JPH045631U - - Google Patents
Info
- Publication number
- JPH045631U JPH045631U JP4549790U JP4549790U JPH045631U JP H045631 U JPH045631 U JP H045631U JP 4549790 U JP4549790 U JP 4549790U JP 4549790 U JP4549790 U JP 4549790U JP H045631 U JPH045631 U JP H045631U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- chassis
- mounting structure
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
絶縁リングの斜視図、第３図は従来の貫通型コン
デンサの実装構造の断面図である。
１……貫通型コンデンサ、２……金属シヤーシ
、２ａ……ネジ部、２……座ぐり部、３……リー
ド、４……プリント基板、４ａ……穴、５……導
体パターン、６……半田、７……絶縁リング、７
ａ……中心穴。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a perspective view of an insulating ring, and FIG. 3 is a sectional view of a conventional feedthrough capacitor mounting structure. DESCRIPTION OF SYMBOLS 1... Feedthrough capacitor, 2... Metal chassis, 2a... Threaded part, 2... Spot facing part, 3... Lead, 4... Printed circuit board, 4a... Hole, 5... Conductor pattern, 6... ...Solder, 7...Insulation ring, 7
a...Center hole.
Claims (1)
のリードを、該シヤーシに沿つて配設したプリン
ト基板の穴を挿通させて該プリント基板に半田付
けしてなる実装構造において、前記リードには中
心穴を有する絶縁リングを嵌挿し、かつこの絶縁
リングを前記プリント基板とシヤーシとの間に介
在させたことを特徴とする貫通型コンデンサの実
装構造。 In a mounting structure in which leads of a feedthrough capacitor attached to a chassis are passed through holes in a printed circuit board disposed along the chassis and soldered to the printed circuit board, the leads have a center hole. 1. A mounting structure for a feedthrough capacitor, characterized in that an insulating ring is inserted between the printed circuit board and the chassis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4549790U JPH045631U (en) | 1990-04-28 | 1990-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4549790U JPH045631U (en) | 1990-04-28 | 1990-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045631U true JPH045631U (en) | 1992-01-20 |
Family
ID=31559728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4549790U Pending JPH045631U (en) | 1990-04-28 | 1990-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045631U (en) |
-
1990
- 1990-04-28 JP JP4549790U patent/JPH045631U/ja active Pending
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