JPH0369634B2 - - Google Patents
Info
- Publication number
- JPH0369634B2 JPH0369634B2 JP1088495A JP8849589A JPH0369634B2 JP H0369634 B2 JPH0369634 B2 JP H0369634B2 JP 1088495 A JP1088495 A JP 1088495A JP 8849589 A JP8849589 A JP 8849589A JP H0369634 B2 JPH0369634 B2 JP H0369634B2
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- electrode
- plating layer
- resistance welding
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は亜鉛鋼板の溶接に適した長い使用寿命
を持つ抵抗溶接用電極に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a resistance welding electrode having a long service life and suitable for welding galvanized steel plates.
（従来の技術）
抵抗溶接用のキヤツプチツプ電極としては、従
来から導電性に優れたクロム銅合金あるいはアル
ミ分散銅等の銅合金製のものが使用されている。
ところが従来の抵抗溶接用のキヤツプチツプ電極
を亜鉛鋼板の溶接に使用すると、亜鉛が銅合金製
の電極の表面に移行して絶縁製の被膜を形成して
通電不良を生じたり、電極のナゲツト径が300打
点程度で最初の６mmから９mm程度まで拡大してし
まい、円滑な溶接を継続することができない等の
問題があつた。このため、従来は300打点終了時
に電極を交換し、ドレツサーで電極表面を研摩し
直す必要があつた。(Prior Art) As cap chip electrodes for resistance welding, those made of copper alloys such as chromium-copper alloys or aluminum-dispersed copper, which have excellent conductivity, have conventionally been used.
However, when conventional cap tip electrodes for resistance welding are used to weld zinc steel plates, the zinc migrates to the surface of the copper alloy electrode and forms an insulating film, resulting in poor conduction, and the nugget diameter of the electrode increases. After about 300 dots, the welding point expanded from the initial 6mm to about 9mm, causing problems such as the inability to continue smooth welding. For this reason, conventionally it was necessary to replace the electrode after 300 dots and re-polish the electrode surface using a dresser.
（発明が解決しようとする課題）
本発明はこのような従来の欠点を解決して、亜
鉛鋼板の溶接に使用した場合にも亜鉛が電極の表
面に移行することがなく、またナゲツト径の変化
も極めて少ない抵抗溶接用電極を提供するために
完成されたものである。(Problems to be Solved by the Invention) The present invention solves these conventional drawbacks and prevents zinc from migrating to the surface of the electrode even when used for welding galvanized steel sheets, and prevents changes in nugget diameter. This was completed in order to provide an electrode for welding with extremely low resistance.
（課題を解決するための手段）
上記の課題は、銅合金製の電極本体の表面に、
チタンとベリリウムとを含有する無電解めつき層
を形成したことを特徴とする抵抗溶接用電極によ
つて解決することができる。(Means for solving the problem) The above problem is solved by the fact that on the surface of the copper alloy electrode body,
This problem can be solved by a resistance welding electrode characterized by forming an electroless plated layer containing titanium and beryllium.
また上記の課題は、銅合金製の電極本体の表面
に、チタンとセリウムとを含有する無電解めつき
層を形成したことを特徴とする抵抗溶接用電極に
よつて解決することができる。 Moreover, the above-mentioned problem can be solved by a resistance welding electrode characterized in that an electroless plating layer containing titanium and cerium is formed on the surface of an electrode body made of a copper alloy.
以下に本発明を第１図を参照しつつ更に詳細に
説明すると、１は例えばクロム銅製の抵抗溶接用
キヤツプチツプ電極の電極本体であり、内部には
冷却用の中空部２が形成されている。本発明にお
いては、このような電極本体１の外側の表面に無
電解めつき層３が形成されている。 The present invention will be described in more detail below with reference to FIG. 1. Reference numeral 1 denotes an electrode body of a cap electrode for resistance welding made of, for example, chromium copper, and a hollow portion 2 for cooling is formed inside. In the present invention, an electroless plating layer 3 is formed on the outer surface of such an electrode body 1.
第１の発明の無電解めつき層３はチタンとベリ
リウムとを含有するものであつて、このような無
電解めつき層３を形成するには、まずクロム銅合
金製の電極本体１を硫酸を主成分とする前処理液
を用いて前処理したうえ、酢酸ベリリウム、硫酸
第二チタン、次亜硫酸ソーダ、チオ硫酸ナトリウ
ムを含有する無電解めつき液中に浸漬する方法を
取ることができる。この無電解めつき液の組成
中、硫酸第二チタンと酢酸ベリリウムとはチタン
とベリリウムとを含有する無電解めつき層３を析
出させるための基本成分である。また次亜硫酸ソ
ーダは反応を活性化させるための成分、チオ硫酸
ナトリウムはチタンとベリリウムとのなじみを良
くするための成分である。しかし無電解めつき液
の組成はこれに限定されるものではないことをい
うまでもない。 The electroless plating layer 3 of the first invention contains titanium and beryllium, and in order to form such an electroless plating layer 3, the electrode body 1 made of a chromium-copper alloy is first heated with sulfuric acid. A method can be used in which the plating material is pretreated using a pretreatment solution containing as a main component, and then immersed in an electroless plating solution containing beryllium acetate, titanium sulfate, sodium hyposulfite, and sodium thiosulfate. In the composition of this electroless plating solution, titanium sulfate and beryllium acetate are basic components for depositing the electroless plating layer 3 containing titanium and beryllium. Also, sodium hyposulfite is a component for activating the reaction, and sodium thiosulfate is a component for improving compatibility between titanium and beryllium. However, it goes without saying that the composition of the electroless plating solution is not limited to this.
このようなチタンとベリリウムとを含有する非
磁性の無電解めつき層３は例えば厚みが10〜15μ
ｍ程度のものとすればよく、クロム銅合金製の電
極本体１の内部にまで拡散した状態で強固に付着
している。一般にチタンは無電解めつきを行うこ
とが難しい金属とされているが、ベリリウムと組
み合わせることにより強固な被膜を形成すること
ができる。この無電解めつき層３中のチタンは亜
鉛の付着を防止するとともに、高温硬度を高める
役割を持つ。 The nonmagnetic electroless plating layer 3 containing titanium and beryllium has a thickness of, for example, 10 to 15 μm.
The electrode body 1, which is made of a chromium-copper alloy, is firmly adhered to the electrode body 1 in a state where it is diffused into the interior of the electrode body 1. Titanium is generally considered to be a metal that is difficult to electroless plate, but when combined with beryllium, a strong film can be formed. Titanium in this electroless plating layer 3 has the role of preventing zinc from adhering and increasing high-temperature hardness.
次に第２の発明によれば、無電解めつき層３は
チタンとセリウムとを含有するものとされる。こ
のような無電解めつき層３を形成するには、前記
と同様に前処理した電極本体を、塩化第一セリウ
ム、硫酸第二チタン、次亜硫酸ソーダ、チオ硫酸
ナトリウムを含有する無電解めつき液中に浸漬す
る方法を取ることができる。この無電解めつき液
の組成中、硫酸第二チタンと塩化第一セリウムと
はチタンとセリウムとを含有する無電解めつき層
３を析出させるための基本成分である。またその
他の成分の役割は第１の発明と同様である。第２
の発明は上記のように第１の発明のベリリウムを
セリウムに置き換えたものであつて、セリウムが
チタンの無電解めつきを可能としている。 According to the second invention, the electroless plating layer 3 contains titanium and cerium. To form such an electroless plating layer 3, the electrode body pretreated in the same manner as described above is subjected to electroless plating containing cerous chloride, titanium sulfate, sodium hyposulfite, and sodium thiosulfate. A method of immersing it in liquid can be used. In the composition of this electroless plating solution, titanium sulfate and cerous chloride are basic components for depositing the electroless plating layer 3 containing titanium and cerium. Further, the roles of other components are the same as in the first invention. Second
As mentioned above, the invention replaces beryllium in the first invention with cerium, and cerium enables electroless plating of titanium.
このような本願第１及び第２の発明の抵抗溶接
用電極はいずれも、チタンとベリリウムまたはセ
リウムとを含有する無電解めつき層３が亜鉛の電
極表面への移行を防止するので、亜鉛鋼板の抵抗
溶接に使用しても従来のような通電不良が生ずる
ことを完全に防止することができる。しかもチタ
ンを含む無電解めつき層３は硬度も大きいので、
1500打点以上使用してもナゲツト径は最初の６mm
から7.5mm程度まで拡大するのみであり、従来品
がわずか300打点でナゲツト径が９mm程度まで拡
大したのに対して、著しい耐久性を発揮すること
ができる。なお、無電解めつき層３は第１の発明
及び第２のいずれの場合にも厚みが10〜15μｍ程
度のものとすればよい。 In both of the resistance welding electrodes of the first and second inventions of the present application, the electroless plating layer 3 containing titanium and beryllium or cerium prevents zinc from migrating to the electrode surface. Even when used for resistance welding, it is possible to completely prevent the occurrence of current conduction failures as in the conventional method. Moreover, since the electroless plating layer 3 containing titanium has high hardness,
Even if you use more than 1500 dots, the nugget diameter is the first 6mm.
The diameter of the nugget only increases from 7.5 mm to 7.5 mm, and the nugget diameter of the conventional product increases to 9 mm after only 300 dots, but it exhibits remarkable durability. In addition, the electroless plating layer 3 may have a thickness of about 10 to 15 μm in both the first invention and the second invention.
（発明の効果）
以上に説明したように、本発明の抵抗溶接用電
極は亜鉛鋼板の溶接に使用した場合にも亜鉛が電
極表面に移行することがほとんどなく、これに伴
う通電不良を完全に防止することができる。また
本発明の抵抗溶接用電極は硬度が大きいために
1500打点以上使用してもナゲツト径の変化が少な
く、従来品に比較して極めて長い使用寿命を持
ち、これによつて溶接ビード幅が均一に保たれる
など溶接品質の向上を図ることができる。しか
も、無電解めつきにより被膜を形成するため、安
価に大量の長寿命の抵抗溶接用電極を容易に製造
することができる。(Effects of the Invention) As explained above, even when the resistance welding electrode of the present invention is used for welding galvanized steel sheets, zinc hardly migrates to the electrode surface, and the resulting current conduction failure can be completely eliminated. It can be prevented. In addition, since the resistance welding electrode of the present invention has high hardness,
Even if more than 1500 dots are used, there is little change in the nugget diameter, and it has an extremely long service life compared to conventional products.As a result, welding quality can be improved by maintaining a uniform weld bead width. . Moreover, since the film is formed by electroless plating, it is possible to easily manufacture large quantities of long-life resistance welding electrodes at low cost.
よつて本発明は従来の問題点を解決した抵抗溶
接用電極として、産業の発展に寄与するところは
極めて大きいものである。 Therefore, the present invention greatly contributes to the development of industry as a resistance welding electrode that solves the conventional problems.
第１図は本発明の抵抗溶接用電極を示す断面図
である。
１：電極本体、３：無電解めつき層。
FIG. 1 is a sectional view showing the resistance welding electrode of the present invention. 1: electrode body, 3: electroless plating layer.
Claims (1)
リウムとを含有する無電解めつき層を形成したこ
とを特徴とする抵抗溶接用電極。 ２ 銅合金製の電極本体の表面に、チタンとセリ
ウムとを含有する無電解めつき層を形成したこと
を特徴とする抵抗溶接用電極。[Claims] 1. An electrode for resistance welding, characterized in that an electroless plating layer containing titanium and beryllium is formed on the surface of an electrode body made of a copper alloy. 2. An electrode for resistance welding, characterized in that an electroless plating layer containing titanium and cerium is formed on the surface of an electrode body made of a copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8849589A JPH02268983A (en) | 1989-04-07 | 1989-04-07 | Resistance welding electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8849589A JPH02268983A (en) | 1989-04-07 | 1989-04-07 | Resistance welding electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02268983A JPH02268983A (en) | 1990-11-02 |
| JPH0369634B2 true JPH0369634B2 (en) | 1991-11-01 |
Family
ID=13944397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8849589A Granted JPH02268983A (en) | 1989-04-07 | 1989-04-07 | Resistance welding electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02268983A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4421464Y1 (en) * | 1966-06-01 | 1969-09-11 | ||
| JPS58141877A (en) * | 1982-02-19 | 1983-08-23 | Sumitomo Electric Ind Ltd | Electrode for welding and brazing |
-
1989
- 1989-04-07 JP JP8849589A patent/JPH02268983A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02268983A (en) | 1990-11-02 |
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