JPH036843U - - Google Patents
Info
- Publication number
- JPH036843U JPH036843U JP1989066945U JP6694589U JPH036843U JP H036843 U JPH036843 U JP H036843U JP 1989066945 U JP1989066945 U JP 1989066945U JP 6694589 U JP6694589 U JP 6694589U JP H036843 U JPH036843 U JP H036843U
- Authority
- JP
- Japan
- Prior art keywords
- lead portion
- die pad
- outer lead
- insulating film
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Description
第１図は本考案にかかるリードフレームの一実
施例を示し、Ａはその平面図、ＢはＡにおける
Ｂ−Ｂ線に沿う断面図、第２図および第３図は
従来の半導体素子用リードフレームを示す図、第
４図従来の半導体素子用リードフレームにおける
各部材間の電気的接続を説明する図、第５図はダ
イパツド部に絶縁基板または絶縁性フイルムを貼
り付ける場合の説明図である。
１……リードフレーム、２……アウタリード部
、３……インナリード部、４……ダイパツド部、
４ａ……凹部、５……絶縁基板または絶縁性フイ
ルム。
FIG. 1 shows an embodiment of a lead frame according to the present invention, A is a plan view thereof, B is a sectional view taken along line B-B in A, and FIGS. 2 and 3 are conventional leads for semiconductor devices. Figure 4 is a diagram illustrating the electrical connection between each member in a conventional lead frame for semiconductor devices; Figure 5 is an explanatory diagram when an insulating substrate or insulating film is attached to the die pad. . 1... Lead frame, 2... Outer lead part, 3... Inner lead part, 4... Die pad part,
4a... recess, 5... insulating substrate or insulating film.
Claims (1)
極が形成されている絶縁基板または絶縁性フイル
ムが貼り付けられるダイパツド部と、前記アウタ
ーリード部から延長形成されると共に他端が前記
独立電極とワイヤーにより接続されるインナリー
ド部とを備えたリードフレームにおいて、 前記ダイパツド部に、前記絶縁基板または絶縁
性フイルムが嵌合し得る大きさの凹部が設けられ
ていることを特徴とするリードフレーム。[Claims for Utility Model Registration] An outer lead portion connected to a circuit, a die pad portion to which an insulating substrate or insulating film is attached on which an independent electrode is formed, and an outer lead portion extending from the outer lead portion and other parts. In the lead frame including an inner lead portion whose end is connected to the independent electrode by a wire, the die pad portion is provided with a recessed portion large enough to fit the insulating substrate or the insulating film. Characteristic lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989066945U JPH036843U (en) | 1989-06-08 | 1989-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989066945U JPH036843U (en) | 1989-06-08 | 1989-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036843U true JPH036843U (en) | 1991-01-23 |
Family
ID=31600088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989066945U Pending JPH036843U (en) | 1989-06-08 | 1989-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036843U (en) |
-
1989
- 1989-06-08 JP JP1989066945U patent/JPH036843U/ja active Pending