JPH0367429U - - Google Patents
Info
- Publication number
- JPH0367429U JPH0367429U JP1989128876U JP12887689U JPH0367429U JP H0367429 U JPH0367429 U JP H0367429U JP 1989128876 U JP1989128876 U JP 1989128876U JP 12887689 U JP12887689 U JP 12887689U JP H0367429 U JPH0367429 U JP H0367429U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- epoxy resin
- center
- utility
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128876U JPH0367429U (is) | 1989-11-02 | 1989-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128876U JPH0367429U (is) | 1989-11-02 | 1989-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367429U true JPH0367429U (is) | 1991-07-01 |
Family
ID=31676550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989128876U Pending JPH0367429U (is) | 1989-11-02 | 1989-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367429U (is) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5333576A (en) * | 1976-09-09 | 1978-03-29 | Matsushima Kogyo Co Ltd | Ic molding method |
| JPH01133328A (ja) * | 1987-11-18 | 1989-05-25 | Nitto Denko Corp | 半導体素子の封止方法 |
-
1989
- 1989-11-02 JP JP1989128876U patent/JPH0367429U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5333576A (en) * | 1976-09-09 | 1978-03-29 | Matsushima Kogyo Co Ltd | Ic molding method |
| JPH01133328A (ja) * | 1987-11-18 | 1989-05-25 | Nitto Denko Corp | 半導体素子の封止方法 |