ
ルムの両側に金属箔を接着剤で貼り合せたもので
あり、金属箔／接着剤／絶縁フイルム／接着剤／
金属箔といつた構成であつた。
Conventionally, flexible circuit boards with metal foil on both sides are made by pasting metal foil on both sides of an insulating film made of polyimide, polyester, etc. with an adhesive.
It was made of metal foil.
しかしながら、この様な構成の回路基板は、絶
縁フイルムと金属箔との間に接着剤層が存在する
ため、得られた回路基板の特性が接着剤の性質に
左右され、絶縁フイルムに高性能フイルムを使用
しても、その特性を十分を生かしきれていないと
いう欠点があつた。 However, in circuit boards with such a structure, since there is an adhesive layer between the insulating film and the metal foil, the characteristics of the resulting circuit board are influenced by the properties of the adhesive, and it is difficult to add a high-performance film to the insulating film. Even when used, the drawback was that its characteristics could not be fully utilized.
具体的な例としてはナイロン系接着剤を用いた
場合、吸水性が高いため、回路としての耐湿絶縁
性が悪くなるとかゴム系接着剤を用いると耐熱性
が悪くなり、ハンダ処理工程で回路部分と絶縁フ
イルムとの接着性が悪くなるとかである。 For example, if a nylon adhesive is used, the moisture-resistant insulation of the circuit will deteriorate due to its high water absorption, and if a rubber adhesive is used, the heat resistance will deteriorate and the circuit part will be damaged during the soldering process. This may result in poor adhesion between the film and the insulating film.
一方、この様な問題を解決するため、熱可塑性
ポリイミド系フイルムをフイルム状接着剤として
用いて、両面に金属箔を熱プレスして、フレキシ
ブルプリント回路用基板を作成する方法が知られ
ている。しかし、この場合も、接着時に非常に高
温・高圧にする必要があり、作成上の困難さがあ
る。 On the other hand, in order to solve this problem, a method is known in which a thermoplastic polyimide film is used as a film adhesive and metal foil is hot-pressed on both sides to create a flexible printed circuit board. However, in this case as well, it is necessary to use extremely high temperature and pressure during bonding, making it difficult to manufacture.
この他、特開昭55−153393号公報に示されてい
るように、金属箔に樹脂ワニスをキヤストし、樹
脂面同士を接着剤にて貼合せて両面金属張りプレ
キシブル回路基板を作成する方法が知られている
が、これにより得られる物も、樹脂、接着剤に一
般的なものを用いているため、次のような欠点を
有している。例えば、金属箔にキヤストする樹
脂の膨張係数が金属箔の膨張係数と不一致のた
め、キヤスト後の積層物がカールし、その後、接
着作業が困難であるとか、さらに同様な理由で
基板の寸法安定性に劣るとか、ヒートサイクル
テストなどの苛酷な条件下での接着性に問題があ
るのが現状であつた。 In addition, as shown in Japanese Unexamined Patent Publication No. 55-153393, there is a method of casting resin varnish on metal foil and bonding the resin surfaces together with adhesive to create a double-sided metal-clad flexible circuit board. However, since the products obtained using this method use common resins and adhesives, they have the following drawbacks. For example, the coefficient of expansion of the resin cast on the metal foil does not match the coefficient of expansion of the metal foil, resulting in curling of the laminate after casting, which makes bonding work difficult, and for similar reasons, the dimensions of the board may become unstable. Currently, there are problems with adhesive properties under harsh conditions such as heat cycle tests.
本発明者らは、これまでのかかる欠点を克服す
べく、鋭意検討した結果、本発明に到着した。即
ち、本発明で特定するポリアミツク酸を銅箔上に
流延塗布し、加熱硬化して得られた銅／ポリイミ
ド積層体のポリイミド面どうしを、特殊なポリエ
ステル系接着剤で貼合せることにより、銅／ポリ
イミド／接着剤／ポリイミド／銅なる構成を持
つ、耐熱性、電気特性に優れたフレキシブルプリ
ント回路用基板を完成するに至つたものである。
The inventors of the present invention have arrived at the present invention as a result of intensive studies aimed at overcoming such drawbacks. That is, the polyamic acid specified in the present invention is cast onto a copper foil, and the polyimide surfaces of the resulting copper/polyimide laminate are bonded together using a special polyester adhesive. We have completed a flexible printed circuit board with a composition of /polyimide/adhesive/polyimide/copper that has excellent heat resistance and electrical properties.
即ち、本発明は、銅箔上に３，3′、４，4′−ビ
フエニルテトラカルボン酸二無水物50〜80モル％
とピロメリツト酸二無水物50〜20モル％からなる
テトラカルボン酸二無水成分と、パラフエニレン
ジアミン50〜80モル％と、４，4′−ジアミノジフ
エニルエーテル50〜20モル％からなるジアミン成
分を反応せしめて得られるポリアミツク酸溶液を
流延塗布し、加熱硬化して得られる銅箔／ポリイ
ミド積層物のポリイミド面に、テレフタルとエチ
レングリコールおよび／又はテトラメチレングリ
コールとの組合せを主成分としさらに、イソフタ
ル酸および／又はセバシン酸、ポリテトラメチレ
ンエーテルグリコールを５〜50重量％共重合させ
た末端カルボン酸ポリエスル樹脂組成物に、多官
能アジリジン化合物を硬化剤として添加した接着
剤組成物からなり、銅箔／ポリイミド／接着剤／
ポリイミド／銅箔なる構成をもつフレキシブルプ
リント回路用基板に関するものである。
That is, the present invention provides 50 to 80 mol% of 3,3',4,4'-biphenyltetracarboxylic dianhydride on copper foil.
and a tetracarboxylic dianhydride component consisting of 50 to 20 mol% of pyromellitic dianhydride, a diamine component consisting of 50 to 80 mol% of paraphenylene diamine, and 50 to 20 mol% of 4,4'-diaminodiphenyl ether. A polyamic acid solution obtained by reacting the polyamic acid solution is cast and cured by heating, and the polyimide surface of the copper foil/polyimide laminate is coated with a combination of terephthal and ethylene glycol and/or tetramethylene glycol as the main component. , an adhesive composition in which a polyfunctional aziridine compound is added as a curing agent to a terminal carboxylic acid polyester resin composition obtained by copolymerizing 5 to 50% by weight of isophthalic acid and/or sebacic acid and polytetramethylene ether glycol, Copper foil/polyimide/adhesive/
This invention relates to a flexible printed circuit board having a polyimide/copper foil structure.
本発明で使用するポリアミツク酸の重合に用い
るテトラカルボン酸二無水物は、３，3′、４，
4′−ビフエニルテトカルボン酸二無水物50〜80モ
ル％とピロメリツト酸二無水物50〜20モル％であ
る。 The tetracarboxylic dianhydride used in the polymerization of polyamic acid used in the present invention is 3, 3', 4,
4'-biphenyltetocarboxylic dianhydride is 50 to 80 mol% and pyromellitic dianhydride is 50 to 20 mol%.
３，3′、４，4′−ビフエニルテトラカルボン酸
二無水物が50モル％以下で、ピロメリツト酸二無
水物が50モル％以上では、ポリイミドフイルムの
収縮率が大きくなり、回路基板として使用するに
当つては、寸法安定性の点で信頼性の低下がおこ
る。逆に、３，3′、４，4′−ビフエニルテトラカ
ルボン酸二無水物が80モル％以上、ピロメリツト
酸二無水物が20モル％以下では、フイルムの可塑
性が劣るため、引き裂きといつた力に対しての耐
性が弱くなる。また、本発明で使用するジアミン
は、パラフエニレンジアミン50〜80モル％と４，
4′−ジアミノジフエニルエーテル50〜20モル％で
ある。 If the amount of 3,3',4,4'-biphenyltetracarboxylic dianhydride is less than 50 mol% and the amount of pyromellitic dianhydride is more than 50 mol%, the shrinkage rate of the polyimide film will increase, making it difficult to use it as a circuit board. In this case, reliability decreases in terms of dimensional stability. On the other hand, if 3,3',4,4'-biphenyltetracarboxylic dianhydride is 80 mol% or more and pyromellitic dianhydride is 20 mol% or less, the plasticity of the film is poor, resulting in tearing. Resistance to force becomes weaker. In addition, the diamine used in the present invention includes 50 to 80 mol% of paraphenylenediamine and 4,
4'-diaminodiphenyl ether 50-20 mol%.
パラフエニレンジアミンが50モル％以下、ジア
ミノジフエニルエーテルが50モル％以上の場合、
テトラカルボン酸二無水物の場合と同様にフイル
ムの寸法安定性の点で劣り、逆にパラフエニレン
ジアミンが80モル％以上、ジアミノジフエニルエ
ーテルが20モル％以下では、フイルムの可塑性の
点で劣る。 When paraphenylene diamine is 50 mol% or less and diaminodiphenyl ether is 50 mol% or more,
As in the case of tetracarboxylic dianhydride, the dimensional stability of the film is poor, and conversely, when paraphenylene diamine is 80 mol% or more and diaminodiphenyl ether is 20 mol% or less, the plasticity of the film is poor. Inferior.
本発明で示した組成のポリイミドは、線膨張係
数が銅のそれと同レベルであるため、このポリイ
ミドを銅箔に積層して得られた積層物は全くカー
ルがなく、又、収縮率も非常に小さいということ
から、エツチング等の工程による寸法変化率も、
従来のフレキシブルプリント回路基板よりも小さ
いという特徴をもつている。また、本発明で使用
する接着剤は、上記組成のポリイミド樹脂を強力
に接着させるためのものであり、テレフタル酸と
エチレングリコールおよび／又はテトラメチレン
グリコールを主成分とし、これにさらにイソフタ
ル酸および／又はセバシン酸とポリテトラメチレ
ングリコールを５〜50重量％共重合させた末端カ
ルボン酸ポリエステル系組成物を多官能アジリジ
ン化合物で硬化せしめるものであるが、この組成
に他の多官能エポキシ化合物、多官能シアン酸エ
ステル化合物等を添加することもできる。 Polyimide with the composition shown in the present invention has a coefficient of linear expansion on the same level as that of copper, so the laminate obtained by laminating this polyimide on copper foil has no curl at all and has a very low shrinkage rate. Because it is small, the dimensional change rate due to processes such as etching is also small.
It has the characteristic of being smaller than conventional flexible printed circuit boards. The adhesive used in the present invention is for strongly adhering polyimide resins having the above composition, and has terephthalic acid, ethylene glycol and/or tetramethylene glycol as main components, and further contains isophthalic acid and/or tetramethylene glycol. Alternatively, a terminal carboxylic acid polyester composition prepared by copolymerizing sebacic acid and polytetramethylene glycol in an amount of 5 to 50% by weight is cured with a polyfunctional aziridine compound, but this composition may not contain other polyfunctional epoxy compounds or polyfunctional aziridine compounds. A cyanate ester compound or the like may also be added.
この組成の接着剤は、上で示した組成のポリイ
ミド樹脂との接着性が非常に優れており、熱処
理、ヒートシヨツク等を施してもその接着性の低
下は極くわずかである。 The adhesive of this composition has very good adhesion to the polyimide resin of the composition shown above, and even when subjected to heat treatment, heat shock, etc., the adhesiveness deteriorates only slightly.
両面板として出来上つたものの接着剤層の厚み
は5μｍ〜20μｍが好ましい。5μｍ以下であれば接
着性が低下してしまい、20μｍ以上であれば接着
層の樹脂の影響が強くでてしまい、ポリイミドと
しての特性がそこなわれる傾向にある。 The thickness of the adhesive layer of the double-sided board is preferably 5 μm to 20 μm. If it is less than 5 μm, the adhesiveness will be reduced, and if it is more than 20 μm, the influence of the resin of the adhesive layer will be strong, and the properties of polyimide will tend to be impaired.
本発明で示したフレキシブルプリント回路用基
板は、銅箔回路層とポリイミド層との間に接着剤
層がないため、優れた耐熱性、耐寒性、耐湿絶縁
性、高周波特性を示し、また、回路間の銅マイグ
レーシヨンが非常に少ないといつた高信頼性を有
している。
The flexible printed circuit board shown in the present invention has no adhesive layer between the copper foil circuit layer and the polyimide layer, so it exhibits excellent heat resistance, cold resistance, moisture resistance insulation, and high frequency characteristics. It has high reliability with very little copper migration between the two.
実施例 １
３，3′、４，4′−ビフエニルテトラカルボン酸
二無水物70モル％とピロメリツト酸二無水物30モ
ル％とからなる酸無水物成分と、パラフエニレン
ジアミン70モル％とジアミノジフエニルエーテル
30モル％からなるジアミン成分を、酸成分／アミ
ン成分モル比を0.97、樹脂分濃度15％で反応した
ポリアミツク酸溶液を１オンス圧延銅箔に塗布
し、100℃から350℃まで連続的に２時間かけて昇
温し、ポリイミド厚が25μｍのキヤストラミネー
トを得た。該キヤストラミネートのポリイミド面
に、平均分子量10000の酸成分としてテレフタル
酸、イソフタル酸、セバシン酸を４：３：3mol
％グリコール成分として、エチレングリコールテ
トラメチレングリコールを１：1mol％から成る
末端カルボン酸ポリエステル樹脂20％ジオキサン
溶液100重量部に対しトリメチロールプロパン−
トリ−β−アジリジニルプロピオン酸エステルを
２重量部加えた接着剤組成物を塗布し、80℃で15
分乾燥後、乾燥後の厚み、片面5μｍ、重ね合わ
せ後10μｍとなるようにし２枚を重ね合わせ150
℃、40Kg／cm2で40分間プレスし、両面銅箔張フレ
キシブルプリント回路基板を得た。
Example 1 An acid anhydride component consisting of 70 mol% of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 30 mol% of pyromellitic dianhydride, and 70 mol% of paraphenylenediamine. Diaminodiphenyl ether
A polyamic acid solution prepared by reacting a diamine component consisting of 30 mol% with an acid component/amine component molar ratio of 0.97 and a resin content concentration of 15% was applied to 1 ounce of rolled copper foil and heated continuously from 100°C to 350°C for 2 hours. The temperature was raised over time to obtain a cast laminate with a polyimide thickness of 25 μm. On the polyimide surface of the cast laminate, 4:3:3 mol of terephthalic acid, isophthalic acid, and sebacic acid were added as acid components with an average molecular weight of 10,000.
% glycol component, trimethylolpropane-trimethylolpropane to 100 parts by weight of a 20% dioxane solution of terminal carboxylic acid polyester resin containing 1:1 mol% of ethylene glycol and tetramethylene glycol.
An adhesive composition containing 2 parts by weight of tri-β-aziridinylpropionic acid ester was applied and heated at 80°C for 15 minutes.
After drying for 15 minutes, stack the two sheets so that the thickness after drying is 5 μm on one side and 10 μm after stacking.
℃ and 40 kg/cm 2 for 40 minutes to obtain a double-sided copper foil-clad flexible printed circuit board.
このようにして得られたフレキシブルプリント
回路板の接着層での180℃ピール強度は3.2Kg／cm
であり、300℃半田浴槽に５分間デイツプしても
何ら異常は見られなかつた。また、−196℃＋150
℃各２分のヒートサイクルテストを100サイクル
行つても何ら異常は見られず、その後180°ピール
強度は2.6Kg／cmであつた。 The 180°C peel strength of the adhesive layer of the flexible printed circuit board thus obtained was 3.2 Kg/cm.
No abnormality was observed even after dipping in a 300°C solder bath for 5 minutes. Also, −196℃＋150
No abnormalities were observed even after 100 cycles of heat cycle tests of 2 minutes each at °C, and thereafter the 180° peel strength was 2.6 kg/cm.
実施例で作成した銅箔／ポリイミドキヤストラ
ミネートのポリイミド面にエポキシ系接着剤（セ
メダインEP−106）を塗布し、これを２枚重ね合
わせプレス接着し、両面金属箔張フレキシブルプ
リント回路用基板を作成した。
Epoxy adhesive (CEMEDINE EP-106) was applied to the polyimide surface of the copper foil/polyimide cast laminate created in the example, and two sheets were pressed and bonded together to create a double-sided metal foil-clad flexible printed circuit board. did.
これにより得られた回路用基板の接着剤層での
180°ピール強度は0.5Kg／cm2であり、300℃半田浴
５分デイツプでは異常は見られなかつたものの、
−196℃＋150℃の各２分のヒートサイクルテスト
では、20サイクルで接着面のハクリが観察され
た。 In the adhesive layer of the circuit board obtained by this
The 180° peel strength was 0.5Kg/ cm2 , and although no abnormality was observed in a 5-minute dip in a 300℃ solder bath,
In a heat cycle test of -196°C + 150°C for 2 minutes each, peeling of the adhesive surface was observed after 20 cycles.
Claims (1)
カルボン酸二無水物50〜80モル％とピロメリツト
酸二無水物50〜20モル％からなるテトラカルボン
酸二無水物成分と、パラフエニレンジアミン50〜
80モル％と４，4′−ジアミノジフエニルエーテル
50〜20モル％からなるジアミン成分を反応せしめ
て得られるポリアミツク酸溶液を流延塗布し、加
熱硬化して得られた銅箔／ポリイミド積層物のポ
リイミド面に、テレフタル酸とエチレングリコー
ルおよび／又はテトラメチレングリコールとの組
合せを主成分とし、さらにイソフタル酸および／
又はセバシン酸、ポリテトラメチレンエーテルグ
リコールを５〜50重量％共重合させた末端カルボ
ン酸ポリエステル組成物に多官能アジリジン化合
物を硬化剤として添加した接着剤組成物を用いて
なることを特徴とする銅箔／ポリイミド／接着
剤／ポリイミド／銅箔なる構成のフレキシブルプ
リント回路用基板。1. A tetracarboxylic dianhydride component consisting of 50 to 80 mol% of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 50 to 20 mol% of pyromellitic dianhydride on copper foil, Paraphenylenediamine 50~
80 mol% and 4,4'-diaminodiphenyl ether
Terephthalic acid, ethylene glycol and/or The main component is a combination of tetramethylene glycol, and isophthalic acid and/or
Or, copper characterized by using an adhesive composition in which a polyfunctional aziridine compound is added as a curing agent to a terminal carboxylic acid polyester composition obtained by copolymerizing 5 to 50% by weight of sebacic acid and polytetramethylene ether glycol. A flexible printed circuit board consisting of foil/polyimide/adhesive/polyimide/copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17383187A JPS6418294A (en) | 1987-07-14 | 1987-07-14 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17383187A JPS6418294A (en) | 1987-07-14 | 1987-07-14 | Flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6418294A JPS6418294A (en) | 1989-01-23 |
| JPH0366825B2 true JPH0366825B2 (en) | 1991-10-18 |
Family
ID=15967963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17383187A Granted JPS6418294A (en) | 1987-07-14 | 1987-07-14 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418294A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05105777A (en) * | 1991-10-15 | 1993-04-27 | Sumitomo Bakelite Co Ltd | Polyisoimide film and production of substrate for flexible printed circuit with the same |
| JPH05105755A (en) * | 1991-10-15 | 1993-04-27 | Sumitomo Bakelite Co Ltd | Polyisoimide and its film |
| KR101064816B1 (en) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | Polyamic Acid Solution, Polyimide Resin, and Flexible Metal Foil Laminate Using the Same |
| JP5291553B2 (en) * | 2009-07-02 | 2013-09-18 | 三井金属鉱業株式会社 | Copper foil with composite resin layer, method for producing copper foil with composite resin layer, flexible double-sided copper-clad laminate and method for producing three-dimensional molded printed wiring board |
| JP7490466B2 (en) | 2020-06-23 | 2024-05-27 | 株式会社マキタ | Fastening Tools |
-
1987
- 1987-07-14 JP JP17383187A patent/JPS6418294A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6418294A (en) | 1989-01-23 |
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