JPH0367500U - - Google Patents
Info
- Publication number
- JPH0367500U JPH0367500U JP12716889U JP12716889U JPH0367500U JP H0367500 U JPH0367500 U JP H0367500U JP 12716889 U JP12716889 U JP 12716889U JP 12716889 U JP12716889 U JP 12716889U JP H0367500 U JPH0367500 U JP H0367500U
- Authority
- JP
- Japan
- Prior art keywords
- component
- spacer
- circuit board
- printed circuit
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Description
第１図は本考案の実装断面図、第２図は本考案
に用いるスペーサ。第３図は従来のスペーサ。
１……プリント基板、２……スルーホール、３
……部品のリード、４……チツプ部品、５……部
品のケース。
Figure 1 is a sectional view of the implementation of the present invention, and Figure 2 is a spacer used in the present invention. Figure 3 shows a conventional spacer. 1...Printed circuit board, 2...Through hole, 3
...Parts lead, 4...Chip parts, 5...Parts case.
Claims (1)
該プリント基板に上記部品のリードを挿入し、ハ
ンダ付面をフローソルダにてハンダ付する。部品
実装構造において、スペーサとしてチツプ部品を
用いたことを特徴とする部品実装構造。 A spacer is interposed between the printed circuit board and the component, the lead of the component is inserted into the printed circuit board, and the soldering surface is soldered using flow solder. A component mounting structure characterized in that a chip component is used as a spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12716889U JPH0367500U (en) | 1989-11-01 | 1989-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12716889U JPH0367500U (en) | 1989-11-01 | 1989-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367500U true JPH0367500U (en) | 1991-07-01 |
Family
ID=31674942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12716889U Pending JPH0367500U (en) | 1989-11-01 | 1989-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367500U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60176291A (en) * | 1984-02-23 | 1985-09-10 | 松下電工株式会社 | Device for connecting printed board |
-
1989
- 1989-11-01 JP JP12716889U patent/JPH0367500U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60176291A (en) * | 1984-02-23 | 1985-09-10 | 松下電工株式会社 | Device for connecting printed board |
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