JPH0368535B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a DHD (double heat sink diode) type semiconductor device such as a glass-sealed light emitting diode.

BACKGROUND TECHNOLOGY For example, a specific example of a DHD type diode will be explained with reference to FIG.
Reference numeral 1 designates a pair of leads, each of which has a large-diameter slug 2, 2, which also serves as a cylindrical heat sink, fixed to one end thereof. 3 is a semiconductor pellet held between the slugs 2, 2, and 4 is a glass sleeve made of lead glass that is welded to the outer peripheral surface of the slugs 2, 2 holding the semiconductor pellet 3, hermetically sealing the inside thereof. .

The glass sleeve 4 is sealed using a semiconductor manufacturing apparatus comprising an upper jig, a lower jig, etc., which will be described below. Therefore, specific examples of conventional semiconductor manufacturing equipment will be explained with reference to FIGS. 4 to 6. As shown in these drawings, the lower jig 5
is made of heat-resistant carbon, for example.
A large number of first holes 6, 6, . . . open to one surface 5a are bored. The first hole 6 includes a large diameter portion 6a that functions as a support seat for inserting the glass sleeve 4, and a small diameter portion 6b that communicates with the large diameter portion 6a and functions as an insertion hole for the lead 1, as described later. It is configured. Similarly to the lower jig 5, the upper jig 7 is made of carbon, and has a large number of second holes 8, 8, . They are arranged at positions corresponding to the holes 6, 6, . . . The second hole 8 has a large diameter portion 8a into which the slug 2 is fitted, and a lead 1 that communicates with the large diameter portion 8a.
and a small diameter portion 8b into which is inserted. Reference numeral 9 denotes a shutter which also serves as the bottom plate of the upper jig 7 and is freely openable and closable between the upper jig 5 and the lower jig 7, as will be described later, when assembling the DHD type diode.

The upper jig 5, the lower jig 7 and the shutter 9
Sealing of the glass sleeve 4 using a semiconductor manufacturing apparatus consisting of the following is performed in the following manner. That is,
As shown in FIG. 4, a large number of glass sleeves 4, 4... are supplied to the lower jig 5 by appropriate means, and the large diameter portions 6a, 6a
Insert into... Next, the leads 1, 1... are inserted into the first holes 6, 6... and the glass sleeves 4, 4...
The slugs 2, 2, . . . of the leads 1, 1, . On the other hand, a large number of leads 1, 1, etc. are inserted into the second holes 8, 8, with one side 7a of the upper jig 7 facing up, and one side of the upper jig 7 is inserted. 7
A is covered with the shutter 9 and the second holes 8, 8 are formed.
...to be blocked. In this state, turn the upper jig 7 upside down and insert the first and second holes 6, 6 above the lower jig 5.
..., 8, 8... are arranged in correspondence. and the fifth
As shown in the figure, the lower surface of the shutter 9 and one surface 5a of the lower jig 5 are brought into contact with each other, and the shutter 9 is disposed between the upper jig 5 and the lower jig 7. after that,
As shown in FIG. 6, the shutter 9 is slid open, and the leads 1, 1... stored in the second holes 8, 8... of the upper jig 7 are dropped by their own weight, and The slugs 2, 2... of the leads 1, 1... are inserted into the glass sleeves 4, 4... of the lower jig 5. In this state, by heating the upper jig 5 and the lower jig 7 to heat and soften the glass sleeves 4, 4..., the outer peripheral surfaces of the slugs 2, 2... of the leads 1, 1... and the glass sleeves 4, 4... The inside is hermetically sealed by welding the inner peripheral surface of the

Problems to be Solved by the Invention As mentioned above, in conventional semiconductor manufacturing equipment, when the glass sleeves 4, 4... are sealed, carbon or stainless steel is used as a means for positioning and fixing the slugs 2, 2 and the glass sleeves 4, 4. An upper jig 5 and a lower jig 7 are used. For this reason, the glass sealing process becomes complicated, and a large number of jigs must be prepared at all times depending on the type of glass sleeve 4 and slug 2. As a result, the efficiency of equipment investment is improved. This greatly impedes the ease of jig management. Furthermore, since the shapes of the leads 1, 1, . . . are limited to linear conditions, it is difficult to process them in accordance with the electrode characteristics, and the types of semiconductor devices that can be manufactured are severely restricted.

A main object of the present invention is to provide a solution to the above-mentioned problems found in semiconductor device manufacturing methods using conventional positioning fixtures.

Means for Solving the Problems In view of the above object, the present invention involves sandwiching a semiconductor pellet between slugs inserted in a pair in a glass sleeve, and forming a contact between the outer circumferential surface of the slug and the inner circumference of the glass sleeve. A method for manufacturing a semiconductor device in which a first slug is attached to a lead body of a first lead frame prepared in advance, and after a glass sleeve is fitted onto the slug. , a step of inserting a semiconductor pellet into the glass sleeve, a step of fixing a second slug to the lead body of a second lead frame prepared in advance, and a step of fixing the first lead frame and the second lead frame. A step of fitting a second stacked slag into the glass sleeve, and introducing the intermediate product having the stacked structure into a heating furnace to heat the outer circumferential surfaces of the first and second slags and the inner circumferential surface of the glass sleeve. The gist of the present invention is a method for manufacturing a semiconductor device, which comprises a step of sealing the intermediate product and a step of separating the connecting portions of the lead frame from the intermediate product taken out from the heating furnace to obtain individual semiconductor devices.

Function By directly fixing a slug to the end of a lead frame prepared in advance and using the slag as a support member to fix the glass sleeve and semiconductor pellets, semiconductor devices can be manufactured without using a positioning fixture. do.

Example 1 FIG. 1 is a process diagram illustrating the first embodiment of the present invention. As shown in the figure, the first
Each lead body 1 of the lead frame 10 of
A first slug 11 having a pressure receiving flange 11a formed thereon is welded to the upper surface of the slug 0a. Next, a glass sleeve 12 is fitted onto the slug 11, and a semiconductor pellet 13 is inserted into the glass sleeve 12. Further, a second slug 15 having a pressure receiving flange 15a formed thereon is welded to the lower surface of each lead body 14a of the second lead frame 14 prepared in advance. After this, the second slag 15
The first lead frame 10 and the second lead frame 14 are placed on top of each other with the lead frame 10 facing the top surface of the glass sleeve 12, and the second slug 15 is inserted into the glass sleeve 12. The thus obtained intermediate product of the DHD type semiconductor device is introduced into a heating furnace (not shown), and the glass sleeve 12 is melted in accordance with a conventional method, and the first slag 11 and the second slag 11 are melted.
The outer peripheral surface of the slug 15 and the inner peripheral surface of the glass sleeve 12 are sealed. Finally, the lead frames 10 and 14 are separated from the intermediate product taken out of the heating furnace to form a DHD type semiconductor device. By selecting the separation shape of the lead frames 10 and 14, leadless type semiconductor devices in which the leads do not extend from the end faces of the slugs 11 and 15 and leads welded to the ends of the slugs 11 and 15 can be used. It is possible to manufacture a self-standing semiconductor device having the following characteristics.

Embodiment 2 FIG. 2 is an explanatory diagram of an improved example of the embodiment shown in FIG. 1. In the first embodiment described above, the first
A second slug 11 having a flat plate shape is welded to the upper surface of the lead body 10a, and a second slug 15 having a similar function is bent with a height approximately equal to the total thickness of the glass sleeve 12 and the pressure receiving flanges 11a and 15a. Lead body 14 having portion 14b
It is welded to the bottom surface of a. Therefore, if the machining accuracy of the bent portion 14b is not maintained at an appropriate level, there is a risk that variations will occur in the pushing pressure of the first slug 11 and the second slug 15 into the glass sleeve 12. be. In the second embodiment of the present invention, in order to eliminate such practical restrictions, the first lead body 10
A rigid pressing jig 16 with a clamping interval adjusted in advance on the lower surface of the lead body 14a and the upper surface of the second lead body 14a.
a, 16b are arranged in contact with each other, thereby controlling the tightening stroke of the first reed body 10 and the second reed body 14a, and the glass sleeve 12,
The pressure applied to the first slug 11 and the second slug 15 is made uniform. According to this embodiment, since the lead frames 10 and 14 are uniformly tightened by the pressing jigs 16a and 16b, the lead bodies 10a and 14a, the glass sleeve 12, the first slug 11 and the second slug 15
The mutual positioning accuracy is improved, and accurate sealing operations can be performed even when placed horizontally. Also, the lead body 10
By using the pressing jigs 16a and 16b that apply a pressure load to the entire surfaces of the glass sleeves 14a and 14a, it is possible to reduce the pressing force per unit area. damage is also reduced. Furthermore, glass sleeve 12
When melting, the lead bodies 10a, 14a, slugs 11, 15, and glass sleeve 12 are uniformly heated by the radiant heat transmitted from the pressing jigs 16a, 16b, improving thermal efficiency and reducing variations in sealing. do.

Effects of the Invention According to the present invention, slug sealing can be performed without using a positioning fixture, which not only simplifies the jig management method but also expands the selection range of the shape of the lead body. Expand significantly. Therefore, by using square leads, for example, stability during mounting can be improved, and by performing desired processing on the lead body according to the electrode characteristics, it is also possible to indicate polarity. Furthermore, according to the present invention, leadless semiconductor devices and freestanding semiconductor devices can be selectively manufactured by selecting the cutting shape of the lead frame.

[Brief explanation of drawings]

FIG. 1 is a process diagram for explaining the first embodiment of the present invention, and FIG. 2 is an explanatory diagram of an improved example thereof. 3 is a sectional view showing an example of a DHD type diode, FIG. 4 is a sectional view showing a specific example of a conventional semiconductor manufacturing device, and FIGS. 5 and 6 are glass sleeves produced by the semiconductor manufacturing device shown in FIG. 4. It is a sectional view explaining the sealing procedure of. 10...First lead frame, 10a...Lead body, 11...Slag, 12...Glass sleeve, 13...Semiconductor pellet, 14...Lead frame, 14a...Lead body, 15...Slag, 16a , 16b...pressing jig.

Claims (1)

[Claims] 1. A method for manufacturing a semiconductor device, comprising sandwiching a semiconductor pellet between slugs inserted in a pair in a glass sleeve, and sealing the outer peripheral surface of the slug and the inner peripheral surface of the glass sleeve, A step of fixing a first slug to a lead body of a first lead frame prepared in advance, a step of fitting a glass sleeve onto the slug and then inserting a semiconductor pellet into the glass sleeve, and a step of inserting a semiconductor pellet into the glass sleeve. fixing a second slug to the lead body of the second lead frame;
a step of overlapping the lead frames and fitting the second slug into the glass sleeve, and introducing the intermediate product having the overlapping structure into a heating furnace so that the outer circumferential surfaces of the first and second slags and the glass sleeve are stacked together. a step of sealing the inner circumferential surface of the semiconductor device; and a step of separating the connecting portion of the lead frame from the intermediate product taken out from the heating furnace to obtain individual semiconductor devices. manufacturing method.