JPH0367429U - - Google Patents

Info

Publication number
JPH0367429U
JPH0367429U JP12887689U JP12887689U JPH0367429U JP H0367429 U JPH0367429 U JP H0367429U JP 12887689 U JP12887689 U JP 12887689U JP 12887689 U JP12887689 U JP 12887689U JP H0367429 U JPH0367429 U JP H0367429U
Authority
JP
Japan
Prior art keywords
pellet
epoxy resin
center
utility
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12887689U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12887689U priority Critical patent/JPH0367429U/ja
Publication of JPH0367429U publication Critical patent/JPH0367429U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の１実施例である正方形のペレ
ツトの上面図、第２図はその側面図、第３図は本
考案の他の実施例である長方形のペレツトの上面
図である。 FIG. 1 is a top view of a square pellet which is one embodiment of the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a top view of a rectangular pellet which is another embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] エポキシ樹脂組成物を圧縮成形したぺレツトの
中心部に少なくとも１つの穴を設けたことを特徴
とする半導体封止用エポキシ樹脂ペレツト。 An epoxy resin pellet for semiconductor encapsulation, characterized in that the pellet is compression molded from an epoxy resin composition, and at least one hole is provided in the center of the pellet.
JP12887689U 1989-11-02 1989-11-02 Pending JPH0367429U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12887689U JPH0367429U (en) 1989-11-02 1989-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12887689U JPH0367429U (en) 1989-11-02 1989-11-02

Publications (1)

Publication Number Publication Date
JPH0367429U true JPH0367429U (en) 1991-07-01

Family

ID=31676550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12887689U Pending JPH0367429U (en) 1989-11-02 1989-11-02

Country Status (1)

Country Link
JP (1) JPH0367429U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333576A (en) * 1976-09-09 1978-03-29 Matsushima Kogyo Co Ltd Ic molding method
JPH01133328A (en) * 1987-11-18 1989-05-25 Nitto Denko Corp Sealing of semiconductor element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333576A (en) * 1976-09-09 1978-03-29 Matsushima Kogyo Co Ltd Ic molding method
JPH01133328A (en) * 1987-11-18 1989-05-25 Nitto Denko Corp Sealing of semiconductor element

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